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FC317G5.08E254
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SAC - Pb Free Bumps Sn63/Pb37 - Eutetic Bumps Also available without bumps for wire bonding Packaging: Waffle Pack (Standard) Tape and Reel (T&R) Optional Reference:FA10 |
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Metal Composition: Al/Cu/Si (98/1/1) Die thickness: 24 mil (600~650µm). Thin die (back grinding)available Metal Thickness: 17K Å Passivation Thickness: 10K Å Passivation Type: Nitride |
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