Patents & Trademarks
 
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Patents Owned by TopLine
Patents
Patent Nbr Field Product Brief Date Google
Patent
Download Note
TBA CCGA
Column Grid Array
Indium-Niobium
Solder Columns
Indium-Niobium
Solder Columns
for Cryogenic and
Quantum Computers and
methods for making same
2024
Provisional
Application
TOPLIN.023PR
Google PDF  
10,937,752 CCGA
Column Grid Array
Lead Free
Solder Column
Copper Core
Lead Free Solder Columns and
methods for making same
2021
Granted
TOPLIN.022A
Google PDF  
CN 114055006 B CCGA
Column Grid Array
Lead Free
Solder Column
Copper Core
Lead Free Solder Columns and
methods for making same
2023
Granted
TOPLIN.022CN
Google PDF  
D908648 CCGA
Column Grid Array
Graphite Fixture Adjustable fixture for aligning
column grid array substrates
2021
Granted
TOPLIN.021DA
Google PDF  
D874413 CGA1752
Column Grid Array
Graphite Fixture Fixture for deliverying 1752 interconnect
members onto a substrate
2020
Granted
TOPLIN.018DA
Google PDF  
CN 111822899 B CCGA
Column Grid Array
Copper Braided
Solder Column
Solder Columns and
methods for making same
2022
Granted

TOPLIN.020CN
Google En

Google Zh
PDF  
10,477,698 B1 CCGA
Column Grid Array
Copper Braided
Solder Column
Solder Columns and
methods for making same
2019
Granted
TOPLIN.020A
Google PDF  
9,629,259 B1 CGA
Column Grid Array
FLIP-PACK® Refillable apparatus for aligning and dispensing solder columns in an array 2017
Granted
TOPLIN.009A
Google PDF  
9,108,262 B1 CGA
Column Grid Array
PIN-PACK® Disposable apparatus for aligning and dispensing solder columns in an array 2015
Granted
TOPLIN.006A
Google PDF  
D808350 S CGA
Column Grid Array
Graphite Fixture Fixture for delivering interconnect members onto a substrate. 2018
Granted
TOPLIN.010A
Google PDF  
9,521,753 B1 Vibration
Attenuation
PID
Particle Impact Damper
Vibration damping
circuit card assembly
2016
Granted
Google PDF NASA
License
10,041,558 B1 Vibration
Attenuation
Tunable PID
Particle Impact Damper
Vibration damping
circuit board assembly
2018
Granted
TOPLIN.011A
Google PDF  
10,021,779 B1 Vibration
Attenuation
Quick Response PID
Particle Impact Damper
Vibration damping
circuit board assembly
2018
Granted
TOPLIN.012A
Google PDF  
D842351 S Vibration
Attenuation
Toroidal Shape
Particle Impact Damper
Vibration damping
circuit board assembly
2019
Granted
TOPLIN.014A
Google PDF  
10,704,639 Vibration
Attenuation
Unidirectional
Particle Impact Damper
Vibration damping
circuit board assembly
2020
Granted
TOPLIN.015A
Google PDF  
D512970 S1 Integrated Circuits QFP
Lead Straightener
Universal lead straightener for integrated circuit devices 2005
Granted
TOPLIN.002A
Google PDF  
 
 
 
 
Trademarks
Trademark Goods & Services First
Use
Year Registration
Class 9. Electronic Components, namely, Integrated Circuits, Microprocessors, Capacitors, Resistors, Transistors, Diodes, Chips, Inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2013
Registered
USPTO
Registration
4,313,144

Japan
Registration
5,593,255
TOPLINE® Class 9. Computer chips; integrated circuits; integrated circuit components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; semiconductors; semiconductor chips; semiconductor components, namely, power elements, converters, wafers, power transistors, silicon crystalline chips and rectifiers; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, Quad Flat Packs, Flip Chips, Ball Grid Arrays and Printed Circuit Boards. 1989 2014
Registered
USPTO
Registration
4,591,591
PIN-PACK® Class 9. Computer Chips; integrated circuits; integrated circuit components; semiconductos; semiconductor chips; semiconductor components; Electronic components, namely, microprocessors, capacitors, resistors, transistors, diodes, chips, inductors, quad flat packs, flip chips, ball grid arrays and printed circuit boards. 2014 2015
Registered
USPTO
Registration
4,727,622
FLIP-PACK® Class 9. Electronic components, namely, carriers for holding interconnecting solder components and solder columns used in the manufacturing of semiconductors, computer chips, column grid arrays, and ball grid arrays. 2015 2017
Registered
USPTO
Registration
5,250,619
SPRING-PACKTM Class 9. Electronic components, namely, carriers for holding interconnecting solder components and solder columns used in the manufacturing of semiconductors, computer chips, column grid arrays, and ball grid arrays. 2018 - -
Inspired by Gravity® Class 9. Electronic components namely, particle impact dampers
for attenuating vibration in printed circuit boards and mechanical assemblies.
2016 2018
Registered
USPTO
Registration
5,469,015
Class 9. Electronic components, namely, Integrated Ciruits and Quad Flat Packs 2007   -
 
 
 



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