CLGA - Ceramic Land Grid Array   CCGA Column Grid Array   BGA   More Products   Home      Pad View    Top Die View CLGA - Ceramic Land Grid Array Daisy Chain - Pitch 0.5mm Fig. Nbr Pads Matrix Pitch Body Size SQ Si Dummy Die Substrate Tray CBGA Sn63Pb37 Solder Ball (Optional) CBGA SAC305 Lead Free Solder Ball (Optional) CLGA Land Grid Array Cu-NiAu Pad Without Ball (Standard) 1 239 16x16 0.5mm 9mm 6mm Ceramic 260 CBGA239T.5X-DC167D CBGA239T.5C-DC167D CLGA239T.5G-DC167D 2 559 24x24 0.5mm 13mm 8mm Ceramic 160 CBGA559T.5X-DC247D CBGA559T.5C-DC247D CLGA559T.5G-DC247D 3 1007 32x32 0.5mm 17mm 10mm Ceramic 90 CBGA1007T.5X-D327D CBGA1007T.5C-D327D CLGA1007T.5G-D327D Pad Metal: W/Cu Pad=20µm Ni=2~5µm Au= 0.127µm   Dummy Die Thickness: 200 µm  Pad Diameter: 0.30mm   Ceramic Substrate Thickness: 0.6mm Optional Ball Dia: 0.30mm   Seated Height: CLGA 0.8mm   •   CBGA 1.1mm Pad View - Pitch 0.5mm Fig. 1 Fig. 2 Fig. 3 CLGA239T.5G-DC167D 9.0 x 9.0mm P=0.5mm CLGA559T.5G-DC247D 13 x 13mm P=0.5mm CLGA1007T.5G-DC327D 17 x 17mm P=0.5mm     CLGA - Ceramic Land Grid Array Daisy Chain - Pitch 0.65mm Fig. Nbr Pads Matrix Pitch Body Size SQ Si Dummy Die Substrate Tray CBGA Sn63Pb37 Solder Ball (Optional) CBGA SAC305 Lead Free Solder Ball (Optional) CLGA Land Grid Array Cu-NiAu Pad No Ball (Standard) 4 344 19x19 0.65mm 13mm 8mm Ceramic 160 CBGA344T.65X-DC197D CBGA344T.65C-DC197D CLGA344T.65G-DC197D 5 608 25x25 0.65mm 17mm 10mm Ceramic 90 CBGA608T.65X-DC256D CBGA608T.65C-DC256D CLGA608T.65G-DC256D 6 944 31x31 0.65mm 21mm 12mm Ceramic 60 CBGA944T.65X-D317D CBGA944T.65C-D317D CLGA944T.65G-D317D Pad Metal: W/Cu Pad=20µm Ni=2~5µm Au= 0.127µm   Dummy Die Thickness: 200 µm  Pad Diameter: 0.40mm   Ceramic Substrate Thickness: 0.6mm Optional Ball Dia: 0.40mm   Seated Height: CLGA 0.8mm   •   CBGA 1.2mm Pad View Pitch 0.65mm Fig. 4 Fig. 5 Fig. 6 CLGA344T.65G-DC197D 13 x 13mm P=0.65mm CLGA608T.5G-DC256D 17 x 17mm P=0.65mm CLGA944T.65G-DC317D 21 x 21mm P=0.65mm     CLGA - Ceramic Land Grid Array Daisy Chain and Silicon Dummy Die Pitch 0.8mm Fig. Nbr Pads Matrix Pitch Body Size SQ Si Dummy Die Substrate Tray CBGA Sn63Pb37 Solder Ball (Optional) CBGA SAC305 Lead Free Solder Ball (Optional) CLGA Land Grid Array Cu-NiAu Pad No Ball (Standard) 7 383 20x20 0.8mm 17mm 10mm Ceramic 90 CBGA383T.8X-DC1204D CBGA383T.8C-DC204D CLGA383T.8G-DC204D 8 608 25x25 0.8mm 21mm 12mm Ceramic 60 CBGA608T.8X-DC256D CBGA608T.8C-DC256D CLGA608T.8G-DC256D Pad Metal: W/Cu Pad=20µm Ni=2~5µm Au= 0.127µm   Dummy Die Thickness: 200 µm  Pad Diameter: 0.50mm   Ceramic Substrate Thickness: 0.6mm Optional Ball Dia: 0.50mm   Seated Height: CLGA 0.8mm   •   CBGA 1.3mm Pad View Pitch 0.8mm Fig. 7 Fig. 8 CLGA383T.8G-DC204D 17 x 17mm P=0.8mm CLGA608T.8G-DC256D 21 x 21mm P=0.8mm     JEDEC Moisture Sensitivity Level MSL-1   Part Numbering System CLGA 239 T .5 G -DC167 D Style Pads Balls Tray Pitch Material Daisy Chain Pattern Dummy Die CLGA= Ceramic Land Grid Array CBGA=Ceramic Ball Grid Array 239 to 1007 T = JEDEC Tray Pitch: .5 = 0.5mm .65 = 0.65mm .8 = 0.8mm G= NiAu Pad X=Sn63 Ball C=SAC305 Ball Daisy Chain Pattern Drawing Number D= Dummy Die

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