Enlarge: Assembled Board (Top)
   
Board Size 4"x5.5" (10x14cm) Same pattern repeated on bottom side.
 
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              TopLine Mixed Technology 1 Kit has fine-pitch QFP, SOIC, SOT, PLCC, SMT chips, DIP and more.
              
  
              Board Features: 
              Choice of Final finish: 
                   • Immersion Tin (Sn) 
                   • ENIG (Ni/Au)Gold 
                   • OSP Copper 
                   • Immersion Silver 
                   • HASL SnPb
              LPI Solder Mask - PSR4000 AUS5
              FR4 Tg=175°C
              Size - 4"x5.5" (10x14cm) 
              Thickness 0.062" (1.6mm)
              2-Layer Board
              Lead Free RoHS Version
              Plated Throughholes (PTH)
              Tooling Holes .125" (3.17mm)
              IPC Fiducials  - 0.062" (1.57mm)
            
 Enlarge: 
Bare Board (Top)
  
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