Elastomer Core
Solder Ball

Non-Collaspible

 

Non-Collapsible Elastomer Core Solder Ball.
 



Applications of Elastomer Core Solder Balls:
Dimensionally stable   •  Solderable  •   Strong and durable.
Novel way to support & interconnect modules to mother PCB.
Non-collapsible top mounted BGA/CSP (PoP) Package on Package.
Other great applications to be discovered.
 
D
Diameter
Composition Resistance Current (Max) Typical
BGA Pitch
Core
Diameter
Cu
Thickness
Solder
Thickness
Drawing
Nbr
Order Number
80µm Sn96.5/Ag3.5 <1.5 mΩ 1.0A 0.15mm 60µm 3µm 7µm 730003
NN-SOL80-3C7SA
NN2-SOL80-3C7SA
90µm Sn96.5/Ag3.5
SAC305
<1.5 mΩ 1.0A 0.15mm 60µm 2µm 13µm 730090
NN-SOL90-2C13SA
NN2-SOL90-2C13SA
110µm Sn96.5/Ag3.5
SAC305
<1.0 mΩ 1.5A 0.2mm 80µm 5µm 10µm 730004
NN-SOL110-5C10SA
NN2-SOL110-5C10SA
180µm SAC305 <0.8 mΩ 1.5A 0.24mm 140µm 5µm 15µm 730007
NN2-SOL180-5C15SA
200µm Sn96.5/Ag3.5
SAC305
<0.8 mΩ 2.0A 0.3mm 150µm 5µm 20µm 730008
NN-SOL200-5C20SA
NN2-SOL200-5C20SA
200µm Sn96.5/Ag3.5
SAC305

SAC105
<0.8 mΩ 2.0A 0.3mm 130µm 5µm 30µm 731008
NN-SOL200-5C30SA
NN2-SOL200-5C30SA

NN2-SOL200-5C30SAL
250µm SAC305 <0.5 mΩ 2.0A 0.4mm 150µm 10µm 40µm 730010
NN2-SOL250-10C40SA
262µm SAC305
SAC105
<0.5 mΩ 2.0A 0.4mm 180µm 7µm 34µm 730011
NN2-SOL-262-7C25SA
NN2-SOL262-7C25SAL
310µm SAC305 <0.5 mΩ 2.0A 0.5mm 210µm 10µm 40µm 731012
NN2-SOL310-10C40SA
330µm SAC305 <0.4 mΩ 2.0A 0.65mm 230µm 10µm 40µm 730013
NN2-SOL330-10C40SA
350µm SAC305 <0.4 mΩ 2.0A 0.65mm 264µm 10µm 33µm 730014
NN2-SOL350-10C33SA
410µm SAC305 <0.4 mΩ 2.0A 0.8mm 310µm 10µm 40µm 730016
NN2-SOL410-10C40SA
500µm SAC305 <0.3 mΩ 2.0A 0.8mm 400µm 15µm 35µm 730020
NN2-SOL500-15C35SA
670µm Sn95/Ag5/Cu <0.3 mΩ 2.0A 1.0mm 550µm 20µm 40µm 730026
NN2-SOL670-20C40SAH
910µm Sn95/Ag5/Cu <0.3 mΩ 2.0A 1.27mm 790µm 20µm 40µm 730036
Bulk Jar:
NN-SOL910-20C40SAH
NN2-SOL910-20C40SAH


Tape & Reel:
NN2-SOL910-E20C40SAH
 
Other sizes and custom alloys available. Contact TopLine for Details.
 
Benefits:
1. Non collaspe during reflow
2. Maintains spherical shape during reflow
3. Dimensionally constant - improves MHz operating frequency
 
Applications:
1. BGA/CSP (PoP) Package on Package
2. Solderable spacer/stand-off on modules
3. Substrates: FR4, Glass, Ceramic, BT, etc
 
Elastomer-Core Properties:
1. Divinylbenzene cross-linked co-polymer
2. Poisson's Ratio 0.38
3. Young's Modulus 4.8 Gpa
4. CTE: 40.2PPM/°C (30°C ~ 60°C)
   46.2PPM/°C (60°C ~ 280°C)
 
Temperature Rating:
1. Storage: -40°C ~ +125°C
2. Storage: -40°C ~ +125°C
3. Peak Reflow: +250°C @ 5 seconds
4. Temperature Decomposition Td 447°C
 
Pad Design Rules:
1. Recommend Solder Mask Defined Pad
2. Mask opening 90% diameter of solder ball
3. Example: Ball Diameter 910um (0.036"). Mask opening 819um (0.032")
 
Assembly Guideline:
1. Recommend Nitrogen (N) reflow oven.
2. Two reflow cycles typical.
3. Three reflow cycles allowed with selected ball part numbers.
 
 
NN-SOL Balls reflow at normal Lead Free temperature profile.

Recommended reflow temperature profile with SAC305 solder paste
 
 
 
NN-SOL assembly steps.

Mount Ball   •   1st Reflow   •   Place solder paste    2nd Reflow
 
 
 
Compression of unplated elastomer core

Compression load versus strain at 25°C
 
 
 
Example BGA with NN-SOL balls.

Cross Section after reflow
Ball is encased in SAC305 solder paste
 
 
 
Stable performance because balls do not collapse

Frequency input-output predictable over 45MHz to 10GHz
 
 
 
Youngs Modulus versus Temperature

NN-SOL ball is dimensionally stable -55°C to +300°C
 
 
 

Example module with Ø890µm non-collapsible balls
Ball acts as standoff and low ohmic electrical interconnect.
 
Discover more novel applications for elastomer core solder balls.
Discuss your big idea with TopLine.
 
 
 

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