QFN CTE
Coefficient Thermal Expansion
And Material Properties
 
  QFN Quad Side Components  •   DFN Dual Side Components  •   M-QFN Open Cavity

 

QFN CTE (Coefficient of Thermal Expansion)
Material Brand-Moldel Attributes CTE Other
Molding
Compound
Sumitomo Bakelite
EME-G700H
Dk 4.1
Dielectric Constant tan εr

Df 0.005
Dissipation Factor δ

Tg 125°C

Thermal Conductivity
0.96W/m • °C

Pb Free • Br Free • Sb Free

UL-94 V-0 Class
α1 = 7x10-6/°C
α2 = 30x10-6/°C
Young's Modulus
32GPa

Poisson's Ratio
0.28@ 25°C
0.34 @125°C
Lead Frame
Base Alloy
Olin C194 K65

Also Known As:
ASTM Mat'l Nbr
C194000
Cu97.45/Fe2.4/Zn.12/P.3

Also Known As:
CuFe2P
16.7x10-6/°C
@25°C

17.5x10-6/°C
@ 250°C
Young's Modulus
125GPa

Poisson's Ratio
0.33
Surface Treatment
Lead Frame
Pre-plated
NiPdAu
Thickness:
Ni 0.50~2.0µm
Pd 0.02~0.15µm
Au 0.003~0.015µm
Ni 13x10-6/°C
Pd 12x10-6/°C
Au 12x10-6/°C
@ 25°C
-
Surface Treatment
Lead Frame
Post-plated
Matte Tin
Sn100
Thickness:
7~15 µm
23x10-6/°C
@ 25°C
-
Die Attach
Adhesive
Ablebond 84-3 Non-Conductive

Tg 125°C
40x10-6/°C
<@85°C

100x10-6/°C
>@ 85°C
-
Silicon Die
Chip
Si Thickness:
0.22mm
(9mils)
2.6x10-6/°C -
Gold Bonding
Wire
Au Diameter:
25μm
(1.0 mil)
14.2x10-6/°C -
Information is for reference only and is not guaranteed for accuracy.
 
Option Surface Plating
Part Number Suffix: -T = Sn100
Part Number Suffix: -F = Ni-Pd-Au
Add -DE to end of part number for Daisy Chain

Typical "F" Plating Thickess (um): Ni 0.20~0.70 / Pd 0.02~0.15 / Au 0.02 min


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