Join CCGA
Packaging Group		  Column
Attachment		 CCGA
Column Grid Array
 
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ABOUT CCGA: Column Grid Array (CCGA) packages provide a trusted solution for overcoming 10ppm/oC mismatch of coefficient of thermal expansion (CTE) between large ceramic IC packages and glass-epoxy printed circuit boards (PCB). Solder columns on CCGA packages are compliant and absorb strain in applications typically found in the fields of military, aerospace and defense where significantly varying temperatures, high vibration and shock are present.
 
CCGA484 CCGA624 CCGA1152 CCGA1272 CCGA1752
 
Columns Matrix Pitch Size (mm) Dummy Die
Location		 Pb80/Sn20
Cu Wrap Columns		 Pb90/Sn10
Plain Columns		 Micro-coil
Springs		 Availability
483/484 22x22 1.0mm 23mm Inside CCGA484T1.0-DC225D
 Model		 CCGA484T1.0A-DC225D
 Model		 CCGA484T1.0M-DC225D
Model		 Tooled
624 25x25 1.27mm 32.5mm Inside CCGA624T1.27-DC254D CCGA624T1.27A-DC254D CCGA624T1.27M-DC254D Tooled
717 27x27 1.27mm 35mm Inside CCGA717T1.27-DC275D
 Model		 CCGA717T1.27A-DC275D
 Model		 CCGA717T1.27M-DC275D
Model		 Tooled
896 30x30 1.0mm 31mm Inside CCGA896T1.0-DC308D - - Tooled
1140 34x34 1.0mm 35mm Surface
Mount		 CCGA1140T1.0-DC341D
 Model		 CCGA1140T1.0A-DC341D
 Model		 CCGA1140T1.0M-DC341D
Model		 Tooled
1144 34x34 1.0mm 35mm Surface
Mount		 CCGA1144T1.0-DC348D
 Model		 CCGA1144T1.0A-DC348D
 Model		 CCGA1144T1.0M-DC348D
Model		 Tooled
1152 34x34 1.0mm 35mm Inside CCGA1152T1.0-DC346D
 Model		 CCGA1152T1.0A-DC346D
 Model		 CCGA1152T1.0M-DC346D
Model
Photos: 1  2  3  4  5		 Tooled
1272 36x36 1.0mm 37.5mm Inside CCGA1272T1.0-DC367D CCGA1272T1.0A-DC367D CCGA1272T1.0M-DC367D Tooled
1657 41x41 1.0mm 42.5mm Surface
Mount		 CCGA1657T1.0-DC417D
Model		 CCGA1657T1.0A-DC417D
Model		 CCGA1657T1.0M-DC417D
Model		 Tooled
IBM Daisy Chain
1752 42x42 1.0mm 45mm Surface
Mount		 CCGA1752T1.0-DC427CN
Model		 CCGA1752T1.0A-DC427CN
Model CN •  Model CF
Photo		 CCGA1752T1.0M-DC427CN
Model CN		 Tooled
Optional: Heat-Spreaders   •   Custom packages and new designs: Aluminum-Models CCGA
 
 
Additional Ceramic CCGA Packagings
Columns Matrix Pitch Size (mm) Die
Location		 Pb80/Sn20
Cu Wrap Columns		 Pb90/Sn10
Plain Columns		 Micro-Coil
Spring		 PDF
Outline
Drawing
165 11x15 1.27mm 21x25mm Inside - CCGA165T1.27-DC1115D - Under Development
168 13x13 1.27mm 17x17mm Inside - CCGA168T1.27-DC137D - Under Development
255 16x16 1.27mm 21mm Inside - CCGA255T1.27A-DC161D - Under Development
337 27x27 1.27mm 35.56mm Inside - CCGA337T1.27-DC27_D - Under Development
349 19x19
Depoulated
3x Corner		 1.27mm 25mm Inside CCGA349T1.27-DC197D - - Under Development
360 19x19 1.27mm 25mm Inside - CCGA360T1.27A-DC198D - Under Development
376 20x20 1.27mm 28mm Inside - CCGA376A-DC204D
Model		 - Under Development
468 22x22
Depoulated
3x3 Center		 1.27mm 31mm Inside CCGA468T1.27-DC22xD
Honeywell		 - - Under Development
472 22x22
Depoulated
3x Corner		 1.27mm 29mm Inside CCGA472T1.27-DC220D CCGA472T1.27A-DC220D
Atmel		 - Under Development
472 22x22 1.27mm 31mm ? Inside - CCGA472T1.27A-DC226D
Aeroflex		 - Under Development
484 22x22 1.27mm 29mm Inside CCGA484T1.27-DC229D
Aeroflex		 - - Under Development
517 23x23 1.27mm 32.5mm Surface
Mount		 CCGA517T1.27-DC236D CCGA517T1.27A-DC236D - Under Development
517 23x23 1.27mm 31mm Surface
Mount		 CCGA517T1.27-DC237D CCGA517T1.27A-DC237D - Under Development
564 24x24 1.27mm 31mm Inside CCGA564T1.27-DC24xD CCGA517T1.27A-DC24xD - Under Development
1077 33x33 1.27mm 42.5mm Surface
Mount		 CCGA1077T1.27-DC338F
Model		 CCGA1077T1.27A-DC427F
Model		 CCGA1077T1.27M-DC427F
Model		 Under Development
1509 39x39 1.0mm 40mm Surface
Mount		 CCGA1509T1.0-DC396D
Model		 CCGA1509T1.0A-DC396D
Model		 CCGA1509T1.0M-DC396D
Model		 Under Development
1588 40x40 1.27mm 52.5mm Surface
Mount		 CCGA1588T1.27-DC407F CCGA1588T1.27A-DC407F - Under Development
1657 41x41 1.0mm 42.5mm Under
Kovar Lid		 CCGA1657T1.0-DC416D CCGA1657T1.0A-DC416D - Under Development
Microsemi
Daisy Chain
1752 44x44 1.27mm 57.0mm Inside CCGA1752T1.27-44x44
Model		 - - Under Development
1825 43x43 1.0mm 46.0mm
2.3mm Thick		 Surface
Mount		 CCGA1825T1.0-43x43
Ø 0.60mm Pads
Ø 0.38mm Columns		 - - Under Development
2577 51x51 1.0mm 52.5mm Surface
Mount		 CCGA2577T1.0-DC517F CCGA2577T1.0A-DC517F CCGA2577T1.0M-DC517F Under Development
Custom packages and new designs: Aluminum-Models CCGA
 
 
 
 
 
 
CLGA - Ceramic Land Grid Array with Daisy Chain
Click to Enlarge
Columns Matrix Pitch Package
Size (mm)		 Part Number Die
Location		 Heat
Sink		 Capacitors Pad
ØDia		 SolidWorks
Model		 Images
165 11x15 1.27mm 21x25mm CLGA165T1.27-DC1115D Inside No No Ø0.8mm
31mil		 Model Top  Bottom
168 13x13 1.27mm 17x17mm CLGA168T1.27-DC137D Inside No No Ø0.8mm
31mil		 Model Top  Bottom
376 20x20 1.0/1.27mm 28mm CLGA376-DC204D Inside No No Ø0.889mm
35mil		 Model Top  Bottom
399 20x20 1.0mm 21mm CLGA399T1.0-DC207D Inside No No Ø0.6mm
24mil		 Model Top  Bottom
468 22x22 1.27mm 31x31mm CLGA468T1.27-DC22xD Inside No No Ø0.86mm
33mil		 Model Top  Bottom
483/484 22x22 1.0mm 23mm CLGA484T1.0-DC225D Inside No No Ø0.8mm
31mil		 Model Top  Bottom
624 25x25 1.27mm 32.5mm CLGA624T1.27-DC254D Inside No No Ø0.8mm
31mil		 - -
672 26x26 1.27mm 35mm CLGA672T1.27-26x26 Inside No No Ø0.9mm
35mil		 Model Top  Bottom
717 27x27 1.27mm 35mm CLGA717T1.27-DC275D Inside No No Ø0.8mm
31mil		 Model Top  Bottom
1140 34x34 1.0mm 35mm CLGA1140T1.0-DC341D Surface No No Ø0.8mm
31mil		 Model Top  Bottom
1144 34x34 1.0mm 35mm CLGA1144T1.0-DC348D Surface No No Ø0.8mm
31mil		 Model Top  Bottom
1152 34x34 1.0mm 35mm CLGA1152T1.0-DC346D Inside No No Ø0.8mm
31mil		 Model Top  Bottom
1272 36x36 1.0mm 37.5mm CLGA1272T1.0-DC367D Inside No No Ø0.8mm
31mil		 - -
1509 39x39 1.0mm 40mm CLGA1509T1.0-DC396 Surface No No Ø0.8mm
31mil		 Model Top  Bottom
1657 41x41 1.0mm 42.5mm CLGA1657T1.0-DC417 Without No No Ø0.8mm
31mil		 Model Top  Bottom
1657 41x41 1.0mm 42.5mm CLGA1657T1.0-DC417D Surface No No Ø0.8mm
31mil		 Model Top  Bottom
1752 44x44 1.27mm 57mm CLGA1752T1.27-44x44 Inside No No Ø0.9mm
35mil		 Model Top  Bottom
1752 42x42 1.0mm 45mm CLGA1752T1.0-DC427D Surface No No Ø0.8mm
31mil		 Model Top  Bottom
1752 42x42 1.0mm 45mm CLGA1752T1.0-DC427CN Surface Yes No Ø0.8mm
31mil		 Model Top  Bottom
 
 
Custom packages and new designs: Aluminum-Models LGA-CCGA
 
 
 
 
 
 
LGA - Plastic Land Grid Array with Daisy Chain
Click to Enlarge Click to Enlarge
Columns Matrix Pitch Package
Size (mm)		 Part Number Die
Location		 Heat
Sink		 Pad
Material		 Pad
ØDia		 SolidWorks
Model		 Images
1152 34x34 1.0mm 35mm LGA1152T1.0G-DC344D Inside Dome
Cover		 NiAu
Cu		 Ø0.5mm
20mil		 Model Top  Bottom
1738 42x42 1.0mm 35mm LGA1738T1.0G20-DC426D Inside Dome
Cover		 NiAu
Cu		 Ø0.5mm
20mil		 Model Top  Bottom
1752 42x42 1.0mm 42.5mm LGA1752T1.0G20-DC427D Inside Dome
Cover		 NiAu
Cu		 Ø0.5mm
20mil		 Model Top  Bottom
1752 42x42 1.0mm 42.5mm LGA1752T1.0G28-DC427D Inside Dome
Cover		 NiAu
Cu		 Ø0.71mm
28mil		 Model Top  Bottom
 
 
Custom packages and new designs: Aluminum-Models LGA-CCGA
 
 
 
 
Plastic Column Grid Array with Daisy Chain
Click to Enlarge Click to Enlarge
Columns Matrix Pitch Package
Size (mm)		 Part Number Fillet
Alloy		 Heat
Sink		 Column Type Column
ØDia		 SolidWorks
Model		 Images
771 30x33 1.17mm
1.09mm		 37.5mm WCGA771T1.0-D
Xeon		 Sn63 Dome
Cover		 Pb80Sn20
Cu Wrap
3.6mm Long
0.140"~0.150"		 Ø0.50mm
20mil		 Model Top  Bottom
896 30x30 1.0mm 31mm CG-FC896T1.0-DC308D Sn63 Dome
Cover		 Pb80Sn20
Cu Wrap		 Ø0.38mm
15mil		 Model Top  Bottom
896 30x30 1.0mm 31mm CG-FC896T1.0M-DC308D Sn63 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.40mm
16mil		 Model Top  Bottom
1152 34x34 1.0mm 35mm CG-FC1152T1.0-DC344D Sn63 Dome
Cover		 Pb80Sn20
Cu Wrap		 Ø0.38mm
15mil		 Model Top  Bottom
1152 34x34 1.0mm 35mm CG-FC1152T1.0A-DC344D Sn63 Dome
Cover		 Pb90Sn10
Cu Wrap		 Ø0.38mm
15mil		 Model Top  Bottom
1152 34x34 1.0mm 35mm CG-FC1152T1.0M-DC344D Sn63 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.40mm
16mil		 Model Top  Bottom
1152 34x34 1.0mm 35mm CG-FC1152T1.0G-DC344D SnPb Dome
Cover		 Micro-Coil
Spring
NiAu		 Ø0.40mm
16mil		 Model Top  Bottom
1152 34x34 1.0mm 35mm CG-FCG1152T1.0G-DC344D SAC305 Dome
Cover		 Micro-Coil
Spring
NiAu		 Ø0.40mm
16mil		 Model Top  Bottom
1738 42x42 1.0mm 42.5mm CG-FC1738T1.0M-DC426D Sn63 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.4mm
16mil		 Model Top  Bottom
1738 42x42 1.0mm 42.5mm CG-EF1738T1.0G-DC426D Sn63 Flat
Cover		 Micro-Coil
Spring
NiAu		 Ø0.4mm
16mil		 Model Top  Bottom
1752 42x42 1.0mm 42.5mm CG-FC1752T1.0-DC427D Sn63 Dome
Cover		 Pb80/Sn20
Cu Wrap		 Ø0.38mm
15mil		 Model Top  Bottom
1752 42x42 1.0mm 42.5mm CG-FC1752T1.0M-DC427D Sn63 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.40mm
16mil		 Model Top  Bottom
1752 42x42 1.0mm 42.5mm CG-FC1752T1.0G-DC427D Sn63 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.40mm
16mil		 Model Top  Bottom
1752 42x42 1.0mm 42.5mm CG-FCG1752T1.0G-DC427D SAC305 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.40mm
16mil		 Model Top  Bottom
2104 46x46 1.0mm 52.5mm CG-FC2104T1.0-DC466D Sn63 Dome
Cover		 Pb90/Sn10
Cu Wrap		 Ø0.38mm
16mil		 Model Top  Bottom
2104 46x46 1.0mm 52.5mm CG-FCG2104T1.0G-DC466D SAC305 Dome
Cover		 Micro-Coil
Spring
SnPb		 Ø0.40mm
16mil		 Model Top  Bottom
 
 
Custom packages and new designs: Aluminum-Models LGA-CCGA
 
 
 
 
Silicon Substrate - Wafer Level Package
Column Grid Array with Daisy Chain
Enlarge Corner View Enlarge Corner View
 
Columns Matrix Pitch Package
Size (mm)		 Part Number Fillet
Alloy		 Heat
Sink		 Column
Type		 Column
ØDia		 SolidWorks
Model		 Images
2500 50x50 0.5mm 25mm CG2500T.5-DC508D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
2916 54x54 0.5mm 27mm CG2916T.5-DC548D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
3844 62x62 0.5mm 31mm CG3844T.5-DC628D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
4900 70x70 0.5mm 35mm CG4900T.5-DC708D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
6400 80x80 0.5mm 40mm CG6400T.5-DC808D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
10000 100x100 0.5mm 50mm CG10000T.5-DC100D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
14400 120x120 0.5mm 60mm CG14400T.5-DC120D Sn63 Dome
Cover
Optional		 Copper
OFHC		 Ø0.125mm
5mil		 Model Top  Bottom
 
More CCGA on Silicon
 
 
CCGA Part Number System
 
    CCGA         1752         T         1.0         A     −     DC427         CN    
Package Type Nbr Pins Tray Pitch Column Type/Length   Daisy Chain Option
CCGA
Ceramic Column
Grid Array

CLGA
Ceramic Land
Grid Array

CG-EF
Plastic Grid Array
Flat Heat Spreader

CG-FC
Plastic Grid Array
Dome Heat Spreader		 I/O Pads T = Tray

 Standard
1.0 = 1.0mm
1.27 = 1.27mm

 Pb80/Sn20 + Copper Wrap
Blank = 2.2mm (0.087")
B = 2.54mm (0.100")

Pb90/Sn10 Plain
A = 2.2mm (0.087")

Pb90/Sn10 + Copper
H = 2.2mm (0.087") Cu Wrap
E = 2.2mm (0.087") Cu Plated

Micro Coil Spring
M = Tin/Lead Fillet
G = Gold Plated

Solid Copper Columns
C8 = 8mil Cu (Pb Plated)
   Net List
Drawing Number		 D=Dummy Die
In Cavity
Under the Lid

CF=Heat Spreader
Attached to Die

CN= Surface Mount
Pedestal Heat Spreader
 
 
 
Kelvin DCR DC Resistance Test Method   •   NASA GSFC-STD-6001   •   PWB Land Pattern
MIL883K - TM2038 Column Pull Test
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
        
 
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