Quartz Die
For Underfill Experiments
 
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Quartz Die
For Underfill Experiments


Quartz Die - Eutetic Bumps, SAC Bumps and Without Bumps
Bumps Bump Matrix Pitch Die Size
(mm)
Bump Size
Height
Diameter
Tray Qty Eutectic Bumps
Sn63/Pb37
Order Number
Pb-Free Bumps
Lead Free
SAC - Sn/Ag/Cu
Order Number
Without Bumps
Order Number
Ref Quick View
48 12x12
Perimeter
18mil
457µm
6.3mm 140µm
ø178µm
25pcs
Waffle 2"
FCQ48D6.3E457-ISO - FCNQ48D6.3C457-ISO FBT250
 
Options and Accessories:
Quartz die available with and without bumps (without daisy chain)
5-inch wafers available for all items.
Tape and reel (T&R) packaging available special order.
 
 
 
Download our 24 page Flip Chip Daisy Chain Product Guide in PDF format.(1Mb)




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