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Fig.1
Pb90/Sn10
Plain Column

Click Photo
Fig.2
Pb80/Sn20
Column with Cu wrap

Click Photo 1 • 2 • 3
Fig.3
NASA Invented
Micro Coil Spring

Click for details
Fig.4
Copper Pillar

Click for details
Fig.5
Cu Braided Column
U.S. Patent 10,477,698 
Click Photo 1 • 2 • 3  •  About
 
About Columns  •   MIL-STD-883L 3.3.6   •   Pull Stength: MIL-STD-883K TM2038
TopLine offers a wide range solder columns to meet your needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20. We wind copper ribbon around the columns to increase reliability. After winding, the column is coated with Sn63/Pb37 hot solder. We can provide columns with a variety of diameters and lengths using different solder cores and copper ribbon thicknesses. We stock solder core materials from 0.20~0.89mm (8~35mils) and copper ribbon thickness from 0.0127~0.038mm (0.5 ~ 1.5mils). We can provide custom size columns to meet your project requirements. The tables below are just a small example of the column sizes we offer. Contact TopLine to discuss your specific needs.
 
Copper Wrap Columns
TopLine offers copper wrapped columns with Tin-Lead as well as Lead Free solder cores. Contact TopLine to discuss your specific needs.
 
Why Columns?
Solder columns are 10x more reliable that solder balls when attaching large size ceramic IC packages to FR4 or polyimide PC Boards operating in harsh environments. The large CTE (Coefficient of Thermal Expansion) mismatch of ceramic puts stress on the interconnections (I/O) over wide temperature cycles. The CTE of a ceramic alumina Al2O3 IC package is about 6.5ppm/°C. The CTE of organic boards, such as Polyimide or FR4 is roughly 16.5ppm/°C. Therefore, the amount of CTE mismatch between ceramic materials and organic boards is roughly 10ppm/°C. The corners of a large 50x50mm ceramic package might twist as much as ±70µm (±2.7mils) over temperature swings of 100°C. Eventually, the connections between the ceramic IC and the mother board will break over time enduring thousands of temperature cycles. Solder columns are flexible and absorb CTE mismatch, thereby lengthening the life of the circuit.
 
Plain Pb90/Sn10 Traditional Columns
Fig. Alloy Column
Ø  Diameter
±0.025mm
Column
Length
±0.050mm
CCGA
Pitch
Copper
Cu Ribbon
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 1
Pb90/Sn10
"U" Unplated
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
1.0mm~
1.27mm
None CG9010U20x87 902087   360 ° Model
2.31mm
(0.091")
1.0mm~
1.27mm
None CG9010U20x91 902091   360 ° Model
2.54mm
(0.100")
1.0mm~
1.27mm
None CG9010U20x100 902099   360 ° Model
Ø 0.20mm
(Ø 0.008")
1.0mm
(0.040")
0.50mm None CG9010U8x40 900840   360 ° Model
Ø 0.25mm
(Ø 0.010")
1.27mm
(0.050")
0.50mm None CG9010U10x50 901050   360 ° Model
Ø 0.30mm
(Ø 0.012")
1.50mm
(0.060")
0.80mm None CG9010U12x60 901260   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.21mm
(0.087")
1.0mm None CG9010U15x87 901587   360 ° Model
Ø All All All None CG9010 Series 900001   360 ° Model
_______________________
Note 1: Contact TopLine for other Diameter and Length available, including Copper Wrap Pb90/Sn10 columns.
Note 2: Pb90/Sn10 columns are RoHS compliant based on an exemption for high melting temperature solder.
Note 3: Reference two types of Pb90/Sn10 columns made by IBM CAST and WIRE.
Note 4: Example new packaging in SMT Carrier Tape for pick and place mounting machine. Carrier Tape.
 
 
Copper Wrapped Pb80/Sn20 Columns   •   Size Parameter
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb80/Sn20
"C" Plating
Ø 0.30mm
(Ø 0.012")
1.27mm
(0.050")
Pitch 0.8~1.0mm
Plastic BGA/LGA
Pad Ø 0.40~0.45mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1 mil)
CG8020C12x50 801250   360 ° Model
1.52mm
(0.060")
CG8020C12x60 801260   360 ° Model
1.78mm
(0.070")
CG8020C12x70 801270   360 ° Model
2.21mm
(0.087")
CG8020C12x87 801287   360 ° Model
2.31mm
(0.091")
CG8020C12x91 801291   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.21mm
(0.087")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1 mil)
CG8020C15x87 801587   360 ° Model
2.31mm
(0.091")
CG8020C15x91 801591   360 ° Model
2.41mm
(0.095")
CG8020C15x95 801595   360 ° Model
2.54mm
(0.100")
CG8020C15x100 801599   360 ° Model
3.81mm
(0.150")
CG8020C15x150 801597   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
Pitch 1.0mm~
1.27mm

Ceramic CCGA
Pad Ø 0.80mm
Ø 0.40mm
(Ø 0.0160")
0.038mm
(1.5 mil)
CG8020C20x87 802087   360 ° Model
2.31mm
(0.091")
CG8020C20x91 802091   360 ° Model
2.41mm
(0.095")
CG8020C20x95 802095   360 ° Model
2.54mm
(0.100")
CG8020C20x100 802099   360 ° Model
3.51mm
(0.138")
CG8020C20x138 802092   360 ° Model
3.70mm
(0.145")
CG8020C20x145 802096   360 ° Model
Ø 0.56mm
(Ø 0.022")
2.21mm
(0.087")
Pitch 1.27mm

Ceramic CCGA
Pad Ø 0.86mm
Ø 0.45mm
(Ø 0.0160")
0.038mm
(1.5 mil)
CG8020C22x87 802287   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
 
 
NASA Invented Micro-coil Spring
Fig. Alloy Spring
Ø Diameter
±0.025mm
Free
Length
±0.050mm
CCGA
Pitch
Plating Wire
ØDia
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 3
Micro-Coil
BeCu
C17200
Alloy 25
Ø 0.406mm
(Ø 0.016")
1.0mm
(0.040")
1.0mm
Plastic BGA/LGA
Sn60/Pb40 0.0635mm
(Ø 0.0025")
MCS172P16x40 171640   360 ° Model
Ø 0.51mm
(Ø 0.020")
1.27mm
(0.050")
1.0~1.27mm
Standard
Ceramic CCGA
Sn60/Pb40 0.086mm
(Ø 0.0034")
MCS172P20x50 172050   360 ° Model
Ø 0.51mm
(Ø 0.020")
1.27mm
(0.050")
1.0~1.27mm
Lead Free
Ni 30~60 µ-inch
(0.76~1.5µm)
__________
Au 10 µ-inch
(0.25µm)
0.086mm
(Ø 0.0034")
MCS172G20x50 192050   360 ° Model
Note: Contact TopLine for ØDiameter and Length available.
 
 
Copper Wrapped Pb90/Sn10 Columns NEW
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb90/Sn10
"C" Plating
Ø 0.30mm
(Ø 0.012")
2.31mm
(0.091")
Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG9010C12x91 911291   360 ° Model
Ø 0.30mm
(Ø 0.012")
2.54mm
(0.100")
Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG9010C12x100 911299   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG9010C15x91 911591   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.54mm
(0.100")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG9010C15x100 911599   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x91 912091   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.54mm
(0.100")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x100 912099   360 ° Model
Ø 0.51mm
(Ø 0.020")
3.81mm
(0.150")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x150 912097   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
Copper wrapped Pb90/Sn10 provides wider process window for secondary assembly to PWB board.
 
 
Copper Column (Cu Pillar)
Fig. Alloy Column
Ø  Diameter
±0.03mm
Column
Length
±0.05mm
Plating
Coating
AWG
Nearest
Equivalent
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 4
CDA101
Copper Alloy
OFE - OFHC

P Plating
Tin-Lead
Sn60/Pb40
Thick 3~5um

(100~200 microinch)

F Plating
Palladium Coated
Ni/Pd/Au
RoHS


G Plating
Ni-Gold Coated
Ni/Au
RoHS


U Unplated
Bare Copper
RoHS
Ø 0.20mm
(Ø 0.008")
0.508mm
(0.020")
NiAu AWG 32 CU101G8x20 620820   360 ° Model
Ø 0.20mm
(Ø 0.008")
1.0mm
(0.040")
Sn60/Pb40 AWG 32 CU101P8x40 300840   360 ° Model
Ø 0.20mm
(Ø 0.008")
2.21mm
(0.087")
Sn60/Pb40 AWG 32 CU101P8x87 300887   360 ° Model
Ø 0.25mm
(Ø 0.010")
0.508mm
(0.020")
NiAu AWG 30 CU101G10x20 621020   360 ° Model
Ø 0.25mm
(Ø 0.010")
2.21mm
(0.087")
Sn60/Pb40 AWG 30 CU101P10x87 301087   360 ° Model
Ø 0.32mm
(Ø 0.0126")
1.75mm
(0.069")
NiAu AWG 28 CU101G12x69 621269   360 ° Model
Ø 0.32mm
(Ø 0.0126")
2.21mm
(0.087")
Sn60/Pb40 AWG 28 CU101P12x87 301287   360 ° Model
Ø 0.36mm
(Ø 0.014")
2.21mm
(0.087")
Sn60/Pb40 AWG 27 CU101P14x87 301487   360 ° Model
Ø 0.40mm
(Ø 0.016")
1.60mm
(0.063")
Sn60/Pb40 AWG 26 CU101P16x63 301663   360 ° Model
Ø 0.40mm
(Ø 0.016")
2.21mm
(0.087")
NiAu AWG 26 CU101G16x87 621687   360 ° Model
Ø 0.40mm
(Ø 0.016")
2.21mm
(0.087")
Sn60/Pb40 AWG 26 CU101P16x87 301687   360 ° Model
Ø 0.45mm
(Ø 0.018")
0.80mm
(0.031")
Bare AWG 25 CU101U18x31 401831   360 ° Model
Ø 0.45mm
(Ø 0.018")
1.27mm
(0.050")
Sn60/Pb40 AWG 25 CU101P18x50 301850   360 ° Model
Ø 0.45mm
(Ø 0.018")
1.27mm
(0.050")
Bare AWG 25 CU101U18x50 401850   360 ° Model
Ø 0.45mm
(Ø 0.018")
2.21mm
(0.087")
NiAu AWG 25 CU101G18x87 621887   360 ° Model
Ø 0.45mm
(Ø 0.018")
2.21mm
(0.087")
Sn60/Pb40 AWG 25 CU101P18x87 301887   360 ° Model
Ø 0.50mm
(Ø 0.020")
2.21mm
(0.087")
Sn60/Pb40 AWG 24 CU101P20x87 302087   360 ° Model
Ø 0.50mm
(Ø 0.020")
2.31mm
(0.091")
Sn60/Pb40 AWG 24 CU101P20x91 302091   360 ° Model
Ø 0.50mm
(Ø 0.020")
2.54mm
(0.100")
Sn60/Pb40 AWG 24 CU101P20x100 302091   360 ° Model
Ø 0.75mm
(Ø 0.030")
1.85mm
(0.073")
Sn60/Pb40 AWG 21 CU101P30x73 303073   360 ° Model
Note: Contact TopLine for other ØDiameter (0.10~0.50mm) and Length (0.25~3.5mm) available.
High frequency applications. Excellent thermal conductivity. Transfers heat from CCGA to ground layers in PCB.
 
 
Copper Braided Solder Columns U.S. PATENT 10,477,698   •   More About
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Core
Material
Solder
Core
Ø Diameter
Copper
Cu
Ø Diameter
Copper
Nbr
Strands
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 5
Copper
Braided Column
Lead Free
and Tin-Lead
Ø 0.35mm
(Ø 0.014")
2.21mm
(0.087")
Lead Free
SAC305 Core
Ø 0.20mm
(Ø 0.008")
0.038mm
(1.5 mil)
16X BC305H14x87 361487   360 ° Model
High Temp
Pb80/Sn20 Core
Ø 0.20mm
(Ø 0.008")
0.038mm
(1.5 mil)
16X BC8020B14x87 881487
High Temp
Pb90/Sn10 Core
Ø 0.20mm
(Ø 0.008")
0.038mm
(1.5 mil)
16X BC9010B14x87 781487
High Temp
Pb90/Sn10 Core
Ø 0.20mm
(Ø 0.008")
0.038mm
(1.5 mil)
32X BC9010D14x87 791487
Ø 0.40mm
(Ø 0.016")
2.21mm
(0.087")
Lead Free
SAC305 Core
Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC305H16x87 361687   360 ° Model
High Temp
Pb80/Sn20 Core
Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC8020B16x87 881687
High Temp
Pb90/Sn10 Core
Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
16X BC9010B16x87 781687
High Temp
Pb90/Sn10 Core
Ø 0.25mm
(Ø 0.010")
0.038mm
(1.5 mil)
32X BC9010D16x87 791687
Ø 0.50mm
(Ø 0.020")
2.21mm
(0.087")
Lead Free
SAC305 Core
Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC305H20x87 362087   360 ° Model
High Temp
Pb80/Sn20 Core
Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC8020B20x87 882087
High Temp
Pb90/Sn10 Core
Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC9010B20x87 782087
High Temp
HPM Pb93/Sn5/Ag1.5
Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
16X BC935B20x87 742087
High Temp
Pb90/Sn10 Core
Ø 0.35mm
(Ø 0.014")
0.038mm
(1.5 mil)
32X BC9010D20x87 792087
Note: Contact TopLine for other ØDiameter and Length available up to 3.8mm Long.
Benefits of New Copper Braided Solder Column:
1. Eutectic Sn63/Pb37 and SAC305 Braided Columns attach by using Tacky Flux. Benefit: Smaller size and lighter package.
2. The Exoskeleton Copper Sleeve heat pipe conducts heat from underside of chip. Benefit: Smaller size and lighter package.
3. Small diameter Braided Columns attach to fine-pitch devices. Benefit: Smaller size and lighter package.
4. Solder paste forms standard fillet on Pb80 or Pb90 and HMP core Braided Columns. Benefit: Drop-in replacement for Copper Wrap Package.
 
 
AWG Size Chart (Reference Only)
AWG
Gauge
Mil Inch Micron
μm
Millimeter
mm
AWG 21 28.5 mil 0.0285" 723um 0.72mm
AWG 24 20 mil 0.020" 500um 0.50mm
AWG 25 18 mil 0.018" 450um 0.45mm
AWG 26 16 mil 0.016" 400um 0.40mm
AWG 27 14 mil 0.014" 360um 0.36mm
AWG 28 12.5 mil 0.0125" 320um 0.32mm
AWG 30 10 mil 0.010" 250um 0.25mm
AWG 32 8 mil 0.008" 200um 0.20mm
AWG 34 6 mil 0.006" 150um 0.15mm
AWG 36 5 mil 0.005" 125um 0.125mm
AWG 38 4 mil 0.004" 100um 0.10mm
AWG 40 3 mil 0.003" 80um 0.08mm
AWG 41 2.8 mil 0.0028" 70um 0.07mm
AWG 42 2.5 mil 0.0025" 60um 0.06mm
AWG 44 2.0 mil 0.0020" 50um 0.05mm
AWG 46 1.6 mil 0.0016" 40um 0.04mm
AWG 47 1.4 mil 0.0014" 35um 0.035mm
AWG 48 1.25 mil 0.00125" 32um 0.032mm
AWG 49 1.1 mil 0.0011" 28um 0.028mm
AWG 50 1.0 mil 0.0010" 25um 0.025mm
Note 1: Sizes listed in table are rounded (up or down) for simplicity and are not guaranteed for accuracy.
Note 2: Refer to ASTM standard B258 for accurate dimensions.
Note 3: AWG is the American Wire Gauge developed in 1857, predominantly for use in North America for electrically conducting wire.
Note 3: Tanaka wire is made to the metric standard.
 
 
 
Solidworks® e-Drawings software to view rotatable:    Download
 
 
Outline Drawing
Fig. 1   Fig. 2
 
Pb90/Sn10
Solder Column


Click Photo
  Pb80/Sn20 Traditional
Pb85/Sn15 New
Pb90/Sn10 New
Solder Column with Cu Wrap

Click Photo to see Sn63/Pb37 coating over the column
Click Photo
 
 
 
Column Part Number System
 
    CG         8020         C         20         X         87         Option    
Column Type Core Alloy Coating Ø Diameter
Mils
Packaging Length
Mils
  Option
CG = Solder Column

MCS = Micro Coil Spring

BC = Braided Column

CC = Copper Core Column

CU = Copper Pillar Column

AU = Gold (Au) Column
Solder Core:
8020 = Pb80/Sn20

8515 = Pb85/Sn15

9010 = Pb90/Sn10

965 = Sn96.5/Cu3.0/Ni0.5
SCN305 (RoHS)


Metal Core:
101 = Copper Cu (4N)
CDA101 - OFHC

172 = BeCu Micro-coil
C17200

 4  = Pure Au Gold 4N



Braided Column:
U.S. Patent 10,477,698

Tin-Lead Core
63 = Sn63/Pb37 (Eutectic)
8020 = Pb80/Sn20 (Hi Lead)
9010 = Pb90/Sn10 (Hi Lead)
935 = Pb93.5/Sn5/Ag1.5 (HMP)

Lead Free (RoHS) Core
305 = Sn96.5/Ag3.0/Cu 0.5 (SAC305)
965 = Sn96.5/Cu3.0/Ni0.5 (SCN305)
Column Cu Wrap(CG)
C = Sn63/Pb37 (Tin-Lead)
T = Sn96.5/Cu0.8/Ag0.7/Bi2.0 (RoHS)

Plain Column(CG)
U = Unplated - Bare



Micro-coil Spring (MCS)
P = Sn60/Pb40
G = Ni/Au (RoHS)



Cu Pillar/Column (CU)
P = Sn60/Pb40
F = NiPdAu (RoHS)
G = NiAu (RoHS)
T = Sn100 (RoHS)
U = Unplated (RoHS)


Copper Core Column (CC)
A = Pb90/Sn10 Ribbon
K = SCN305 Ribbon (RoHS)
Sn96.5/Cu0.8/Ag0.7/Bi2.0 Coated



Gold Column (AU)
N = Unplated (RoHS)



Braided Column (BC)
Tin-Lead
D = Sn63/Pb37 32*Cu
B = Sn63/Pb37 16*Cu
L = Sn63/Pb37 8*Cu

Lead-Free (RoHS)
R = SAC 32*Cu
H = SAC 16*Cu
J = SAC 8*Cu

W = Coreless 16*Cu
Y = Coreless 8*Cu
Solder Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
10 = 0.25mm
11 = 0.28mm
12 = 0.30mm
13 = 0.33mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
20 = 0.50mm
22 = 0.56mm
35 = 0.89mm


Micro Coil Spring
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm


Copper Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
9 = 0.23mm
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm
30 = 0.75mm


Gold Column
6 = 0.15mm
8 = 0.20mm
10 = 0.25mm
X = Jar


Special:
J = JEDEC Tray
T = 4" Tray
W = 2" Tray
E = Tape & Reel
Solder Column
25 = 0.63mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
100 = 2.54mm
138 = 3.51mm
150 = 3.81mm


Micro Coil Spring
25 = 0.65mm
30 = 0.75mm
33 = 0.85mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm


Copper Columns
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
73 = 1.85mm
87 = 2.21mm


Gold Columns
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
87 = 2.21mm

Other Lengths Available
  Blank=Standard
N2 Nitrogen
 
 
Column DP# Order Number
 
    8         20         87         0    
Column Type Ø Diameter
Mils
Length
Mils
Package
Quantity
Pb80/Sn20 Solder Column (CG):
8 = Cu Wrap + Sn63/Pb37 (C)


Pb90/Sn10 Solder Column (CG):
9 = Unplated Plain Column (U)
0 = Cu Wrap Ribbon + Sn63/Pb37 (C)
7 = Cu Braided + Sn63/Pb37 (D)


SCN305 Braided Column (BC):
5 = Cu Braid + SCN305 (K)
RoHS Lead Free
U.S. Patent 10,477,698


Micro-Coil Spring (MCS):
1 =   Be-Cu C17200  Plated Sn60/Pb40 (P)
2 =   Be-Cu C17200  Plated Ni/Au Gold (G) RoHS


Copper Pillar Columns (CU):
3 = Cu Column Plated Sn60/Pb40 (P)
4 = Cu Column Unplated (U) RoHS
6 = Cu Column Plated NiAu (G) RoHS
Columns Under Development:
7 = Cu Braided Column + Sn63/Pb37 (D)
Code • Diameter • Pitch
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 1.0mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
30 = Ø0.75mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)

Code   •  Length
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
99 = 2.54mm
95 = 2.41mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm


Other Lengths Available


WIP
00 = 8"
12 = 12"
14 = 14"
Code   •  Qty
0 = Jar 100pcs
1 = Jar 1Kpcs
2 = Jar 5Kpcs
3 = Jar 10Kpcs
7 = Reel 2500pcs
8 = Tray
9 = Bulk






WIP
0 = PLAIN
1 = WRAP
8 = DIP
9 = WAVE
 
 
Column Drawing Number
 
    80         20         87    
Column Type and Plating Ø Diameter
Mils
Length
Mils
COPPER WRAP COLUMN (CG)
    Tin-Lead   
80 = Pb80/Sn20 (C)
85 = Pb85/Sn15 (C)
91 = Pb90/Sn10 (C)

    Lead Free RoHS   
42 = Sn96.5/Cu3.0/Ni0.5 (T)



Plain Solder Column (CG)
Tin-Lead
90 = Pb90/Sn10 Unplated (U)



Micro Coil Spring (MCS)
17 = BeCu + Sn60/Pb40 (P)
19 = BeCu + Ni/Au RoHS (G)



Copper Column/Pillar (CU)
Tin-Lead    
30~32 = Cu Pillar + Sn60/Pb40 (P)

Lead Free:
40~42 = Cu Pillar Unplated (U) RoHS
61 = Cu Pillar Plated NiPdAu (F) RoHS
62 = Cu Pillar Plated NiAu (G) RoHS
69 = Cu Pillar Plated Sn100 (T) RoHS



Copper Core Solder Column (CU)
Tin-Lead
34 = Cu Core + Pb90/Sn10 Ribbon(A)

Lead Free:
33 = Cu Core + SCN305 Ribbon (K) RoHS



Pure Gold 4N Column/Pillar (AU)
20 = Au Pillar Unplated (U)



U.S. Patent 10,477,698
Copper Braided Column (BC)


Lead Free Core (RoHS)
10 = Coreless Lead Free 16*Cu (W)
11 = Coreless Lead Free 8*Cu (Y)

35 = SAC305 Lead Free 32*Cu (R)
36 = SAC305 Lead Free 16*Cu (H)
37 = SAC305 Lead Free  8*Cu (J)
38 = SCN305 Lead Free  8*Cu (J)
39 = SCN305 Lead Free 16*Cu (H)

Tin-Lead Core
70 = Pb80/Sn20 High Lead 16*Cu (B)
71 = Pb80/Sn20 High Lead 32*Cu (D)

72 = Pb90/Sn10 High Lead 32*Cu (D)
78 = Pb90/Sn10 High Lead 16*Cu (B)
73 = Pb90/Sn10 High Lead  8*Cu (L)

74 = Pb93.5/Sn5/Ag1.5 HMP 16*Cu (B)
75 = Pb93.5/Sn5/Ag1.5 HMP 32*Cu (D)

76 = Sn63/Pb37 Eutectic 16*Cu (B)
77 = Sn63/Pb37 Eutectic 32*Cu (D)
79 = Future                                .

RoHS Exempt
92 = Pb90/Sn10 High Lead 8*Cu (J)
93 = Pb90/Sn10 High Lead 16*Cu (H)

Application Specific (ASIC)
89 = Customer Specific Assigned number
  Diameter  
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 0.8mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
30 = Ø0.75mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)
  Length  
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
99 = 2.54mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm

Other Lengths Available
 
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
HS Code: 8311.30.3000 Lead-Tin Solders
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
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Milledgeville, GA 31061, USA
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