B-25A
SIR TEST Board

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Board Size 4" x 4.5" (10 x 14cm)
Bottom side is bare.


 

Board Features:

  • Final finish:
        • Bare Copper
        • Immersion Silver
        • ENIG Ni-Au
        • Other Available
  • Copper Thickness - 1-Oz.
  • Solder Mask - None
  • FR4 Tg=175°C
  • Size - 4"x4.5" (10x11.4cm)
  • Thickness 0.062" (1.6mm)
  • Single Layer Board
  • Connector Fingers 0.156" Pitch (4.0mm)
  • Pattern Line Spacing:
        • Coupon-C 0.025"
        • Coupon-D 0.0125"
        • Coupon-E 0.020"
        • Coupon-F 0.020"
  •  
    How to Order B-25A Boards
    Order
    Qty
    Order Number Coupons
    PCB/PWB Finish
    Fingers
    PCB/PWB Finish
    RoHS
    Pb-Free
    1 each Order# 900025 Bare Copper (Cu) Board Electroplated Gold (Au)
    30 micro-inch
    RoHS
    1 each Order# 900125 Electroplated Gold (Au)
    30 micro-inch
    Electroplated Gold (Au)
    30 micro-inch
    RoHS
    1 each Order# 900325 Tin-Lead HASL (SnPb) Tin-Lead HASL (SnPb) -
    1 each Order# 900425 Bare Copper Cu (Not OSP) Bare Copper Cu (Not OSP) RoHS
    1 each Order# 900625 Immersion Silver (Ag) Immersion Silver (Ag) RoHS
    1 each Order# 900725 Immersion Tin (Sn) Immersion Tin (Sn) RoHS
    1 each Order# 900825 HASL Tin (Sn) HASL Tin (Sn) RoHS
    1 each Order# 900925 ENIG Gold
    (Au) 5 micro-inch
    ENIG Gold
    (Au) 5 micro-inch
    RoHS
    Ask for other plating/finish combinations.
     
     
    IPC-B-25A test board artwork and
    electronic data is available from IPC.
     
     
    Kit Order Number System
    900 0 25
    Board Plating Series
    Size 4"x4.5"
    (10x11.4cm)
    0 = Bare Cu (Electroplated Gold Fingers)
    Original Version

    1 = Hard Gold (Au)
    3 = HASL Tin-Lead (SnPb)
    4 = Bare Cu (No Gold)
    5 = To be assigned
    6 = Immersion Silver (Ag)
    7 = Immersion Tin (Sn)
    8 = HASL Tin (Sn)
    9 = ENIG (Flash Gold)
    25 = B-25A
     
    Edge Connector (Not Included)
    Item Specification
    Order Nbr DWG 172422 - Solderable Eyelet
    DIP Dual Row 0.14" (3.56mm) Center
    Positions 22
    Pitch 0.156" (3.96mm)
    Board Thick 0.059~0.062" (1.50~1.57mm)
    Edges Double
    Connector
    Vertical Mouting
    DWG 172422 - Solderable Wire Eyelet

    Alternative Plated Thru-Hole
    44X (Ø 1.3mm - .051" Holes)
    Dual Row Spaced on PCB Card:
    0.140 (3.56mm)
     
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