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Material Properties
 
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COPPER (Cu) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•K-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
Copper
CDA101
OFHC-101
1083°C 1083°C 8.94 115 GPa 60 μΩ m 400 W/m-°K 17ppm/°C 221 MPa
Copper
CDA14410

Cu99.9 Sn0.1~0.2
EFTEC-3
1083°C 1083°C 8.94 120 GPa 60 μΩ m 360 W/m-°K 17.3ppm/°C 255 MPa
Copper
C194
CuFe2P
EFTEC-194W

Cu97.4/Fe2.4/Zn0.13/P0.04
1088°C 1088°C 8.80 121 GPa 65 μΩ m 260 W/m-°K 17.4ppm/°C 221 MPa
Beryllium Copper
C172

Hard Temper TD05
Alloy 25
Cu98/Be1.8/Co0.2
865°C 980°C 8.30 131 GPa 23 μΩ m @20°
105 W/m-°K
----
@200°
130W/m-°K
17.8ppm/°C 560 MPa
 
 
LEAD (Pb) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•K-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
 High Lead
Pb95/Sn5
Solder

UNS L54320
308°C 312°C 11.0 20 GPa 8.8 36 W/m-°K 28.7ppm/°C 28.5 MPa
Pb93.5/Sn5/Ag1.5
Solder

HMP
296°C 301°C 10.8 19.5 GPa 8.7 36 W/m-°K 28.7ppm/°C 29.6 MPa
Pb90/Sn10
Solder

UNS L54520
275°C 302°C 10.7 19 GPa 8.2 36 W/m-°K 27.9ppm/°C 30 MPa
Pb85/Sn15
Solder
226°C 290°C 10.5 19.5 GPa 8.5 36.5 W/m-°K 27.0ppm/°C 32 MPa
Pb80/Sn20
Solder

UNS L54711
183°C 280°C 10.2 20 GPa 8.7 37 W/m-°K 26.5ppm/°C 33 MPa
Pb75/Sn25
Solder

 
183°C 271°C 9.96 20.5 GPa 9.0 38 W/m-°K 26.2ppm/°C 33.5 MPa
Pb70/Sn30
Solder

UNS L54280
183°C 257°C 9.7 21 GPa 9.3 41 W/m-°K 26.0ppm/°C 34 MPa
 
Eutectic and Near Eutectic
Sn60/Pb40
Solder
183°C 186°C 8.5 30 GPa 11.5 50 W/m-°K 23.9ppm/°C 52 MPa
Sn63/Pb37
Solder
183°C 183°C 8.4 30 GPa 11.9 51 W/m-°K 24.0ppm/°C 52 MPa
Sn62/Pb36/Ag2
Solder
179°C 179°C 8.44 23 GPa 11.5 49 W/m-°K 27.0ppm/°C xx MPa
 
 
LEAD FREE (Pb-Free) Material Properties
 
Alloy Solidus Liquidus Density
gm/cm3
Young's
Modulus of
Elasticity
Electrical
Conductivity

1.72µohms-cm
% of IACS
Thermal
Conductivity

W•m-1•K-1
CTE
Coefficient
Thermal
Expansion
Tensile
Strength
Lead Free (Tin-Sn)
Sn96.5/Ag3.0/Cu0.5
SAC305
217°C 218°C 7.4 51 Gpa 16.6 59 W/m-°K 21.0ppm/°C 50 Mpa
Sn96.5/Ag3.5
Sn96
221°C 221°C 7.5 51 Gpa 0.0000104 ohm-cm
Electrical Resistivity
59 W/m-°K 21.6ppm/°C 32 Mpa
Sn99.9/Cu.7/Ni.05/Ge.009
SN100C
227°C 227°C 7.4 __ Gpa _____ ohm-cm
Electrical Resistivity
59 W/m-°K 21.6ppm/°C __ Mpa
Sn96.5/Cu3.0/Ni0.5
SCN305
228°C 394°C 7.3 ~48 Gpa ~13.0 ~50W/m-°K 22.0ppm/°C 40~60 MPa
Sn90/Sb10 245°C 266°C 7.24 ~50 Gpa 0.0000161 ohm-cm
Electrical Resistivity
49 W/m-°K 27.0ppm/°C 42 MPa
Sn91.5/Sb8.5 235°C 243°C 7.3 - 0.0000145 ohm-cm
Electrical Resistivity
58 W/m-°K 20.0ppm/°C 40~50 MPa
Sn95/Sb5
UNS L13950
236°C 240°C 7.25 48 Gpa 0.0000145 ohm-cm
Electrical Resistivity
57 W/m-°K 27.0ppm/°C 41 MPa
Sn96.5/Cu.8/Ag.7/Bi2 208°C 215°C __ __ Gpa __ __ W/m-°K __ppm/°C __ MPa
Sn90/Ag3.5/Bi0.5/In6.0 202°C 210°C 7.4 53 Gpa 15.1 51.2 W/m-°K 25.5ppm/°C 47 MPa
Sn62/Bi37/0.5Cu/1.0Sb
Tin-Bismuth
139°C 174°C 8.1 47 GPa 5.9 30 W/m-°C 22.0ppm/°C 99 MPa
 
Lead Free (Non-Tin)
Au80-Sn20
Eutectic Solder
280°C 280°C 14.7 68 GPa 16.4 57 W/m-°K 16.0ppm/°C 275 MPa
Ag100
Silver
960°C 960°C 10.5 71 Gpa 6 x 105Ohm*m 418 W/m-°K 20.6ppm/°C 125 Mpa
Flux Designation System
Notes:
Ambient temperature is ~25 °C.
Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.
CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C.

Liquidus is the lowest temperature which an alloy is completely liquid.
Solidus is the highest temperature at which an alloy is completely solid.

Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa)

Data is for information only and is not guaranteed for accuracy.

Reference:Wikipedia Young's Modulus
Conversion: GPa to PSI
 
 
 
Material Properties
Metal
Alloy Melting Point
Liquidus
Solidus
Thermal
Conductivity
@ 25°C
CTE
Coefficient
Thermal
Expansion
Electrical
Resistance
Specific
Gravity
Alloy 42 1435°C 10.5 W/m-°K 5.0ppm/°C 72*10-6 Ω-cm 8.1 g/cc
Kovar 1450°C 16.7 W/m-°K 5.9ppm/°C 49*10-6 Ω-cm 8.4 g/cc
Alloy C194
Copper
1085°C 260 W/m-°K 17.6ppm/°C
20~300°C
2.87*10-6 Ω-cm 8.9 g/cc
Tungsten (W) 3422°C 173 W/m-°K 4.5ppm/°C 5.5*10-6 Ω-cm 19.3 g/cc
Molybdenum 2623°C 138 W/m-°K 5.1ppm/°C 5.2*10-6 Ω-cm 10.2 g/cc
 
Notes:
Ambient temperature is ~25 °C.
Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.
CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C.
Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa)
Data is for information only and is not guaranteed for accuracy.
 
 
 
Material Properties
Substrates
Material Density
gm/cc
Hardness Flexural
Strength
Young's
Modulus
Shear
Modulus
Surface
Finish
Thermal
Conductivity
@25°C
CTE
Coefficient
Thermal
Expansion
Volume
Resistivity
Dielectric
Constant
Dk
Dissipation
Factor
Df
HTCC Ceramic
92% Alumina
Al2O3
3.62
g/cc
1027
Kg/mm2
443
MPa
275
GPa
112
GPa
<1.14
µm
20.3
W/mk
6.6
ppm/°C
>1014
Ω-cm2/cm
9.2
εr
0.0003
δ @1MHz
 
 
Material Properties
Organic
Material Density
gm/cc
Hardness Flexural
Modulus
Ultimate
Tensile
Strength
Elongation
at Break
Water
Absorption
Thermal
Conductivity
@25°C
CTE
Coefficient
Thermal
Expansion
Volume
Resistivity
Dielectric
Constant
Dk
Melt
Temperature
PEEK
Strands
1.3
g/cc
>84
Shore D
3.6-4.0
GPa
100
MPa
40-45% 0.1-0.45% 0.30
W/mk
45
ppm/°C
>1016
Ω-cm
3.1
εr
343 °C
PTFE
Strands
2.2
g/cc
50-65
Shore D
0.5-0.6
GPa
21-35
MPa
200-500% 0.01% <0.30
W/mk
100
ppm/°C
<1018
Ω-cm
2.1
εr
326°C
 
 
Material Properties
Heatsinks
Material Density
gm/cc
Specific
Heat
Flexural
Strength
Young's
Modulus
Shear
Modulus
Thermal
Conductivity
@25°C
CTE
Coefficient
Thermal
Expansion
20~150°C
Electrical
Resistance
Al-SiC
37% Aluminum
Alloy A356.2
63% Silicon Carbide
3.01
g/cc
0.741
J/gK @25°C
488
MPa
188
GPa
76
GPa
200
W/mk Typical
8.4
ppm/°C
20.7
µΩ-cm
 
Ambient temperature is ~25 °C.
Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature.
CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C.
Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa)
Data is for information only and is not guaranteed for accuracy.
 
 
 
Specific Heat
Various Materials
Material Water
@ 25°
Ice
@ 0°
Air Aluminum
Al
Titanium
Ti
Nickel
Ni
Copper
Cu
Silver
Ag
Tin
Sn
Tungsten
W
Lead
Pb
Gold
Au
J/g°C 4.1813 2.010 1.012 0.897 0.523 0.440 0.385 0.233 0.227 0.134 0.129 0.129
 
Ambient temperature is ~25 °C.
Specific Heat is the heat required to raise the temperature of the unit mass of a given substance by a given amount (usually one degree).
Data is for information only and is not guaranteed for accuracy.
 
 
 
Solder Paste
Particle Size

80% Minimum Between:
Unit of
Measurement
T3 T4 T5 T6 T7 T8
Microns 20~45 µm 20~38 µm 10~25 µm 5~15 µm 2~11 µm 2~8 µm
MILS 0.8~1.8 Mils 0.8~1.5 Mils 0.4~1.0 Mils 0.2~0.6 Mils 0.08~0.4 Mils 0.08~0.3 Mils
Mesh size
Lines-per-inch
-325 / +500 -400 / +635 -500 / +635 -635 TBA TBA
 
Solder pastes are classified based on the particle size by IPC standard J-STD 005.
The table above shows the classification type of a paste compared with the mesh size and particle size.
A minimum of 4 to 5 solder paste particles should span the width of the stencil aperature.
Data is for information only and is not guaranteed for accuracy.
 
 
Flux Designation System
 
 
BL - Beaking Load & Tensile Strength
Round Wire
Material Temper Diameter
µm
Diameter
mils
UTS
KSI
BL
Gram Force
C172
BeCu
Soft 25 µm 1.0 mil 85 KSI 30 gf
38 µm 1.5 mil 85 KSI 68 gf
50 µm 2.0 mil 85 KSI 121 gf
Hard 25 µm 1.0 mil 212.5 KSI 75 gf
38 µm 1.5 mil 212.5 KSI 170 gf
50 µm 2.0 mil 212.5 KSI 302 gf
Cu98-Pd2.0
PCC
Soft 25 µm 1.0 mil 31 KSI 10 gf
38 µm 1.5 mil 31 KSI 25 gf
50 µm 2.0 mil 31 KSI 44 gf
70 µm 2.7 mil 31 KSI 89 gf
Ambient temperature 20 °C.
UTS = Ultimate Tensile Strength.   •   1.0 KSI = 6.9 MPa
BeCu = Beryllium Copper.
Data is for information only and is not guaranteed for accuracy.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
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