ABOUT CCGA: Column Grid Array (CCGA) packages provide a trusted solution for overcoming 10ppm/oC mismatch of coefficient of thermal expansion (CTE) between large ceramic IC packages and glass-epoxy printed circuit boards (PCB). Solder columns on CCGA packages are compliant and absorb strain in applications typically found in the fields of military, aerospace and defense where significantly varying temperatures, high vibration and shock are present.