eWLP Embedded Die
Daisy Chain
For PCB core
 
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Round Pads

Example Marking

eWLP Square Pads
 
 
0.2mm pitch eWLP - Wafer Level Package
Pads
I/O
Pad
Matrix
Pitch Size SQ Tape
& Reel
Tray Qty
2" Waffle Pack
Die Thickness Outline Drawing
Cu Post
360°
SolidWorks
64 8x8 0.2mm 2.0mm
W=8mm
P=4mm
100 200um
360um
eWLP64W.2-DC088D2
eWLP64W.2-DC088D3
256 16x16 0.2mm 4.0mm
W=12mm
P=8mm
49 200um
360um
eWLP256W.2-DC168D2
eWLP256W.2-DC168D3
576 24x24 0.2mm 6.0mm
W=16mm
P=12mm
25 200um
360um
eWLP576W.2-DC248D2
eWLP576W.2-DC248D3
1024 32x32 0.2mm 8.0mm
W=16mm
P=12mm
64
4" Tray
200um
360um
eWLP1024T.2-DC328D2
eWLP1024T.2-DC328D3
1600 40x40 0.2mm 10mm
W=24mm
P=16mm
49
4" Tray
200um
360um
eWLP1600T.2-DC407D2
eWLP1600T.2-DC407D3
2304 48x48 0.2mm 12mm
W=24mm
P=16mm
36
4" Tray
200um
360um
eWLP2304T.2-DC487D2
eWLP2304T.2-DC487D3
3136 56x56 0.2mm 14mm
W=24mm
P=24mm
25
4" Tray
200um
360um
eWLP3136T.2-DC567D2
eWLP3136T.2-DC567D3
Round Pad
4096 64x64 0.2mm 16mm
Call 16
4" Tray
280um
360um
eWLP4096T.2-DC647U2
eWLP4096T.2-DC647U3
Pitch = 0.2mm   •   Cu Pad diameter 0.10mm   •   Die Thickness: 200µm and 360µm
Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray
 
0.3mm pitch eWLP - Wafer Level Package
Pads
I/O
Pad
Matrix
Pitch Size SQ Tape
& Reel
Tray Qty
2" Waffle Pack
Die Thickness Outline Drawing
Cu Post
360°
SolidWorks
4 2x2 0.3mm 0.56mm
W=8mm
P=2mm
400 200um
360um
eWLP4T.3-DC022D2
eWLP4T.3-DC022D3
16 4x4 0.3mm 1.16mm
W=8mm
P=4mm
400 200um
360um
eWLP16T.3-DC048D2
eWLP16T.3-DC048D3
36 6x6 0.3mm 1.76mm
W=8mm
P=4mm
225 200um
360um
eWLP36T.3-DC067D2
eWLP36T.3-DC067D3
64 8x8 0.3mm 2.36mm
W=12mm
P=8mm
100 200um
360um
eWLP64T.3-DC088D2
eWLP64T.3-DC088D3
100 10x10 0.3mm 2.96mm
W=12mm
P=8mm
100 200um
360um
eWLP100T.3-DC108D2
eWLP100T.3-DC108D3
144 12x12 0.3mm 3.56mm
W=12mm
P=8mm
100 200um
360um
eWLP144T.3-DC127D2
eWLP144T.3-DC127D3
196 14x14 0.3mm 4.16mm
W=12mm
P=8mm
49 200um
360um
200um
200um
eWLP196T.3-DC148D2
eWLP196T.3-DC148D3
eWLP196T.3-DC148D2Q
eWLP196T.3-DC148U2Q
Round Pad

Square pad
2500 50x50 0.3mm 15mm
W=24mm
P=24mm
25 200um
200um
eWLP2500T.3-DC508D2Q
eWLP2500T.3-DC508U2Q
Pitch = 0.3mm   •   Cu Pad diameter 0.15mm   •   Die Thickness: 200µm and 360µm
Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray
 
0.4mm pitch eWLP Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size SQ Tape
& Reel
Tray Qty
2" Waffle Pack
Die Thickness Outline Drawing
Cu Post
4 2x2 0.4mm 0.76mm
W=8mm
P=4mm
625 200um
360um
eWLP4T.4-DC022D2
eWLP4T.4-DC022D3
16 4x4 0.4mm 1.56mm
W=8mm
P=4mm
100 200um
360um
eWLP16T.4-DC048D2
eWLP16T.4-DC048D3
36 6x6 0.4mm 2.36mm
W=12mm
P=8mm
100 200um
360um
eWLP36T.4-DC067D2
eWLP36T.4-DC067D3
64 8x8 0.4mm 3.16mm
W=12mm
P=8mm
100 200um
360um
eWLP64T.4-DC088D2
eWLP64T.4-DC088D3
100 10x10 0.4mm 3.96mm
W=12mm
P=8mm
49 200um
360um
eWLP100T.4-DC108D2
eWLP100T.4-DC108D3
144 12x12 0.4mm 4.76mm
W=12mm
P=8mm
64 200um
360um
eWLP144T.4-DC127D2
eWLP144T.4-DC127D3
196 14x14 0.4mm 5.56mm
W=12mm
P=8mm
36 200um
360um
200um
200um
eWLP196T.4-DC148D2
eWLP196T.4-DC148D3
eWLP196W.4-DC148D2Q
eWLP196W.4-DC148U2Q
256 16x16 0.4mm 6.36mm W=16mm
P=12mm
25 200um
200um
200um
eWLP256T.4-DC168D2
eWLP256T.4-DC148D2Q
eWLP256T.4-DC148U2Q
Round Pad

Square pad
Pitch = 0.4mm   •   Cu Pad diameter 0.20mm   •   Die Thickness: 200µm and 360µm
Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray
 
0.5mm pitch eWLP Wafer Level Package
Balls
I/O
Ball
Matrix
Pitch Size SQ Tape
& Reel
Tray Qty
4" Waffle Pack
Die Thickness Outline Drawing
Cu Post
100 10x10 0.5mm 5.0mm
W=12mm
P=8mm
144 200um
400um
eWLP100T.5-DC108D2
eWLP100T.5-DC108U4
Round Pad
144 12x12 0.5mm 6.0mm
W=12mm
P=8mm
121 200um
400um
eWLP144T.5-DC127D2
eWLP144T.5-DC127U4
Round Pad
196 14x14 0.5mm 7.0mm
W=16mm
P=12mm
81 200um
400um
eWLP196T.5-DC148D2
eWLP196T.5-DC148U4
Round Pad
256 16x16 0.5mm 8.0mm
W=16mm
P=12mm
64 200um
360um
400um
eWLP256T.5-DC168D2
eWLP256T.5-DC168D3
eWLP256T.5-DC168U4
Pitch = 0.5mm   •   Cu Pad diameter 0.25mm   •   Die Thickness: 200µm and 400µm
Tray Pin 1   •     Pad Down in Tray   •    Pad Up in Tray
 
Download Solidworks® e-Drawings software to view rotatable:   Download
 
eWLP Pad Size - Embedded Die in PCB
    Spec Pitch 0.2mm Pitch 0.3mm Pitch 0.35mm Pitch 0.4mm Pitch 0.5mm    
    Ø Cu Pad 0.10mm 0.15mm 0.20mm 0.20mm 0.25mm
   
    Flatness
Tolerance
+/-20µm +/-20µm +/-20µm +/-20µm +/-20µm    
    Backgrind
With Extra
Fine-Polish
#2000
Grit
#2000
Grit
#2000
Grit
#2000
Grit
#2000
Grit
   
 
All eWLP devices are rated JEDEC Moisture Sensitivity Level MSL-1
Width of Daisy Chain tracing between Cu pads is 20µm
Material of RDL is Low-K Cu 99% pure
Passivation: Polyimide 4um thick
Encapsulation: Epoxy resin structure 50um thick
 
 
eWLP Cross Section
Copper Pillar Design.
 
 
eWLP Drawing Numbering System
    6         4         127         0    
Series Pitch Daisy Chain Pattern Packaging
For Embedded Die Applications

With Encapsulation:

6 = eWLP Without Balls
Die 200um thick
Round Cu Pad

7 = eWLP Without Balls
Die 360~400um thick
Round Cu Pad

1 = eWLP Without Balls
Die 200um thick
Square Cu Pad

2 = 0.2mm (M)
3 = 0.3mm (A)
7 = 0.35mm (Y)
4 = 0.4mm (F)
5 = 0.5mm (P)

(Laser Marking Code)
Row-Column Matrix

999 Unsawn Wafer
Waffle Pack Tray:
0 = 4-inch Tray (T) Pad Down
7 = 2-inch Tray (W) Pad Up (Special)
8 = 2-inch Tray (W) Pad Down
9 = 4-inch Tray (T) Pad Up (Special)

Carrier Tape:
1 = T&R Reel (E7A) Pad Down
2 = Cut Tape - (E) Pad Down

Wafer Format:
3 = Sawn Wafer UV Tape & Ring (Full)
4 = Sawn Wafer UV Tape & Ring (Partial)
5 = Unsawn Wafer

Unassigned:
6 = To Be Assigned
 
 
 
eWLP Part Numbering System
    eWLP         144         T         .4         -         DC127         D2    
Series Nbr Pads Package Code Pitch Pad Alloy Daisy Chain
Pattern
Die Thickness and
Pad Up/Down in Package
eWLP = Without Balls
Embedded Application




Under Development
eSWLP =
Cu Metal Shielded Version
Without Balls
Embedded Application
4 ~ 2500
Greater I/O Available
T = 4-inch Waffle Tray

W = 2-inch Waffle Tray

E = Tape Reel (T&R)


X = Unsawn Wafer

U = Sawn Wafer
UV Tape & Ring
2 = 0.2mm (M)
.3 = 0.3mm (A)
.35 = 0.35mm (Y)
.4 = 0.4mm (F)
.5 = 0.5mm (P)

(Laser Marking Code)
Blank= Cu Pad
Without Solder Balls
Matrix Pattern Pad Down:
D2= 200µm Thick
Cu Pad

D2Q= 200µm Thick
Cu Pad
Square Pin 1 Pad

D3= 360µm Thick
Cu Pad

D4= 400µm Thick
Cu Pad

Pad Up:
U2= 200µm Thick
Cu Pad

U2Q= 200µm Thick
Cu Pad
Square Pin 1 Pad

U3= 360µm Thick
Cu Pad

Not Recommended:
251µm ~ 359µm Thick


 

eWLP Round Pads
 
Top Marking Example
 
eWLP Square Pads
 
 
eWLP Encapsulation Material Properties


TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000
Email: sales@topline.tv

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