Wafers mechanical Dummy Si silcon wafers: mirrored, polished or with etched patterns. IGBT Si GaN and SiC wafer with back metal plating. Wafer or singulated sawn die. We backgrind to thickness you require. For experimental use in the lab for dicing practice, pick and place, wire-bonding practice. Daisy chain available. WM, WE, WMD, WED series.

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Tel: 1-800-776-9888
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Mechanical Dummy Wafers and Die

Mirrored and Etched Patterns

Experimental use in Lab

Variety of Applications

Go to IGBT Dummy Die

Quick Specs:
Wafer Material: Si (Silicon)
Wafer size 4~12 inch (100~300mm)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks


Wafer Part Numbering System
WM	8	BG250	C
Wafer Type	Size Code Inch	Back Grinding Thickness µm	Packaging
WM=Mirrored Mechancial Wafer WE=Etched Patterned Wafer WMD=Sawn Mirrored Wafer MED=Sawn Etched Wafer	4-inch (100mm) 5-inch (125mm) 6-inch (150mm) 8-inch (200mm) 12-inch (300mm)	Blank= No Backgrinding BG100=100µm BG200=200µm BG300=300µm All thickness available	C = Cassette J = Jar (Coin Stack) B = Bulk Coin Stack NTR = Nitto Tape & Ring UVR = Ultraviolet Tape & Ring

Variety of options are available. Please tell us your application.


Die Part Numbering System
MD	-	5x5mm	BG250	WP2
Die Type	-	Size in millimeter	Back Grinding Thickness µm	Packaging
MD=Mirrored Mechancial Die ED=Etched Patterned Die	-	All sizes available 0.25 ~ 25mm	Blank= No Backgrinding BG100=100µm BG200=200µm BG300=300µm All thickness available	WP2 = Waffle Pack 2-inch WP4 = Waffle Pack 4-inch NTR = Nitto Tape & Ring UVR = Ultraviolet Tape & Ring

Variety of options and packaging are available. Tell us your application.


Wafer & Die Ordering Information
Wafer Size	Wafer Jar	Wafer Cassette	Wafer Tape & Ring	Die Sawn Wafer Tape & Ring	Die Singulated Waffle Pack
4-Inch 100mm	WM4-J Mirrored Wafer WE4-J Etched Wafer	WM4-C Mirrored Wafer WE4-C Etched Wafer	WM4-NTR Mirrored Wafer WE4-NTR Etched Wafer	WMD4-mm x mm-NTR Mirrored Wafer WED4-mm x mm-NTR Etched Wafer	MD - mm x mm-WP2 Mirrored Die ED - mm x mm-WP2 Etched Die
5-Inch 125mm	WM5-J Mirrored Wafer WE5-J Etched Wafer	WM5-C Mirrored Wafer WE5-C Etched Wafer	WM5-NTR Mirrored Wafer WE5-NTR Etched Wafer	WMD5-mm x mm-NTR Mirrored Wafer WED5-mm x mm-NTR Etched Wafer	MD - mm x mm-WP2 Mirrored Die ED - mm x mm-WP2 Etched Die
6-Inch 150mm	WM6-J Mirrored Wafer WE6-J Etched Wafer	WM6-C Mirrored Wafer WE6-C Etched Wafer	WM6-NTR Mirrored Wafer WE6-NTR Etched Wafer	WMD6 - mm x mm-NTR Mirrored Wafer WED6 - mm x mm-NTR Etched Wafer	MD - mm x mm-WP2 Mirrored Die ED - mm x mm-WP2 Etched Die
8-Inch 200mm	WM8-J Mirrored Wafer WE8-J Etched Wafer	WM8-C Mirrored Wafer WE8-C Etched Wafer	WM8-NTR Mirrored Wafer WE8-NTR Etched Wafer	WMD8 - mm x mm-NTR Mirrored Wafer WED8 - mm x mm-NTR Etched Wafer	MD - mm x mm-WP2 Mirrored Die ED - mm x mm-WP2 Etched Die
12-Inch 300mm	WM12-J Mirrored Wafer WE12-J Etched Wafer	WM12-C Mirrored Wafer WE12-C Etched Wafer	WM12-NTR Mirrored Wafer WE12-NTR Etched Wafer	WMD12 - mm x mm-NTR Mirrored Wafer WED12 - mm x mm-NTR Etched Wafer	MD - mm x mm-WP2 Mirrored Die ED - mm x mm-WP2 Etched Die

Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.


Related Links: IGBT Dummy Die Test Die Flip Chip
TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 • Fax: 1-478-451-3000 Email: sales@topline.tv • Home