@CCGA2  Join CCGA
Packaging Group
CCGA
Material Properties
 
Catalog   •   What is?   •   CCGA Packages   •   Library   •   Video   •   Materials   •   CCGA PWB   •   MCS Micro-coil Spring   •   Tray   •   Attachment Tools   •   Pin-Pack
 
 
Column
Attachment

2 Minute Video
Fig.1
Pb90/Sn10
Plain Column

Click Photo
Fig.2
Pb80/Sn20
Column with Cu wrap

Click Photo 1 • 2 • 3
Fig.3
NASA Invented
Micro Coil Spring

Click for details
Fig.4
Copper Pillar

Click for details
 
About Columns
TopLine offers a wide range solder columns to meet your needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20. We wind copper ribbon around the columns to increase reliability. After winding, the column is coated with Sn63/Pb37 hot solder. We can provide columns with a variety of diameters and lengths using different solder cores and copper ribbon thicknesses. We stock solder core materials from 0.20~0.89mm (8~35mils) and copper ribbon thickness from 0.025~0.10mm (1 to 4mils). We can provide custom size columns to meet your project requirements. The tables below are just a small example of the column sizes we offer. Contact TopLine to discuss your specific needs.
 
Copper Wrap Columns
TopLine offers copper wrapped columns with Pb80/Sn20 as well as Pb90/Sn10 solder cores. Pb90/Sn10 has a wider process window during secondary reflow to the PC Board (PWB-Card). The liquidus/solidus temperature range of Pb80/Sn20 is more difficult to attach to PC boards. The liquidus/solidus temperature of Pb90/Sn10 is more forgiving during secondary operations while soldering and reworking.
 
Why Columns?
Solder columns are 10x more reliable that solder balls when attaching large size ceramic IC packages to FR4 or polyimide PC Boards operating in harsh environments. The large CTE (Coefficient of Thermal Expansion) mismatch of ceramic puts stress on the interconnections (I/O) over wide temperature cycles. The CTE of a ceramic alumina Al2O3 IC package is about 6.5ppm/°C. The CTE of organic boards, such as Polyimide or FR4 is roughly 16.5ppm/°C. Therefore, the amount of CTE mismatch between ceramic materials and organic boards is roughly 10ppm/°C. The corners of a large 50x50mm ceramic package might twist as much as ±70µm (±2.7mils) over temperature swings of 100°C. Eventually, the connections between the ceramic IC and the mother board will break over time enduring thousands of temperature cycles. Solder columns are flexible and absorb CTE mismatch, thereby lengthening the life of the circuit.
 
Plain Pb90/Sn10 Traditional Columns
Fig. Alloy Column
Ø  Diameter
±0.025mm
Column
Length
±0.050mm
CCGA
Pitch
Copper
Cu Ribbon
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 1
Pb90/Sn10
"U" Unplated
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
1.0mm~
1.27mm
None CG9010U20x87 902087   360 ° Model
2.31mm
(0.091")
1.0mm~
1.27mm
None CG9010U20x91 902091   360 ° Model
2.41mm
(0.095")
1.0mm~
1.27mm
None CG9010U20x95 902095   360 ° Model
2.54mm
(0.100")
1.0mm~
1.27mm
None CG9010U20x100 902099   360 ° Model
Ø 0.20mm
(Ø 0.008")
0.8mm
(0.031")
0.50mm None CG9010U8x31 900831   360 ° Model
Ø 0.20mm
(Ø 0.008")
1.0mm
(0.040")
0.50mm None CG9010U8x40 900840   360 ° Model
Ø 0.25mm
(Ø 0.010")
1.27mm
(0.050")
0.50mm None CG9010U10x50 901050   360 ° Model
Ø 0.30mm
(Ø 0.012")
1.50mm
(0.060")
0.80mm None CG9010U12x60 901260   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.21mm
(0.087")
1.0mm None CG9010U15x87 901587   360 ° Model
Ø All All All None CG9010 Series 900001   360 ° Model
_______________________
Note 1: Contact TopLine for other ØDiameter and Length available, including Copper Wrap Pb90/Sn10 columns.
Note 2: Pb90/Sn10 columns are RoHS compliant based on an exemption for high melting temperature solder.
 
 
Copper Wrapped Pb80/Sn20 Columns
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb80/Sn20
"C" Plating
Ø 0.30mm
(Ø 0.012")
1.27mm
(0.050")
Pitch 0.8~1.0mm
Plastic BGA/LGA
Pad Ø 0.40~0.45mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1 mil)
CG8020C12x50 801250   360 ° Model
1.52mm
(0.060")
CG8020C12x60 801260   360 ° Model
1.78mm
(0.070")
CG8020C12x70 801270   360 ° Model
2.21mm
(0.087")
CG8020C12x87 801287   360 ° Model
2.31mm
(0.091")
CG8020C12x91 801291   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.21mm
(0.087")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1 mil)
CG8020C15x87 801587   360 ° Model
2.31mm
(0.091")
CG8020C15x91 801591   360 ° Model
2.41mm
(0.095")
CG8020C15x95 801595   360 ° Model
2.54mm
(0.100")
CG8020C15x100 801599   360 ° Model
3.81mm
(0.150")
CG8020C15x150 801597   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.21mm
(0.087")
Pitch 1.0mm~
1.27mm

Ceramic CCGA
Pad Ø 0.80mm
Ø 0.40mm
(Ø 0.0160")
0.038mm
(1.5 mil)
CG8020C20x87 802087   360 ° Model
2.31mm
(0.091")
CG8020C20x91 802091   360 ° Model
2.41mm
(0.095")
CG8020C20x95 802095   360 ° Model
2.54mm
(0.100")
CG8020C20x100 802099   360 ° Model
3.51mm
(0.138")
CG8020C20x138 802092   360 ° Model
3.70mm
(0.145")
CG8020C20x145 802096   360 ° Model
Ø 0.56mm
(Ø 0.022")
2.21mm
(0.087")
Pitch 1.27mm

Ceramic CCGA
Pad Ø 0.86mm
Ø 0.45mm
(Ø 0.0160")
0.038mm
(1.5 mil)
CG8020C22x87 802287   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
 
 
NASA Invented Micro-coil Spring
Fig. Alloy Spring
Ø Diameter
±0.025mm
Free
Length
±0.050mm
CCGA
Pitch
Plating Wire
ØDia
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 3
Micro-Coil
BeCu
C17200
Alloy 25
Ø 0.406mm
(Ø 0.016")
1.0mm
(0.040")
1.0mm
Plastic BGA/LGA
Sn60/Pb40 0.0635mm
(Ø 0.0025")
MCS172P16x40 171640   360 ° Model
Ø 0.51mm
(Ø 0.020")
1.27mm
(0.050")
1.0~1.27mm
Standard
Ceramic CCGA
Sn60/Pb40 0.086mm
(Ø 0.0034")
MCS172P20x50 172050   360 ° Model
Ø 0.51mm
(Ø 0.020")
1.27mm
(0.050")
1.0~1.27mm
Lead Free
Ni 30~60 µ-inch
(0.76~1.5µm)
__________
Au 10 µ-inch
(0.25µm)
0.086mm
(Ø 0.0034")
MCS172G20x50 192050   360 ° Model
Note: Contact TopLine for ØDiameter and Length available.
 
 
Copper Wrapped Pb85/Sn15 Columns NEW
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb85/Sn15
"C" Plating
Ø 0.30mm
(Ø 0.012")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.45~0.51mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG8515C12x91 851291   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.53~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG8515C15x91 851591   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.70~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG8515C20x91 852091   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
 
 
Copper Wrapped Pb90/Sn10 Columns NEW
Fig. Alloy Column
Ø  Diameter
±0.05mm
Column
Length
±0.05mm
Pitch
Application
Solder
Core
ØDiameter
Copper
Cu Ribbon
Thickness
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2
Pb90/Sn10
"C" Plating
Ø 0.30mm
(Ø 0.012")
2.31mm
(0.091")
Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG9010C12x91 911291   360 ° Model
Ø 0.30mm
(Ø 0.012")
2.54mm
(0.100")
Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm
Ø 0.25mm
(Ø 0.010")
0.025mm
(1.0 mil)
CG9010C12x100 911299   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG9010C15x91 911591   360 ° Model
Ø 0.38mm
(Ø 0.015")
2.54mm
(0.100")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm
Ø 0.30mm
(Ø 0.012")
0.025mm
(1.0 mil)
CG9010C15x100 911599   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.31mm
(0.091")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x91 912091   360 ° Model
Ø 0.51mm
(Ø 0.020")
2.54mm
(0.100")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x100 912099   360 ° Model
Ø 0.51mm
(Ø 0.020")
3.81mm
(0.150")
Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.76~0.80mm
Ø 0.40mm
(Ø 0.016")
0.038mm
(1.5 mil)
CG9010C20x150 912097   360 ° Model
Note: Contact TopLine for other ØDiameter and Length available.
Copper wrapped Pb90/Sn10 provides wider process window for secondary assembly to PWB board.
 
 
Copper Column (Cu Pillar)
Fig. Alloy Column
Ø  Diameter
±0.03mm
Column
Length
±0.05mm
Plating
Coating
AWG
Nearest
Equivalent
Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 4
CDA101
Copper Alloy
OFE - OFHC

P Plating
Tin-Lead
Sn60/Pb40
Thick 3~5um

(100~200 microinch)

F Plating
Palladium Coated
Ni/Pd/Au
RoHS


U Unplated
Bare Copper
RoHS
Ø 0.10mm
(Ø 0.004")
1.0mm
(0.040")
Sn60/Pb40 AWG 38 CU101P4x40 300440   360 ° Model
Ø 0.127mm
(Ø 0.005")
1.0mm
(0.040")
Sn60/Pb40 AWG 36 CU101P5x40 300540   360 ° Model
Ø 0.127mm
(Ø 0.005")
1.27mm
(0.050")
Sn60/Pb40 AWG 36 CU101P5x50 300550   360 ° Model
Ø 0.15mm
(Ø 0.006")
1.50mm
(0.060")
Sn60/Pb40 AWG 34 CU101P6x60 300660   360 ° Model
Ø 020mm
(Ø 0.008")
1.0mm
(0.040")
Sn60/Pb40 AWG 32 CU101P8x40 300840   360 ° Model
Ø 0.20mm
(Ø 0.008")
2.21mm
(0.087")
Sn60/Pb40 AWG 32 CU101P8x87 300887   360 ° Model
Ø 0.25mm
(Ø 0.010")
2.21mm
(0.087")
Sn60/Pb40 AWG 30 CU101P10x87 301087   360 ° Model
Ø 0.30mm
(Ø 0.012")
0.53mm
(0.021")
NiPdAu AWG 28 CU110F12x21 601221   360 ° Model
Ø 0.32mm
(Ø 0.0126")
2.21mm
(0.087")
Sn60/Pb40 AWG 28 CU101P12x87 301287   360 ° Model
Ø 0.30mm
(Ø 0.012")
2.31mm
(0.091")
NiPdAu AWG 28 CU110F12x91 601291   360 ° Model
Ø 0.35mm
(Ø 0.014")
1.27mm
(0.050")
NiPdAu AWG 27 CU110F14x87 601450   360 ° Model
Ø 0.36mm
(Ø 0.014")
2.21mm
(0.087")
Sn60/Pb40 AWG 27 CU101P14x87 301487   360 ° Model
Ø 0.40mm
(Ø 0.016")
2.21mm
(0.087")
Sn60/Pb40 AWG 26 CU101P16x87 301687   360 ° Model
Ø 0.45mm
(Ø 0.018")
0.80mm
(0.031")
Bare - No Plating AWG 25 CU101P18x31-N2 401831   360 ° Model
Ø 0.45mm
(Ø 0.018")
0.80mm
(0.031")
NiPdAu AWG 25 CU110F18x31 601831   360 ° Model
Ø 0.45mm
(Ø 0.018")
1.27mm
(0.050")
Sn60/Pb40 AWG 25 CU101P18x50 301850   360 ° Model
Ø 0.45mm
(Ø 0.018")
1.27mm
(0.050")
Bare - No Plating AWG 25 CU101P18x50-N2 401850   360 ° Model
Ø 0.45mm
(Ø 0.018")
2.21mm
(0.087")
Sn60/Pb40 AWG 25 CU101P18x87 301887   360 ° Model
Ø 0.50mm
(Ø 0.020")
2.21mm
(0.087")
Sn60/Pb40 AWG 24 CU101P20x87 302087   360 ° Model
Ø 0.50mm
(Ø 0.020")
2.31mm
(0.091")
Sn60/Pb40 AWG 24 CU101P20x91 302091   360 ° Model
Ø 0.50mm
(Ø 0.020")
2.54mm
(0.100")
Sn60/Pb40 AWG 24 CU101P20x100 302091   360 ° Model
Note: Contact TopLine for other ØDiameter (0.10~0.50mm) and Length (0.25~3.5mm) available.
High frequency applications. Excellent thermal conductivity. Transfers heat from CCGA to ground layers in PCB.
 
 
AWG Size Chart (Reference Only)
AWG
Gauge
Mil Inch Micron
μm
Millimeter
mm
AWG 24 20 mil 0.020" 500um 0.50mm
AWG 25 18 mil 0.018" 450um 0.45mm
AWG 26 16 mil 0.016" 400um 0.40mm
AWG 27 14 mil 0.014" 360um 0.36mm
AWG 28 12.5 mil 0.0125" 320um 0.32mm
AWG 30 10 mil 0.010" 250um 0.25mm
AWG 32 8 mil 0.008" 200um 0.20mm
AWG 34 6 mil 0.006" 150um 0.15mm
AWG 36 5 mil 0.005" 125um 0.125mm
AWG 38 4 mil 0.004" 100um 0.10mm
AWG 40 3 mil 0.003" 80um 0.08mm
AWG 41 2.8 mil 0.0028" 70um 0.07mm
AWG 42 2.5 mil 0.0025" 60um 0.06mm
AWG 44 2.0 mil 0.002" 50um 0.05mm
AWG 46 1.6 mil 0.0016" 40um 0.04mm
AWG 47 1.4 mil 0.0014" 35um 0.035mm
AWG 48 1.25 mil 0.00125" 32um 0.032mm
AWG 49 1.1 mil 0.0011" 28um 0.028mm
AWG 50 1.0 mil 0.001" 25um 0.025mm
Note 1: Sizes listed in table are rounded (up or down) for simplicity and are not guaranteed for accuracy.
Note 2: Refer to ASTM standard B258 for accurate dimensions.
Note 3: AWG is the American Wire Gauge developed in 1857, predominantly for use in North America for electrically conducting wire.
Note 3: Tanaka wire is made to the metric standard.
 
 
 
Solidworks® e-Drawings software to view rotatable:    Download
 
 
Outline Drawing
Fig. 1   Fig. 2
 
Pb90/Sn10
Solder Column


Click Photo
  Pb80/Sn20 Traditional
Pb85/Sn15 New
Pb90/Sn10 New
Solder Column with Cu Wrap

Click Photo to see Sn63/Pb37 coating over the column
Click Photo
 
 
 
Column Part Number System
 
    CG         8020         C         20         X         91         Option    
Column Type Alloy Plating Ø Diameter
Mils
Packaging Length
Mils
  Option
CG = Solder Column

MCS = Micro Coil Spring


CU = Copper (Cu) Column
8020
Pb80/Sn20

8515
Pb85/Sn15

9010
Pb90/Sn10

172
BeCu Micro-coil
C17200 - Alloy 25


101
Copper 4N
CDA101
Cu99.99%

110
Copper Alloy
Cu99.5% Zn0.2% Mg0.1%
Solder Columns
C = Cu Ribbon Wrap
E = Cu Electro Plated
U = Unplated - Bare



Micro-coil Spring
P = Sn60/Pb40
G = Ni/Au (RoHS)



Cu Pillar
P = Sn60/Pb40
F = NiPdAu (RoHS)
U = Unplated (RoHS)



Under Development
Braided Column
D = Cu (Diamond Load)
Plated Sn63/Pb37
Solder Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
10 = 0.25mm
11 = 0.28mm
12 = 0.30mm
13 = 0.33mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
20 = 0.50mm
22 = 0.56mm
35 = 0.89mm


Micro Coil Spring
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm


Copper Pillar
4 = 0.10mm
5 = 0.13mm
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
9 = 0.23mm
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm
X = Bulk in Jar
Standard


J = JEDEC Tray
T = 4" Tray
W = 2" Tray
Solder Column
20 = 0.50mm
25 = 0.63mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
100 = 2.54mm
110 = 2.80mm
120 = 3.05mm
138 = 3.51mm
145 = 3.70mm
150 = 3.81mm

Micro Coil Spring
20 = 0.50mm
25 = 0.65mm
30 = 0.75mm
33 = 0.85mm
35 = 0.90mm
40 = 1.00mm
43 = 1.10mm
50 = 1.27mm

Copper Columns
20 = 0.50mm
25 = 0.63mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
87 = 2.21mm

Other Lengths Available
  Blank=Standard
N2=Nitrogen Pack
Custom available
 
 
Column DP# Order Number
 
    8         20         91         0    
Column Type Ø Diameter
Mils
Length
Mils
Package
Quantity
Pb80/Sn20 Solder Column:
8 = Cu Wrap + Sn63/Pb37 (C)


Pb85/Sn15 Solder Column:
5 = Cu Wrap + Sn63/Pb37 (C)


Pb90/Sn10 Solder Column:
9 = Unplated Plain Column (U)
0 = Cu Wrap Ribbon + Sn63/Pb37 (C)
7 = Cu Braided + Sn63/Pb37 (P)


Micro-Coil Spring:
1 =   Be-Cu C17200  Plated Sn60/Pb40 (P)
2 =   Be-Cu C17200  Plated Ni/Au Gold (G) RoHS


Copper (Cu) Pillar Columns:
3 = Cu Column Plated Sn60/Pb40 (P)
4 = Cu Column Unplated (U) RoHS
6 = Cu Column Plated NiPdAu (F) RoHS
Columns Under Development:
7 = Cu Braided Column + Sn63/Pb37 (D)
Code • Diameter • Pitch
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 1.0mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)

Code   •  Length
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
99 = 2.54mm
95 = 2.41mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm


Other Lengths Available


WIP
00 = 8"
12 = 12"
14 = 14"
Code   •  Qty
0 = 100pcs
1 = 1Kpcs
2 = 5Kpcs
3 = 10Kpcs
4 = 25Kpcs
5 = 50Kpcs
6 = 100Kpcs
7 = 250Kpcs
8 = Tray
9 = Bulk






WIP
0 = PLAIN
1 = WRAP
8 = DIP
9 = WAVE
 
 
Column Drawing Number
 
    80         20         91    
Column Type and Plating Ø Diameter
Mils
Length
Mils
Pb80/Sn20 Solder Column
80 = Cu Wrap + Sn63/Pb37 (C)


Pb85/Sn15 Solder Column
85 = Cu Wrap + Sn63/Pb37 (C)


Pb90/Sn10 Solder Column
90 = Plain Unplated (U)
91 = Cu Wrapped + Sn63/Pb37 (C)
94 = Cu Plated + Sn60/Pb40 (E)



Micro Coil Spring
17 = BeCu + Sn60/Pb40 (P)
19 = BeCu + Ni/Au RoHS (G)



Copper (Cu) Column:
30 = Cylinder Cu + Sn60/Pb40 (P)
40 = Cylinder Cu - Unplated (U) RoHS
60 = Cylinder Cu + NiPdAu (F) RoHS
64 = Nail Head Cu + NiPdAu (F) RoHS




Under Development
Braided Column (D):
70 = Cu Braid over Pb80/Sn20
75 = Cu Braid over Pb85/Sn15
79 = Cu Briad over Pb90/Sn10


  Diameter  
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 0.8mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)
  Length  
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
99 = 2.54mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm

Other Lengths Available
 
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
HS Code: 8311.30.3000 Lead-Tin Solders
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
Download Solidworks® e-Drawing viewer to enjoy 360° rotatable models.
For PC   •   MAC Version
 



TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

©2018 TopLine. All Rights Reserved.

Home
 

PCB Vibration Damping

New Technology Video