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Technical Papers, Presentations and References
Column Grid Array
 
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Technical Papers
Ref Title Company Author Subject Nbr
Pages
File
Size
Download
File
Year
Pub.
0 CCGA
Column Attachment
TopLine
Corporation
Martin Hart CCGA Column Attachment for Absorbing Large CTE Mismatch 7 1Mb v9+ 2015
1 Solder Columns
Space Parts Working Group
TopLine
Corporation
Martin Hart Solder Columns for CCGA Substrates 15 1Mb v5+ 2014
2 Reliability of CGA/LGA/HDI
Package Board/Assembly
NASA
JPL Jet Propulsion Laboratory
Reza Ghaffarian, Ph.D. Test data for CGA1752, CGA1272 and CGA1517 packages. 1.0mm pitch. Plain Columns, Copper Wrap Columns and Micro-coil Spring. Visual, SEM, and thermal cycle evaluations to determine integrity of chip capacitors on package. 44 5Mb v9+ 2013
3 Microcoil Spring interconnects for Ceramic Grid Array Integrated Circuits NASA - Marshal Space Flight Center Mark Strickland
Jimmy Hester
J.F. Blanche
T.S. Nash
Novel micro-coil spring interconnect for Ceramic Grid Array - CCGA to replace solder balls and traditional solder columns. 24 4Mb v9+ 2011
4 Study of Ceramic Column Grid Array Components for Space Systems Northop Grumman Jonathan Fleisher
Walter Willing
Paper addresses using CCGA in high reliability space systems and issues of thermal mismatch between ceramic substrate and traditional PWB. 6 1Mb v5+ 2011
5 Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware NASA
Goddard Space Flight Center
GSFC-STD-6001 Mounting of CCGA onto PCB to provide uniform engineering and technical requirements for processes, procedures, practices, and methods that have been endorsed as standard for NASA programs 21 1Mb v9+ 2011
6 Reliability of High I/O High Density CCGA Interconnect Electronc Packages under Extreme Thermal Environments. NASA
JPL Jet Propulsion Laboratory
Rajeshumi Ramesham, Ph.D. CCGA1152 and CCGA1272 packages paper provides experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. 15 2Mb v5+ 2011
7 Reliability of CCGA Under Extreme Temperature for Space Applcations NASA
JPL Jet Propulsion Laboratory
Rajeshumi Ramesham, Ph.D. Mounting of 8 Daisy Chain CCGA717 packages on PCB and evaluation under temperature cycling from -185°C to +125°C for space applcations 9 4Mb v5+ 2010
8 Thermal Performance of Micro-Springs in Electronic Systems NASA
Marshall Space Flight Center
Allison Copus
Reviewed by Jeff Brown
Internship Report using 3D modeling Pro-Engineer & thermal simulation IcePro and IcePak to model comparision of Micro-coil Springs to solder balls in vacuum conditions and to characterize their thermal performance. 7 1Mb v5+ 2009
9 Thermal Cycle Reliability Failure Mechanisms CCGA and PBGA With and Without Corner Staking NASA
JPL Jet Propulsion Laboratory
Reza Ghaffarian, Ph.D. Comparing Plastic Ball grid array (PBGA) to CCGA560 ceramic column grid array, inspection, thermal cycle solder joint, stake. Revision of 2006 paper 12 1Mb v9+ 2008
10 Column Grid Array Rework For High Reliability NASA
JPL Jet Propulsion Laboratory
Atul Mehta & Charles Bodie Questions and challenges: Is the reliability of the PWB adversely affected by rework. How many times can rework the same board without destroying a pad or degrading lifetime? 11 6Mb v5+ 2008
11 Solder Column Qualification for Ceramic Column Grid Array (CCGA) Aeroflex Author not cited The test vehicle used in this study was a 472 pin daisy chain CCGA package. Revision of 2006 paper 16 2Mb v5+ 2008
12 Atmel CCGA625 Mounting Evaluation SAAB
Stanley Mattsson Mounting and evaluation of CCGA625 daisy chain on PCB 31 8Mb v9+ 2007
13 CCGA packages for space applications NASA
JPL Jet Propulsion Laboratory
Reza Ghaffarian, Ph.D. Commercial-off-the-shelf (COTS) CCGA560 and CCGA717 area array packaging technologies reliability study Space Shuttle and Mars Rover missions. 19 3Mb v5+ 2006
14 Design Parameters Influencing Reliability of CCGA Assembly: A Sensitivity Analysis NASA
JPL Jet Propulsion Laboratory
Reza Ghaffarian, Amaneh Tasooji, Antonio Rinaldi Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies. 8 1Mb v5+ 2005
15 Comparison of X-Ray Inspection Systems of BGA/CCGA Quality Assurance and Crack Detection NASA
JPL Jet Propulsion Laboratory
Reza Ghaffarian, D. Mih Using X-Ray as an inspection tool for detecting defects and cracks in CCGA 7 2Mb v9+ 2005
16 Reliability Testing and Data Analysis of an 1657 CCGA (Ceramic Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards) Agilent
Technologies
Author not cited Comparision of CCGA1657 Pb90/Sn10 using Lead Free Solder Paste and various PC Board Finish 25 .5Mb v5+ 2004
17 JEDEC Standard MO-158D JEDEC JEDEC JC-11 Committee Square CCGA Outlines 8 .2Mb v5+ 2002
18 JEDEC Standard MO-159B JEDEC JEDEC JC-11 Committee Rectangular CCGA Outlines 6 .3Mb v5+ 1999
19 Solder Column CCMD Test Report on Serial Thermal Cycle, Shook, and Vibration Tests Raychem - Improved temperature life cylces using copper wrapped solder columns on ceramic LCC periemter array 28 12Mb v5+ 1987
 
 
 
 
Video
Ref Title Company Language Subject Minutes File Year
Pub.
1 CCGA Column
Attachment
TopLine
Corporation
English Attach Solder Columns using
Pin-Pack loading system.
2m 2015
2 CCGA Column
Lapping & Planarization
TopLine
Corporation
English How to lap & polish
columns and planarize into coplanarity.
3m 2015
3 C7-PRINTER
Benchtop manual solder paste printer
TopLine
Corporation
English How to print SnPb or SAC305 solder paste
on LGA substrates by hand.
2m 2015
3 Vibration Damping
Attenuate Vibration in PWB Boards
TopLine
Corporation
English PID (Particle Impact Damper)
NASA technology dampens vibration, extends life and increase reliability.
2m 2016
 
 
 
 
Quick Reference
Ref Title Company Language Subject Minutes File Year
Pub.
1 DNP
Distance from Neutral Point
TopLine
Corporation
English How to calculate DNP
Distance from Neutral Point.
1m v9+ 2015
2 Stress-Strain
Equation
TopLine
Corporation
English How to calculate
stress on ceramic CCGA.
1m v9+ 2015
 
 
 
 
Mil-Spec and Industry Standards/Guidelines
Ref Title Source Language Subject File
Size
File
Type
Year
Pub.
1 CCGA Solder Column Allowable Voids and other standards USA
MIL-STD-883J
w/Change 5
Section 3.3.6
English Conformance criteria for Ball/Column Grid Array Leads voids and other attributes of solder columns. 200Kb v9+ 2015
1 CCGA Solder Column Package Destructive Lead Pull Test USA
MIL-STD-883J
w/Change 5
Method 2038
English Method for measuring capability of solder column on CCGA package to withstand an axial force. 200Kb v9+ 2013
 
 
 
 


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