Ball Attachment Tool Set
CBGA256A - P0.8mm
Preliminary
 
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Attachment Tools for Pb90/Sn10 Solder Ball
About Tool-Kit:
TopLine manufactures a complete set of precision tools to attach Pb90/Sn10 Solder Balls to your specific ceramic grid array package. Our tools hold high temperature Pb90/Sn10 solder balls in place during the entire assembly process with your preferred Sn62 or Sn63 solder paste.

Use our tool-kit to attach solder balls to fresh CLGA or rework damaged CBGA for full-use deployment. The tool-kit includes a benchtop graphite set and accessories such as a vacuum chuck, alignment template, insertion tool, extraction tool and solder paste printer for a professional job.
Package Specifications:
  • Balls: 256
  • Pitch: 0.8mm
  • Size X/Y: 14.5 x 14.5mm
  • Size Z: Substrate ~0.52mm / With Lid ~2.14mm
  • Substrate: Ceramic
  • Column Diameter: Ø0.45mm
  • Maker: -
  • Drawings:  CBGA256
    •
    Top
    Bottom
    C7 Series TOOL-KIT
    REQUIRED ITEMS
    Tool DWG Model Description Image
    GRAPHITE SET 781650 C7-TOP-256-A Graphite structure with array of holes to match CBGA pads. Holds Balls in place. Bottom side has downset to clear solder paste fillets. Top side has receptacle to accept optional Flip-Pack® U.S. Patents D808350 S.
    514050 C7-STAGE-256-A Adjustable X/Y stage holds and aligns LGA/CBGA substrate pads. Channels permit optional thermocouples to measure temperature at substrate during reflow. Vacuum center hole prevents substrate from lifting. Patent Pending.
    550000 C7-BASE Base has ultra-fine threaded adjustment to align the stage in X/Y directions. Includes 3 precision alignment pins. The C7-BASE sits on top of vacuum chuck to secure the substrate in the stage. Patent pending.
    VACCUM CHUCK 703100 C7-VACUUM-CHUCK-A Vacuum chuck holds LGA substrate during Solder Paste Printing. 5/16-inch (8mm) nozzle connects to ≥ 3 CFM vacuum source. The graphite set sits on top of the C7-VACUUM-CHUCK.
    WEIGHT 700150 C7-WEIGHT-A Graphite weight adds pressure on Tamping Tool during reflow.
    TAMPING TOOL 481680 C7-TAMP-256-Z Array of Titanium (Ti) pins gently pushes solder ball uniformly into solder paste on substrate.
    EXTRACTION TOOL 703XXX C7-EXTRACT-256-A Precision dowel pins safely lifts CBGA substrate by 4-corners from the Graphite top plate after reflow.
    ALIGNMENT 281600 C7-ALIGN-256-A Essential tool for centering and accurate X/Y Theta alignment of LGA in graphite. Includes precision alignment template with aperture allowing annular ring vision of LGA pads while seated in graphite.
    PASTE STENCIL 681690
    Set    		 C7-STENCIL-256-A Set of laser cut stainless steel stencils with a choice of apertures for optimizing solder paste volume. Micro-etched stencil surface with nano-coating assures clean solder paste deposits to LGA seated in Graphite Set.
    STENCIL PRINTER 700000 C7-PRINTER Simple to use manual stencil printer for applying solder paste while LGA sits in graphite. Adjustable spring back for clean solder paste deposits. Includes stainless steel stencils and metal doctor blade squeegee.
     
    Note 1: Consult with TopLine for recommended tools for your application.
     
     
     
    C7 Series Tools
    RECOMMENDED OPTIONAL ACCESSORIES
    Tool Series Model Description Image
    FLIP PACK® Filled:
    908169

    Empty:
    008169    		 Filled with Solder Balls Pb90/Sn10:
    FP90U256D18A

    Empty:
    FP256A    		 Flip-Pack® pre-loaded cassette with Balls arranged in the correct array for quick assembly. Deposits balls into graphite in one-minute. Optionally re-fillable by customer or by recycling to TopLine. U.S. Patent 9,629,259
    INSERT TOOL 7000xx C7-INSERT-FP2-18 Provides easy loading of Flip-Pack® into Graphite
    TRAY BOX 938164 EC1-256D-2BCP Protective Tray Box for safe transport and storage of single CBGA device with Pb90/Sn10 Solder Balls. ESD safe.
     
     
     
     
     
    Model Numbering System
        C7     -     GRAPHITE     -     256     -     Option    
    Series   Description   Balls   Variations
    Attachment Tool
    Series   •   Description
    C7 = CBGA tool-set






    		  Tool Type
    NAME • Description
    GRAPHITE
    STAGE
    BASE
    TOP
    VACUUM_CHUCK
    TAMP
    EXTRACT
    STENCIL
    PRINTER
    ALIGN
    		   Columns
    Code • Nbr. Pads
    256 = 256 Balls

    Contact TopLine Other Pins




    		   SET
    Code • Version
    A • Version A

    Other Version Available
     
     
    Drawing Number System
     
        7         8         16         50    
    Series Pitch or Size Tool Number Version
    C7 Tool-set
    Code • Item Description
    2 = OPTIC (Alignment Reticle)
    3 = Interposer with Columns
    4 = Titanium Tamping Tool
    5 = Graphite X/Y Stage
    6 = STENCIL (Solder Paste)
    7 = Graphite Set & Accessories
    8 = See Flip Pack
    9 = Graphite Top Plate
    		 GRAPHITE SET
    Code • Pitch
    1 = 1.0mm  
    2 = 1.27mm
    4 = 0.4mm  
    5 = 0.5mm  
    6 = 0.65mm
    8 = 0.8mm  
    9 = Special 
    0 = Special 










    GRAPHITE STAGE
    Code • X/Y Size
    14 = 14.5x14.5
    21 = 21x21mm
    23 = 23x23mm
    25 = 25x25mm
    27 = 27x27mm
    29 = 29x29mm
    31 = 31x31mm
    32 = 32.5x32.5
    33 = 33x33mm
    35 = 35x35mm
    37 = 37.5x37.5
    40 = 40x40mm
    42 = 42.5x42.5
    45 = 45x45mm    		 GRAPHITE SET
    Code • Matrix
    14 = 14x14
    15 = 15x15
    16 = 16x16
    17 = 17x17
    18 = 18x18
    19 = 19x19
    20 = 20x20
    22 = 22x22
    24 = 24x24
    25 = 25x25
    26 = 26x26
    27 = 27x27
    30 = 30x30
    32 = 32x32
    34 = 34x34



    Graphite STAGE
    Code • LGA (Z) Thick
    05 = 0.5mm
    06 = 0.6mm
    08 = 0.8mm
    10 = 1.0mm
    15 = 1.5mm
    20 = 2.0mm
    25 = 2.5mm
    30 = 3.0mm
    35 = 3.5mm
    40 = 4.0mm
    50 = 5.0mm
    60 = 6.0mm
    		 GRAPHITE SET
    Code • Ø Ball Diameter
    1# = Ø10 mil •   Ø0.25mm
    2# = Ø12 mil •   Ø0.30mm
    3# = Ø15 mil • Ø0.38mm
    4# = Ø16 mil • Ø0.40mm
    5# = Ø18 mil • Ø0.45mm
    6# = Ø20 mil • Ø0.50mm
    7# = Ø24 mil • Ø0.61mm
    8# = Ø25 mil • Ø0.635mm
    9# = Ø30 mil • Ø0.76mm









    GRAPHITE STAGE
    Code • Version
    0~9 = Rev A~J
     
     
     
    ECCN: EAR99 Export Administration Regulations (EAR)
    HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
    ITAR: Micro-coil springs and dummy daisy chain CCGA are not restricted.
     
     
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    TopLine Corporation
    95 Highway 22 W
    Milledgeville, GA 31061, USA
    Toll Free USA/Canada (800) 776-9888
    International: 1-478-451-5000  •  Fax: 1-478-451-3000
    Email: sales@topline.tv

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