eWLP Embedded Die
Daisy Chain
For PCB core
 
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Round Pads

Example Marking

eWLP Square Pads
 
 
0.3mm pitch eWLP - Wafer Level Package
Pads
I/O
Pad
Matrix
Pitch Size ⟩ Tape
& Reel
Tray Qty
2" Waffle Pack
Die Thickness Outline Drawing
Cu Post
360°
SolidWorks
4 2x2 0.3mm 0.56mm
W=8mm
P=2mm
400 eWLP4-TEG0306(200um)
eWLP4-TEG0306(360um)
eWLP4T.3-DC022D2
eWLP4T.3-DC022D3
16 4x4 0.3mm 1.16mm
W=8mm
P=4mm
400 eWLP16-TEG0306(200um)
eWLP16-TEG0306(360um)
eWLP16T.3-DC048D2
eWLP16T.3-DC048D3
36 6x6 0.3mm 1.76mm
W=8mm
P=4mm
225 eWLP36-TEG0306(200um)
eWLP36-TEG0306(360um)
eWLP36T.3-DC067D2
eWLP36T.3-DC067D3
64 8x8 0.3mm 2.36mm
W=12mm
P=8mm
100 eWLP64-TEG0306(200um)
eWLP64-TEG0306(360um)
eWLP64T.3-DC088D2
eWLP64T.3-DC088D3
100 10x10 0.3mm 2.96mm
W=12mm
P=8mm
100 eWLP100-TEG0306(200um)
eWLP100-TEG0306(360um)
eWLP100T.3-DC108D2
eWLP100T.3-DC108D3
144 12x12 0.3mm 3.56mm
W=12mm
P=8mm
100 eWLP144-TEG0306(200um)
eWLP144-TEG0306(360um)
eWLP144T.3-DC127D2
eWLP144T.3-DC127D3
196 14x14 0.3mm 4.16mm
W=12mm
P=8mm
49 eWLP196-TEG0306(200um)
eWLP196-TEG0306(360um)
eWLP196T.3-DC148D2
eWLP196T.3-DC148D3
eWLP196T.3-DC148D2Q
eWLP196T.3-DC148U2Q
Round Pad

Square pad
2500 50x50 0.3mm 15mm
W=24mm
P=24mm
25 eWLP2500-TEG0306(200um) eWLP2500T.3-DC508D2Q
eWLP2500T.3-DC508U2Q
Pitch = 0.3mm   •   Cu Pad diameter 0.15mm   •   Die Thickness: 200µm and 360µm
Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray
 
Download Solidworks® e-Drawings software to view rotatable:   PC Version  •  Mac Version
0.4mm pitch eWLP Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size ⟩ Tape
& Reel
Tray Qty
2" Waffle Pack
Die Thickness Outline Drawing
Cu Post
4 2x2 0.4mm 0.76mm
W=8mm
P=4mm
625 eWLP4-TEG0408(200um)
eWLP4-TEG0408(360um)
eWLP4T.4-DC022D2
eWLP4T.4-DC022D3
16 4x4 0.4mm 1.56mm
W=8mm
P=4mm
100 eWLP16-TEG0408(200um)
eWLP16-TEG0408(360um)
eWLP16T.4-DC048D2
eWLP16T.4-DC048D3
36 6x6 0.4mm 2.36mm
W=12mm
P=8mm
100 eWLP36-TEG0408(200um)
eWLP36-TEG0408(360um)
eWLP36T.4-DC067D2
eWLP36T.4-DC067D3
64 8x8 0.4mm 3.16mm
W=12mm
P=8mm
100 eWLP64-TEG0408(200um)
eWLP64-TEG0408(360um)
eWLP64T.4-DC088D2
eWLP64T.4-DC088D3
100 10x10 0.4mm 3.96mm
W=12mm
P=8mm
49 eWLP100-TEG0408(200um)
eWLP100-TEG0408(360um)
eWLP100T.4-DC108D2
eWLP100T.4-DC108D3
144 12x12 0.4mm 4.76mm
W=12mm
P=8mm
64 eWLP144-TEG0408(200um)
eWLP144-TEG0408(360um)
eWLP144T.4-DC127D2
eWLP144T.4-DC127D3
196 14x14 0.4mm 5.56mm
W=12mm
P=8mm
36 eWLP196-TEG0408(200um)
eWLP196-TEG0408(360um)
eWLP196T.4-DC148D2
eWLP196T.4-DC148D3
eWLP196W.4-DC148D2Q
eWLP196W.4-DC148U2Q
Pitch = 0.4mm   •   Cu Pad diameter 0.20mm   •   Die Thickness: 200µm and 360µm
Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray
 
Download Solidworks® e-Drawings software to view rotatable:   PC Version  •  Mac Version
 
 
eWLP Pad Size - Embedded Die in PCB
        Pitch 0.3mm Pitch 0.4mm Pitch 0.5mm    
      Ø Cu Pad 0.15mm 0.20mm 0.25mm
   
      Flatness
Tolerance
+/-20µm +/-20µm +/-20µm    
      Backgrind
With Extra
Fine-Polish
#2000
Grit
#2000
Grit
#2000
Grit
   
 
All eWLP devices are rated JEDEC Moisture Sensitivity Level MSL-1
Width of Daisy Chain tracing between Cu pads is 20µm
Material of RDL is Low-K Cu 99% pure
Passivation: Polyimide 4um thick
Encapsulation: Epoxy resin structure 50um thick
 
 
eWLP Cross Section
Copper Pillar Design.
 
 
eWLP Drawing Numbering System
    6         4         127         0    
Series Pitch Daisy Chain Pattern Packaging
For Embedded Die Applications

With Encapsulation:

6 = eWLP Without Balls
Die 200um thick
50um Round Cu Post

7 = eWLP Without Balls
Die 360um thick
50um Round Cu Post

1 = eWLP Without Balls
Die 200um thick
50um Square Cu Post

4 = eSWLP Without Balls
Metal Shielded
Die 200um thick
50um Square Cu Post

Without Encapsulation:
8 = eWLP Without Balls
Die 200um thick
10um Round Cu Post
3 = 0.3mm
4 = 0.4mm
5 = 0.5mm
Row-Column Matrix

999 Unsawn Wafer
Waffle Pack Tray:
0 = 4-inch Tray (T) Pad Down
8 = 2-inch Tray (W) Pad Down
9 = 4-inch Tray (T) Pad Up (Special)
7 = 2-inch Tray (W) Pad Up (Special)

Carrier Tape:
1 = T&R Reel (E7A) Pad Down
2 = Cut Tape - (E) Pad Down

Wafer Format:
3 = Sawn Wafer UV Tape & Ring (Full)
4 = Sawn Wafer UV Tape & Ring (Partial)
5 = Unsawn Wafer

Unassigned:
6 = To Be Assigned
 
 
 
eWLP Part Numbering System
    eWLP         196         T         .4         -         DC127         D2    
Series Nbr Pads Package Code Pitch Pad Alloy Daisy Chain
Pattern
Die Thickness and
Pad Up/Down in Package
eWLP = Without Balls
Embedded Application




Under Development
eSWLP =
Cu Metal Shielded Version
Without Balls
Embedded Application
4 ~ 2500
Greater I/O Available
T = 4-inch Waffle Tray

W = 2-inch Waffle Tray

E = Tape Reel (T&R)


X = Unsawn Wafer

U = Sawn Wafer
UV Tape & Ring
.3 = 0.3mm
.4 = 0.4mm
.5 = 0.5mm
Blank= Pure Cu Pillar
Without Solder Balls
For embedded Application
eWLP only
Matrix Pattern Pad Down:
D1= 200µm Thick
10um Cu Post

D2= 200µm Thick
50um Cu Post

D2Q= 200µm Thick
50um Cu
Square A1 Post

D3= 360µm Thick
50um Cu Post

Pad Up:
U1= 200µm Thick
10um Cu Post

U2= 200µm Thick
50um Cu Post

U2Q= 200µm Thick
50um Cu
Square A1 Post

Not Recommended:
251µm ~ 359µm


 

eWLP Round Pads
 
Top Marking Example
 
eWLP Square Pads
 
 
eWLP Encapsulation Material Properties


TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

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