| Click PC Board Number below for more details about Kit |
| Kit Name |
Main Components |
PC Board Number |
| QFP Tool |
QFP Lead Straightening Tool |
900000 |
| B-24 Board |
SIR Test Board |
900024 |
| B-25 Board |
SIR Test Board |
900025 |
| B-36 Board |
SIR Test Board LCC68 |
900036 |
| FC176 Flip Chip Substrate |
176 Bump Flip Chip 204µm |
901001 |
| FC88 Flip Chip Substrate |
88 Bump Flip Chip 204µm |
902001 |
| FC317 Flip Chip Substrate |
317 Bump Flip Chip 254µm |
903001 |
| FC220 Flip Chip Substrate |
220 Bump Flip Chip 204µm |
904001 |
| CBGA196 Ceramic Substrate |
4x CBGA196 1.27mm pitch |
905201 |
| CBGA1089 Ceramic Substrate |
2x CBGA1089 1.27mm pitch |
905901 |
| FC96 Flip Chip Ceramic Substrate |
FC96 Flip Chip 457µm |
906001 |
| FC96 Flip Chip Substrate |
FC96 Flip Chip 457µm |
907001 |
| FC48 Flip Chip Ceramic Substrate |
FC48 Flip Chip 457µm |
908001 |
| FC48 Flip Chip Substrate |
FC48 Flip Chip 457µm |
909001 |
| Beginner's Throughhole |
24 Traditonal Throughhole Components |
910001 |
| FC112 Flip Chip Substrate |
FC112 Flip Chip 152µm |
911001 |
| Re-certification by Hand |
Low Cost Mixed Technology for Re-certification |
912001 |
| Multilayer Lead Free Throughhole |
DIP14 Daisy Chain + Connector + Zero Ohm Resistors + Capillary PTH Test |
913001 |
| Mixed Technology 2 |
Fine Pitch SMD and BGA, Chips and Throughhole |
914001 |
| Multipurpose Throughhole Machine Run |
900 Plated Throughholes |
915001 |
| Multipurpose Throughhole Hand Assembly |
900 Plated Throughholes |
916001 |
| BGA352-BGA400 Kit |
BGA352 1.27mm & BGA400 1.5mm (OBSOLETE) |
917001 |
| Flip-Chip Glass Underfill 50um |
Full Array. Pitch 80 ~ 250um |
918000 |
| Machine Run |
Large board 9"x8" chips, BGA, TQFP, TSOP, PLCC |
919001 |
| Challenger 1 |
See new Challenger 2 #928001 |
920001 |
| µBGA TV46 |
Tessera µBGA CSP46 0.75mm pitch |
921001 |
| µBGA TV74 |
Tessera µBGA CSP74 (Obsolete) |
922001 |
| µBGA TV188 |
Tessera µBGA CSP188 (Obsolete) |
923001 |
| Beginners SMT |
Simple Kit with PLCC, SOIC, SOT, Chips |
924001 |
| SMD Introductory Kit |
QFP, PLCC, SOIC, SOT, Chips |
925001 |
| Practical Hand Kit |
QFP, PLCC, SOIC, SOT, DIP, chips |
926001 |
| Challenger 2 Kit |
QFP, BGA, PLCC, SOIC, SOT, Chips |
928001 |
| Jumbo Chip Kit |
0402, 0603, 0805, 1206 chips |
929001 |
| Advanced SMD 1 |
QFP, TQFP, TSOP (Pitch 0.5~1.0mm) |
930001 |
| Advanced SMD 2 |
QFP,TQFP, TSOP (Pitch 0.4~1.0mm) |
931001 |
| µBGA TV62 |
Tessera µBGA CSP62 RAMBUS 0.8mm/1.0mm (Obsolete) |
932001 |
| µBGA TV208 |
Tessera µBGA CSP208 RAMBUS 0.5mm (Obsolete) |
934001 |
| Stencil Eval 0.3mm Pitch |
TQFP, QFP, BGA, TSOP, PLCC |
935001 |
| Stencil Eval 0.4mm Pitch |
QFP, BGA, TSOP, PLCC |
936001 |
| BGA256/272 Kit |
BGA256/272 Pitch 1.27mm |
937001 |
| Econo Kit 2 |
TQFP, SO, DIP, Chips |
938001 |
| Econo Kit 3 |
QFP, PLCC, SO, DIP, Chips + throughhole |
939001 |
| Monster Kit |
See 948001 |
940001 |
| 0.3mm Pitch Kit |
TQFP168 (obsolete) |
943001 |
| Rework Practice 2 |
QFP, PLCC, SOIC, SOT, chips |
944501 |
| PCMCIA |
LQFP, TSOP, Chips |
945001 |
| Universal BGA 1.27/1.5mm |
BGA for 1.27mm and 1.5mm pitch without daisy-chain |
946001 |
| Multiple BGA |
Daisy-chain Top: BGA196/256/272/352/388 Back: BGA225/352/388 |
947001T Top
947001B Back
BGA Mounting |
| Monster Kit 2 |
Combines Advanced 930001 and Challenger 2 Kits 928001 |
948001 |
| 0201 / 0401 Kit |
0201 chips on top side and 0402 chips on back side of board. Daisy Chain |
949001 |
| SABER Array |
4-Board array Mixed Technology designed by SMTA fine-pitch, BGA, TSOP, SIR coupon, Wave solder coupons, etc |
950001 |
| Multiple CBGA |
CBGA121,196,256,304,361,625 on FR-4 Board |
951001 |
| B-52 SIR Test |
Cleanliness & Residue Evaluation Test IPC-B-52 Compatible |
952001 |
| Visual Placement Inspection |
Acrylic with sticky surface for BGA 1.27mm and 1.5mm pitch |
953001 |
| Visual Placement Inspection |
Acrylic with sticky surface for µBGA and CSP 0.5mm to 0.8mm pitch |
953101 |
| Visual Placement Inspection |
Acrylic with sticky surface for 0.8mm and 1.0mm BGA |
953201 |
| Visual Placement Inspection |
Acrylic with sticky surface for Flip Chip 204um, 254um and 457um pitch |
953401 |
| Visual Placement Inspection |
Acrylic with sticky surface for Flip Chip Grid Lines 4mil to 20mil |
953501 |
| Visual Placement Inspection |
View of Layers of Typical Visual Boards |
953xxx |
| HP Saber Alloy Test Kit |
4-Layer SABER PCA OSP |
9548xx |
| Die Bond Kit |
Die Bond to QFN48 Lead Frame with daisy chain |
955000 |
| CLGA |
CLGA239, 334, 383, 559, 608, 944, 1007 with daisy chain |
956009 |
| CBGA196 and CBGA625 |
CBGA196/625 with daisy chain |
957001 |
| BGA1225 and BGA1089 |
BGA1225 & BGA1089 with daisy chain |
958001 |
| Glass Underfil 50um, 100um, 125um |
Simulate Flip Chip Underfill 5mm to 15mm |
959001 |
| Machine Diagnostic Kit |
3 Machine Diagnotic kits: Speed, Rotational & Fiducials |
960001 |
| TSOP32 Kit |
9 each TSOP32 0.5mm pitch |
960301 |
| Fiducial Evaluation |
QFP100 with 10 different fiducial marks |
961001 |
| BQFP132 |
BQFP132 25 mils |
961301 |
| QFP160 |
QFP160 0.65mm Pitch |
961601 |
| Rotational Placement 360° |
TSOP, SO, Chips |
961801 |
| Assortment QFP 0.4mm to 0.8mm |
QFP120, QFP160, QFP208, QFP256 |
962001 |
| QFP208 |
QFP208 0.5mm Pitch |
962101 |
| QFP256 |
QFP256 0.4mm Pitch |
962501 |
| Universal BGA 0.5mm - 0.8mm |
Universal BGA with non-daisy chain pads for 0.5mm, 0.75mm and 0.8mm pitch |
963001 |
| Chip Shooter 0402 / 0603 |
0402 and 0603 Chips Daisy Chain |
964001 |
| Rework Practice 1 |
QFP, PLCC, SOIC, SOT, chips |
965001 |
| BGA169 / 225 Daisy Chain Test |
BGA169 and BGA225 1.5mm pitch |
967001 |
| Chip Shooter 0805 / 1206 |
0805 and 1206 Chips |
968001 |
| Mixed Technology 1 |
QFP, PLCC, SOIC, Chips, DIP |
969601 |
| SMD Bread Board |
Snaps apart for Prototyping |
970500 |
| Sample Display Boards for Show & Tell |
Parts mounted in plastic case |
970000 |
| Not used
| Internal Use |
971 - 972 |
| CCGA1089 - 1.27mm (SRO 35mil) and CCGA1247 - 1.0mm (SRO 33mil) |
Column Grid Array FR4 Board |
973000 |
| BGA1600 - BGA1936 |
BGA1600 and BGA1936 1.0mm Pitch |
974000 |
| QFN Board |
20 Different QFN 0.4mm~0.65mm , 3mm ~ 12mm , 8L ~ 80L |
975000 |
| BGA256Board |
6x BGA256 P=1.0mm |
976000 |
| Metcal Rework Practice Board |
Rework Practice Board 3 |
977001 See 978000 |
| Rework 3 Kit |
Rework Practice 3 Kit |
978001 |
| NASA Solder Training Board |
Throughhole Practice Board |
979001 |
| 01005 / 0201 Chip |
Daisy Chain Zero Ohm Chip Board |
980001 |
| Universal BGA 1.0mm / 0.8mm |
Universal BGA board for 1.0mm and 0.8mm pitch |
981001 |
| Lead Free QFP208 |
QFP208 with Ni-Pd leads and tin board |
982001 |
| Lead Free 0805 / 1206 chips |
0805 and 1206 chips with tin terminations and tin board |
983001 |
| Lead Free 0402 / 0603 chips |
Lead Free 0402 and 0603 chips |
984001 |
| Lead Free BGA |
See 947 board |
985001 |
| Lead Free BGA and Fine Pitch |
Lead Free BGAs, QFP, chips |
986001 |
| BGA and Fine Pitch |
HASL Sn/Pb version of 986001 |
987001 |
| Global Fiducial Only |
Global Fiducial Only 5.5" x 8" |
997001 |
| Throughhole Connector 120-Pin |
2X Connectors 1.27mm pitch |
990015 990016 |
| Fine Pitch BGA 0.8mm / 1.0mm Pitch |
BGA676 1.0mm and BGA100 0.8mm pitch |
998000 |
| Fine Pitch BGA 0.8mm / 1.0mm Pitch |
BGA672 1.0mm and BGA100 0.8mm pitch |
998101 Obsolete. See 998000 |
| BGA172 - 1.0mm Pitch 12mm |
12-Layer Board BGA172 |
999013 |
| CGA1752 - 1.0mm Pitch |
4-Layer Board Column Grid Array |
999015 |
| BGA1752 - 1.0mm Pitch |
4-Layer Board Ball Grid Array |
999016 |
| BGA 15x15mm STAND OFF BOARD |
Controlled Height For Underfill |
999080 |
| BGA 15x15mm STAND OFF FIXTURE |
Tool for mounting Glass Components |
999099 |
| BGA324 - 1.0mm Pitch 23mm |
BGA Concentric Ring Cleanliness Board |
999141 |
| BGA272 - 1.27mm Pitch 27mm |
BGA Concentric Ring Cleanliness Board |
999143 |
| BGA676 - 0.8mm Pitch 23mm |
BGA Concentric Ring Cleanliness Board |
999145 |
| BGA2025 - 0.4mm Pitch 21mm |
BGA Concentric Ring Cleanliness Board |
999147 |
| BGA Substrates |
Practice Substrates for BGA Semiconductor Manufacturing Equipment |
BGA Substrates |
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