Solder Mask:
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Standard:
LPI photo liquid-imageable green solder mask.
Typical Thickness 2.5mils (63.5µm), Sanwa Model SPSR 950
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Special Order:
Available on request, Taiyo Model PSR-4000 AUS5
Plating Finish:
Standard SnPb:
HASL - Hot Air Solder leveling with controlled Sn63 plating for flatness for coplanarity.
Lead Free (Pb-Free):
White tin: (Also known as "Immersion Tin" Sn100)
Immersion Silver: 5~16 micro-inches (0.12~0.40µm) • Typical: 8~12 micro-inches (0.2~0.3µm)
OSP: Bare copper (Entek 106 Organic Solder Preservative)
ENIG: 5 micro-inches (0.127µm) Immersion Gold over 150 micro-inches (3.8µm)electroless nickel.
Hard Gold: 30 micro-inches (0.76µm) Electroplated Gold over (3.8µm) electroless nickel.
Note: Hard Gold (99.0~99.7%) is recommended for connector fingers only.
Wire Bondable:
NiPdAu (ENEPIG): 8~15 micro-inches (0.20~0.38µm) Palladium over 150 micro-inches (3.8µm) electroless nickel. (Pd is covered with thin 0.7 micro-inches Immersion Gold (0.08µm).)
NiAu (Soft Gold 99.999%): 25~50 micro-inches (0.6~1.3µm) Gold over 150 micro-inches (3.8µm) electroless nickel.
ENIG: Bondable only with aluminum (Al) wire.
Board Material:
Standard:
FR-4 epoxy glass Tg=140°C
Special Order:
Multifunctional FR-4 Tg=170°C
Polyimide Tg=270°C
BT- Bismaleimde Triazine
Board Thickness:
Standard 0.062" (1.5mm) typical. Other thickness available.
Alternate double layer core thickness: 0.005" • 0.008" • 0.010" • 0.014" • 0.021" • 0.028" • 0.039" • 0.047" • 0.059" • 0.093" • 0.125"
Copper Clad:
Standard 1 oz [Thickness: 1.4 mil (0.035mm or 35µm)].
Special 1/2 oz [Thickness: 0.7 mil (0.018mm or 18µm)].
Special 2 oz [Thickness: 2.8 mil (0.070mm or 70µm)].
Note: Ounce (oz) is the weight per square foot (ft2).
Layers:
Double Sided:
Repeated pads on both sides.
Kits are supplied with enough components for one side of the board only.
Multilayer:
Multi-layer boards available on special order.
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