CCGA Material Properties   Catalog   •   CCGA Packages   •   CCGA Library   •   Attachment Tools   •   DC Resistance   •   Cryogenic   COPPER (Cu) Material Properties   Alloy Solidus Liquidus Density gm/cm3 Young's Modulus of Elasticity Electrical Conductivity 1.72µohms-cm % of IACS Thermal Conductivity W•m-1•K-1 CTE Coefficient Thermal Expansion Tensile Strength Copper CDA101 OFHC-101 1083°C 1083°C 8.94 115 GPa 60 μΩ m 400 W/m-°K 17ppm/°C 221 MPa Copper CDA14410 Cu99.9 Sn0.1~0.2 EFTEC-3 1083°C 1083°C 8.94 120 GPa 60 μΩ m 360 W/m-°K 17.3ppm/°C 255 MPa Copper C194 CuFe2P EFTEC-194W Cu97.4/Fe2.4/Zn0.13/P0.04 1088°C 1088°C 8.80 121 GPa 65 μΩ m 260 W/m-°K 17.4ppm/°C 221 MPa Beryllium Copper C172 Hard Temper TD05 Alloy 25 Cu98/Be1.8/Co0.2 865°C 980°C 8.30 131 GPa 23 μΩ m @20° 105 W/m-°K ---- @200° 130W/m-°K 17.8ppm/°C 560 MPa     LEAD (Pb) Material Properties   Alloy Solidus Liquidus Density gm/cm3 Young's Modulus of Elasticity Electrical Conductivity 1.72µohms-cm % of IACS Thermal Conductivity W•m-1•K-1 CTE Coefficient Thermal Expansion Tensile Strength  High Lead Pb95/Sn5 Solder UNS L54320 308°C 312°C 11.0 20 GPa 8.8 36 W/m-°K 28.7ppm/°C 28.5 MPa Pb93.5/Sn5/Ag1.5 Solder HMP 296°C 301°C 10.8 19.5 GPa 8.7 36 W/m-°K 28.7ppm/°C 29.6 MPa Pb90/Sn10 Solder UNS L54520 275°C 302°C 10.7 19 GPa 8.2 36 W/m-°K 27.9ppm/°C 30 MPa Pb85/Sn15 Solder 226°C 290°C 10.5 19.5 GPa 8.5 36.5 W/m-°K 27.0ppm/°C 32 MPa Pb80/Sn20 Solder UNS L54711 183°C 280°C 10.2 20 GPa 8.7 37 W/m-°K 26.5ppm/°C 33 MPa Pb75/Sn25 Solder   183°C 271°C 9.96 20.5 GPa 9.0 38 W/m-°K 26.2ppm/°C 33.5 MPa Pb70/Sn30 Solder UNS L54280 183°C 257°C 9.7 21 GPa 9.3 41 W/m-°K 26.0ppm/°C 34 MPa   Eutectic and Near Eutectic Sn60/Pb40 Solder 183°C 186°C 8.5 30 GPa 11.5 50 W/m-°K 23.9ppm/°C 52 MPa Sn63/Pb37 Solder 183°C 183°C 8.4 30 GPa 11.9 51 W/m-°K 24.0ppm/°C 52 MPa Sn62/Pb36/Ag2 Solder 179°C 179°C 8.44 23 GPa 11.5 49 W/m-°K 27.0ppm/°C xx MPa     LEAD FREE (Pb-Free) Material Properties   Alloy Solidus Liquidus Density gm/cm3 Young's Modulus of Elasticity Electrical Conductivity 1.72µohms-cm % of IACS Thermal Conductivity W•m-1•K-1 CTE Coefficient Thermal Expansion Tensile Strength Lead Free (Tin-Sn) Sn96.5/Ag3.0/Cu0.5 SAC305 217°C 218°C 7.4 51 Gpa 16.6 59 W/m-°K 21.0ppm/°C 50 Mpa Sn96.5/Ag3.5 Sn96 221°C 221°C 7.5 51 Gpa 0.0000104 ohm-cm Electrical Resistivity 59 W/m-°K 21.6ppm/°C 32 Mpa Sn99.9/Cu.7/Ni.05/Ge.009 SN100C 227°C 227°C 7.4 __ Gpa _____ ohm-cm Electrical Resistivity 59 W/m-°K 21.6ppm/°C __ Mpa Sn96.5/Cu3.0/Ni0.5 SCN305 228°C 394°C 7.3 ~48 Gpa ~13.0 ~50W/m-°K 22.0ppm/°C 40~60 MPa Sn90/Sb10 245°C 266°C 7.24 ~50 Gpa 0.0000161 ohm-cm Electrical Resistivity 49 W/m-°K 27.0ppm/°C 42 MPa Sn91.5/Sb8.5 235°C 243°C 7.3 - 0.0000145 ohm-cm Electrical Resistivity 58 W/m-°K 20.0ppm/°C 40~50 MPa Sn95/Sb5 UNS L13950 236°C 240°C 7.25 48 Gpa 0.0000145 ohm-cm Electrical Resistivity 57 W/m-°K 27.0ppm/°C 41 MPa Sn96.5/Cu.8/Ag.7/Bi2 208°C 215°C __ __ Gpa __ __ W/m-°K __ppm/°C __ MPa Sn90/Ag3.5/Bi0.5/In6.0 202°C 210°C 7.4 53 Gpa 15.1 51.2 W/m-°K 25.5ppm/°C 47 MPa Sn62/Bi37/0.5Cu/1.0Sb Tin-Bismuth 139°C 174°C 8.1 47 GPa 5.9 30 W/m-°C 22.0ppm/°C 99 MPa   Lead Free (Non-Tin) Au80-Sn20 Eutectic Solder 280°C 280°C 14.7 68 GPa 16.4 57 W/m-°K 16.0ppm/°C 275 MPa Ag100 Silver 960°C 960°C 10.5 71 Gpa 6 x 105Ohm*m 418 W/m-°K 20.6ppm/°C 125 Mpa Flux Designation System Notes: Ambient temperature is ~25 °C. Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature. CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C. Liquidus is the lowest temperature which an alloy is completely liquid. Solidus is the highest temperature at which an alloy is completely solid. Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa) Data is for information only and is not guaranteed for accuracy. Reference:Wikipedia Young's Modulus Conversion: GPa to PSI       Material Properties Metal Alloy Melting Point Liquidus Solidus Thermal Conductivity @ 25°C CTE Coefficient Thermal Expansion Electrical Resistance Specific Gravity Alloy 42 1435°C 10.5 W/m-°K 5.0ppm/°C 72*10-6 Ω-cm 8.1 g/cc Kovar 1450°C 16.7 W/m-°K 5.9ppm/°C 49*10-6 Ω-cm 8.4 g/cc Alloy C194 Copper 1085°C 260 W/m-°K 17.6ppm/°C 20~300°C 2.87*10-6 Ω-cm 8.9 g/cc Tungsten (W) 3422°C 173 W/m-°K 4.5ppm/°C 5.5*10-6 Ω-cm 19.3 g/cc Molybdenum 2623°C 138 W/m-°K 5.1ppm/°C 5.2*10-6 Ω-cm 10.2 g/cc   Notes: Ambient temperature is ~25 °C. Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature. CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C. Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa) Data is for information only and is not guaranteed for accuracy.       Material Properties Substrates Material Density gm/cc Hardness Flexural Strength Young's Modulus Shear Modulus Surface Finish Thermal Conductivity @25°C CTE Coefficient Thermal Expansion Volume Resistivity Dielectric Constant Dk Dissipation Factor Df HTCC Ceramic 92% Alumina Al2O3 3.62 g/cc 1027 Kg/mm2 443 MPa 275 GPa 112 GPa <1.14 µm 20.3 W/mk 6.6 ppm/°C >1014 Ω-cm2/cm 9.2 εr 0.0003 δ @1MHz     Material Properties Organic Material Density gm/cc Hardness Flexural Modulus Ultimate Tensile Strength Elongation at Break Water Absorption Thermal Conductivity @25°C CTE Coefficient Thermal Expansion Volume Resistivity Dielectric Constant Dk Melt Temperature PEEK Strands 1.3 g/cc >84 Shore D 3.6-4.0 GPa 100 MPa 40-45% 0.1-0.45% 0.30 W/mk 45 ppm/°C >1016 Ω-cm 3.1 εr 343 °C PTFE Strands 2.2 g/cc 50-65 Shore D 0.5-0.6 GPa 21-35 MPa 200-500% 0.01% <0.30 W/mk 100 ppm/°C <1018 Ω-cm 2.1 εr 326°C     Material Properties Heatsinks Material Density gm/cc Specific Heat Flexural Strength Young's Modulus Shear Modulus Thermal Conductivity @25°C CTE Coefficient Thermal Expansion 20~150°C Electrical Resistance Al-SiC 37% Aluminum Alloy A356.2 63% Silicon Carbide 3.01 g/cc 0.741 J/gK @25°C 488 MPa 188 GPa 76 GPa 200 W/mk Typical 8.4 ppm/°C 20.7 µΩ-cm   Ambient temperature is ~25 °C. Coefficient of thermal expansion is defined as the fractional increase in the length per unit rise in temperature. CTE units may be expressed in units of: µm/m/°C or ppm/°C or µ-inch/in/°C. Metric Units of GPa are gigapascals (109Pa)   •   Metric Units of MPa are megapascals (106Pa) Data is for information only and is not guaranteed for accuracy.       Specific Heat Various Materials Material Water @ 25° Ice @ 0° Air Aluminum Al Titanium Ti Nickel Ni Copper Cu Silver Ag Tin Sn Tungsten W Lead Pb Gold Au J/g°C 4.1813 2.010 1.012 0.897 0.523 0.440 0.385 0.233 0.227 0.134 0.129 0.129   Ambient temperature is ~25 °C. Specific Heat is the heat required to raise the temperature of the unit mass of a given substance by a given amount (usually one degree). Data is for information only and is not guaranteed for accuracy.       Solder Paste Particle Size 80% Minimum Between: Unit of Measurement T3 T4 T5 T6 T7 T8 Microns 20~45 µm 20~38 µm 10~25 µm 5~15 µm 2~11 µm 2~8 µm MILS 0.8~1.8 Mils 0.8~1.5 Mils 0.4~1.0 Mils 0.2~0.6 Mils 0.08~0.4 Mils 0.08~0.3 Mils Mesh size Lines-per-inch -325 / +500 -400 / +635 -500 / +635 -635 TBA TBA   Solder pastes are classified based on the particle size by IPC standard J-STD 005. The table above shows the classification type of a paste compared with the mesh size and particle size. A minimum of 4 to 5 solder paste particles should span the width of the stencil aperature. Data is for information only and is not guaranteed for accuracy.     Flux Designation System     BL - Beaking Load & Tensile Strength Round Wire Material Temper Diameter µm Diameter mils UTS KSI BL Gram Force C172 BeCu Soft 25 µm 1.0 mil 85 KSI 30 gf 38 µm 1.5 mil 85 KSI 68 gf 50 µm 2.0 mil 85 KSI 121 gf Hard 25 µm 1.0 mil 212.5 KSI 75 gf 38 µm 1.5 mil 212.5 KSI 170 gf 50 µm 2.0 mil 212.5 KSI 302 gf Cu98-Pd2.0 PCC Soft 25 µm 1.0 mil 31 KSI 10 gf 38 µm 1.5 mil 31 KSI 25 gf 50 µm 2.0 mil 31 KSI 44 gf 70 µm 2.7 mil 31 KSI 89 gf Ambient temperature 20 °C. UTS = Ultimate Tensile Strength.   •   1.0 KSI = 6.9 MPa BeCu = Beryllium Copper. Data is for information only and is not guaranteed for accuracy.                  WARNING - THIS PRODUCT CONTAINS LEAD Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.   California Regulatory Information California State Proposition 65 WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)   Download Solidworks® e-Drawing viewer to enjoy 360° rotatable models. Download   TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 Email: sales@topline.tv ©2023 TopLine. All Rights Reserved. Home