| Enlarge: Bare Board  Board Size 4"x5.5" (10x14cm)
 Same pattern repeated on bottom side.
 
 
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              TopLine Rotational Placement Kit. Each side has pads for TSOP(I), SOIC and chip Resistors. Components are place radially around a center focal point, spaced on 22.5° angles.
              
 Board Features:
 Choice of Final finish:
 • Immersion Tin (Sn)
 • ENIG (Ni/Au)Gold
 • OSP Copper
 • Immersion Silver
 • HASL SnPb
              LPI Solder Mask - PSR4000 AUS5
              FR4 Tg=170°C
              Size - 4"x5.5" (10x14cm) 
              Thickness 0.062" (1.6mm)
              2-Layer Board
              Lead Free RoHS Version
              Tooling Holes .125" (3.17mm)
              IPC Fiducials  - 0.062" (1.57mm)
 Enlarge: 
Top (Shown After Assembly)
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