Pad Detail Photo of Board Other Kits
Laminate FR4 board for placement and daisy chain continuity testing after assembly.
Each substrate has 10 sites for mounting flip chips with 317 bumps 5.08mm x 5.08mm with 254µm pitch full array.
Tg = 180°C
3~8 micro-inch immersion Gold over electroless nickel
1/4-oz copper, plated up to 1-oz
Local and Global Fiducial Marks
Traces 3 mil lines and spaces
Single Sided mounting 10-sites
Green LPI Solder Mask
Fingers .05" (1.27mm) pitch
Board 3.8" x 5.5" (96mm x 140mm)
Board Thickness .031" (0.8mm)
4-tooling holes .125" (3.17mm)