BGA Specifications

Nomenclature µBGA = Micro Ball Grid Array CSP = Chip Scale Package PBGA = Plastic Ball Grid Array CBGA = Ceramic Ball Grid Array CCGA = Ceramic Column Grid Array CLGA = Ceramic Land Grid Array LBGA = Laminate Ball Grid Array SBGA = Thermally Enhanced Heat Spreader TBGA = Tape Ball Grid Array Ball Pitch Fine-Pitch - 0.5mm, 0.75mm, 0.8mm Standard -  1.0mm, 1.27mm, 1.5mm Ball Alignment Full Grid, Perimeter Rows and Staggered Ball Diameter Pitch = 1.27mm & 1.5mm Diameter = 0.75mm Pitch = 1.0mm, Diameter = 0.6mm Pitch = 0.8mm, Diameter = 0.5mm Pitch = 0.5mm - 0.75mm Diameter = 0.4mm Pre-Assembly Baking Recommended to bake for 24-hours at 125°C to prevent delamination and "popcorn" phenomena on plastic BGA Packaging Options Standard: Trays Optional: Tape & Reel