Ball Grid Array Kit
BGA169 & BGA225
With Daisy Chain Test


Actual Size: 4" x 5.5" (100 x 140mm) 		 

     TopLine makes practicing with Ball Grid Array technology accesible and affordable. Each board supports four BGAs with 1.5mm grid pattern and daisy chain test points to verify proper placement. Double sided board incorporates "two front side" design so only one solder paste stencil is needed.

Features:

  • Hot Air Soldering Leveling
  • LPI Solder Mask
  • FR4 Board .062"
  • Double Sided
  • Tooling Holes .125"
  • Fiducial Marks

    Click here to download our Kits catalog in PDF format.

    • BGA 169
    After Mounting to Test Board View of Solder Balls
    BGA 225
    After Mounting to Test Board View of Solder Balls

        Manual Assembly Machine Run
    Component Pitch Order #
    967000
    1 Kit    		 Order #
    967012
    12 Kits    		 Order #
    967025
    25 Kits    		 Order #
    967050
    50 Kits    		 Order #
    9675100
    100 Kits
    Board   1 12 25 50 100
    BGA 169 1.5mm 2 25 50 100 200
    BGA 225 1.5mm 2 25 50 100 200

    Optional Accessories
    Parts Placement Data - X, Y, Theta ASCII File - Order Number 967004
    Solder Paste Artwork - Gerber File - Order Number 967005
    Solder Paste Stencil - Order Number 967009 - Call for Details

    Spare Parts
    Components Quantity Order Number
    PC Board Only 1 967001
    BGA 169 1 100940
    BGA 169 25 287899
    BGS 225 1 100950
    BGA 225 25 287912


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