Mirrored & Patterned
Dummy Die
 
 
Mechanical Dummy Die
Mirrored and Etched Patterns
Experimental use in Lab
Variety of Applications
 
Go to Wafer

Example Die with Etch Patterns

Quick Specs:
Material: Si (Silicon)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks

 
Bare Die Part Numbering System
MD - 5x5mm - BG250 - WP2
Die Type - Size in millimeter - Back Grinding
Thickness µm
  Packaging
Mirrored Dummy Die
MD=Singulated
WMD=Wafer Format

Etched Die
ED=Singulated
WED=Wafer Format
- All sizes available
0.25 ~ 25mm
- Blank= No Backgrinding

BG100=100µm
BG250=250µm
BG300=300µm

All thickness available
  MD & ED series:
Packed in Tray
WP2 = Waffle Pack 2-inch
WP4 = Waffle Pack 4-inch

WMD & WED series:
Diced on Tape
H = Hoop
NTR = Nitto Tape & Ring
UVR = UV Tape & Ring
Variety of options and packaging are available. Tell us your application.
 
Die Ordering Information
Mirrored Die
Singulated
Waffle Pack
Etched Die
Singulated
Waffle Pack
Mirrored Die
Sawn Wafer
Tape & Ring
Etched Die
Sawn Wafer
Tape & Ring
MD-mm x mm-BG300-WP2
BG back grind optional
ED-mm x mm-BG300-WP2
BG back grind optional
WMD8-mm x mm-BG300-NTR
BG back grind optional
WED8-mm x mm-BG300-NTR
BG back grind optional
Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.
 

Related Links:
Wafer   Test Die   Flip Chip  


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