 
Applications of Elastomer Core Solder Balls:
Dimensionally stable • Solderable • Strong and durable.
Novel way to support & interconnect modules to mother PCB.
Non-collapsible top mounted BGA/CSP (PoP) Package on Package.
Other great applications to be discovered. |
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D
Diameter |
Outer Layer
Composition |
Resistance |
Current (Max) |
Typical
BGA Pitch |
Core
Diameter |
Cu
Thickness |
Solder
Thickness |
Drawing
Nbr |
Order Number |
| 80µm |
Sn96.5/Ag3.5 |
<1.5 mΩ |
1.0A |
0.15mm |
60µm |
3µm |
7µm |
730003
|
NN-SOL-80-3C7SA |
| 90µm |
Sn96.5/Ag3.5 |
<1.5 mΩ |
1.0A |
0.15mm |
60µm |
2µm |
13µm |
730090
|
NN-SOL-90-2C13SA |
| 110µm |
Sn96.5/Ag3.5 |
<1.0 mΩ |
1.5A |
0.2mm |
80µm |
5µm |
10µm |
730004
|
NN-SOL-110-5C10SA |
| 200µm |
Sn96.5/Ag3.5 |
<0.8 mΩ |
2.0A |
0.3mm |
150µm |
5µm |
20µm |
730008
|
NN-SOL-200-5C20SA |
| 200µm |
Sn96.5/Ag3.5 |
<0.8 mΩ |
2.0A |
0.3mm |
130µm |
5µm |
30µm |
731008
|
NN-SOL-200-5C30SA |
| 250µm |
Sn96.5/Ag3.5 |
<0.5 mΩ |
2.0A |
0.4mm |
150µm |
10µm |
40µm |
730010
|
NN-SOL-250-10C40SA |
| 262µm |
Sn96.5/Ag3.5 |
<0.5 mΩ |
2.0A |
0.4mm |
198µm |
7µm |
25µm |
730011
|
NN-SOL-262-7C25SA |
| 310µm |
Sn96.5/Ag3.5 |
<0.5 mΩ |
2.0A |
0.5mm |
210µm |
10µm |
40µm |
731012
|
NN-SOL-310-10C40SA |
| 350µm |
Sn96.5/Ag3.5 |
<0.4 mΩ |
2.0A |
0.65mm |
264µm |
10µm |
33µm |
730014
|
NN-SOL-350-10C33SA |
| 410µm |
Sn96.5/Ag3.5 |
<0.4 mΩ |
2.0A |
0.8mm |
310µm |
10µm |
40µm |
730016
|
NN-SOL-410-10C40SA |
| 500µm |
Sn96.5/Ag3.5 |
<0.3 mΩ |
2.0A |
0.8mm |
400µm |
15µm |
35µm |
730020
|
NN-SOL-500-15C35SA |
| 650µm |
Sn96.5/Ag3.5 |
<0.3 mΩ |
2.0A |
1.0mm |
550µm |
20µm |
30µm |
730026
|
NN-SOL-650-20C30SA |
| 890µm |
Sn96.5/Ag3.5 |
<0.3 mΩ |
2.0A |
1.27mm |
790µm |
20µm |
30µm |
730035
|
NN-SOL-890-20C30SA |
| 910µm |
Sn96.5/Ag3.5 |
<0.3 mΩ |
2.0A |
1.27mm |
790µm |
20µm |
40µm |
730036
|
NN-SOL-910-20C40SA |
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| Other sizes and custom alloys available. Contact TopLine for Details. |
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Benefits:
1. Non collaspe during reflow
2. Maintains spherical shape during reflow
3. Dimensionally constant - improves MHz operating frequency |
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Applications:
1. BGA/CSP (PoP) Package on Package
2. Solderable spacer/stand-off on modules
3. Substrates: FR4, Glass, Ceramic, BT, etc |
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Elastomer-Core Properties:
1. Divinylbenzene cross-linked co-polymer
2. Poisson's Ratio 0.38
3. Young's Modulus 4.8 Gpa
4. CTE: 40.2PPM/°C (30°C ~ 60°C)
46.2PPM/°C (60°C ~ 280°C) |
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Temperature Rating:
1. Storage: -40°C ~ +125°C
2. Storage: -40°C ~ +125°C
3. Peak Reflow: +250°C @ 5 seconds
4. Temperature Decomposition Td 447°C |
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Pad Design Rules:
1. Recommend Solder Mask Defined Pad
2. Mask opening 90% diameter of solder ball
3. Example: Ball Diameter 910um (0.036"). Mask opening 819um (0.032") |
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Assembly Guideline:
1. Recommend Nitrogen (N) reflow oven.
2. Two reflow cycles typical.
3. Three reflow cycles allowed with selected ball part numbers. |
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| NN-SOL Balls reflow at normal Lead Free temperature profile. |
Recommended reflow temperature profile with SAC305 solder paste |
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| NN-SOL assembly steps. |
Mount Ball • 1st Reflow • Place solder paste 2nd Reflow |
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| Compression of unplated elastomer core |
Compression load versus strain at 25°C |
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| Example BGA with NN-SOL balls. |
Cross Section after reflow
Ball is encased in SAC305 solder paste |
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| Stable performance because balls do not collapse |
Frequency input-output predictable over 45MHz to 10GHz |
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| Youngs Modulus versus Temperature |
NN-SOL ball is dimensionally stable -55°C to +300°C |
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Example module with Ø890µm non-collapsible balls
Ball acts as standoff and low ohmic electrical interconnect. |
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Discover more novel applications for elastomer core solder balls.
Discuss your big idea with TopLine. |
