| Enlarge: Bare Board  Board Size 4"x5.5" (10x14cm)
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              TopLine Mixed Technology 2 Kit. Top side has daisy chain BGA, QFP, SOIC, SOJ, SOT23, PLCC, SMT chips and throughhole components. Test points for checking continuity after mounting daisy chain BGA169 to verify correct assembly with a simple ohm-meter.
              
 Board Features:
 Choice of Final finish:
 • Immersion Tin (Sn)
 • ENIG (Ni/Au)Gold
 • OSP Copper
 • Immersion Silver
 • HASL SnPb
              LPI Solder Mask - PSR4000 AUS5
              FR4 Tg=170°C
              Size - 4"x5.5" (10x14cm) 
              Thickness 0.062" (1.6mm)
              2-Layer Board
              Lead Free RoHS Version
              Plated Throughholes (PTH)
              Tooling Holes .125" (3.17mm)
              IPC Fiducials  - 0.062" (1.57mm)
 Enlarge: 
Top (Shown After Assembly)
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