CCGA
Columns
 
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Fig.1
Pb90/Sn10
Plain Column
Click Photo		 Fig.2
Pb80/Sn20
Column with Cu wrap
Click Photo 1 • 2 • 3		 Fig.3
NASA Invented
Micro Coil Spring
Click for details		 Fig.4
Copper Column
Click for details		 Fig.5
Cu Braided Column
U.S. Patent 10,477,698 
 Next Generation Solder Column
 
About Columns  •   MIL-STD-883L 3.3.6   •   Pull Stength: MIL-STD-883K TM2038
TopLine offers a wide range solder columns to meet your needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20. We wind copper ribbon around the columns to increase reliability. After winding, the column is coated with Sn63/Pb37 hot solder. We can provide columns with a variety of diameters and lengths. A choice of different solder cores and copper ribbon thicknesses are available. Solder core materials from 0.20~0.89mm (8~35mils) and copper ribbon thickness from 0.0127~0.038mm (0.5 ~ 1.5mils) are readily available. We can provide custom size columns to meet your project requirements. The tables below are just a small example of the column sizes we offer. Contact TopLine to discuss your specific needs.
 
Copper Wrap Columns
TopLine offers columns with Tin-Lead as well as Lead Free solder cores. Contact TopLine to discuss your specific needs.
 
Why Columns?
Solder columns are 10x more reliable that solder balls when attaching large size ceramic IC packages to FR4 PC Boards operating in harsh environments. The large CTE (Coefficient of Thermal Expansion) mismatch of ceramic puts stress on the interconnections (I/O) over wide temperature cycles. The CTE of a ceramic alumina Al2O3 IC package is about 6.7ppm/°C. The CTE of organic boards, such as Polyimide or FR4 is roughly 17.5ppm/°C. Therefore, the amount of CTE mismatch between ceramic materials and organic boards is roughly 10ppm/°C. The corners of a large 50x50mm ceramic package might twist as much as ±70µm (±2.7mils) over temperature swings of 100°C. Eventually, the connections between the ceramic IC and the mother board will break over time enduring thousands of temperature cycles. Solder columns are compliant and absorb CTE mismatch, thereby lengthening the life of the circuit.
 
Plain Pb90/Sn10 Traditional Columns
Fig. Alloy Column
Ø  Diameter
±0.025mm		 Column
Length
±0.050mm		 CCGA
Pitch		 Copper
Cu Ribbon		 Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 1
Pb90/Sn10
"U" Unplated		 Ø 0.20mm
(Ø 0.008")		 1.0mm
(0.040")		 0.50mm None CG9010U8x40 900840   360 ° Model
Ø 0.25mm
(Ø 0.010")		 1.27mm
(0.050")		 0.50mm None CG9010U10x50 901050   360 ° Model
Ø 0.30mm
(Ø 0.012")		 1.50mm
(0.060")		 0.80mm None CG9010U12x60 901260   360 ° Model
Ø 0.38mm
(Ø 0.015")		 2.21mm
(0.087")		 1.0mm None CG9010U15x87 901587   360 ° Model
Ø 0.51mm
(Ø 0.020")		 1.80mm
(0.070")		 1.0mm~
1.27mm		 None CG9010U20x70 902070   360 ° Model
2.21mm
(0.087")		 1.0mm~
1.27mm		 None CG9010U20x87 902087   360 ° Model
2.31mm
(0.091")		 1.0mm~
1.27mm		 None CG9010U20x91 902091   360 ° Model
2.54mm
(0.100")		 1.0mm~
1.27mm		 None CG9010U20x100 902099   360 ° Model
Ø 0.51mm
(Ø 0.022")		 1.80mm
(0.070")		 1.27mm None CG9010U22x70 922070   360 ° Model
 
 
Copper Wrapped Pb80/Sn20 Columns   •   Size Parameter
Fig. Alloy Column
Ø  Diameter
±0.05mm		 Column
Length
±0.05mm		 Pitch
Application		 Solder
Core
ØDiameter		 Copper
Cu Ribbon
Thickness		 Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2A
Pb80/Sn20
"C" Plating		 Ø 0.30mm
(Ø 0.012")		 1.27mm
(0.050")		 Pitch 0.8~1.0mm
Plastic BGA/LGA
Pad Ø 0.40~0.45mm		 Ø 0.25mm
(Ø 0.010")		 0.025mm
(1 mil)		 CG8020C12x50 801250   360 ° Model
1.52mm
(0.060")		 CG8020C12x60 801260   360 ° Model
1.78mm
(0.070")		 CG8020C12x70 801270   360 ° Model
2.21mm
(0.087")		 CG8020C12x87 801287   360 ° Model
2.31mm
(0.091")		 CG8020C12x91 801291   360 ° Model
Ø 0.38mm
(Ø 0.015")		 2.21mm
(0.087")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50mm		 Ø 0.30mm
(Ø 0.012")		 0.025mm
(1 mil)		 CG8020C15x87 801587   360 ° Model
2.31mm
(0.091")		 CG8020C15x91 801591   360 ° Model
2.41mm
(0.095")		 CG8020C15x95 801595   360 ° Model
2.54mm
(0.100")		 CG8020C15x100 801599   360 ° Model
3.81mm
(0.150")		 CG8020C15x150 801597   360 ° Model
Ø 0.51mm
(Ø 0.020")		 2.21mm
(0.087")		 Pitch 1.0mm~
1.27mm

Ceramic CCGA
Pad Ø 0.80mm		 Ø 0.40mm
(Ø 0.0160")		 0.038mm
(1.5 mil)		 CG8020C20x87 802087   360 ° Model
2.31mm
(0.091")		 CG8020C20x91 802091   360 ° Model
2.41mm
(0.095")		 CG8020C20x95 802095   360 ° Model
2.54mm
(0.100")		 CG8020C20x100 802099   360 ° Model
3.51mm
(0.138")		 CG8020C20x138 802092   360 ° Model
3.70mm
(0.145")		 CG8020C20x145 802096   360 ° Model
3.81mm
(0.150")		 CG8020C20x150 802097   360 ° Model
Ø 0.56mm
(Ø 0.022")		 2.21mm
(0.087")		 Pitch 1.27mm

Ceramic CCGA
Pad Ø 0.86mm		 Ø 0.45mm
(Ø 0.0160")		 0.038mm
(1.5 mil)		 CG8020C22x87 802287   360 ° Model
Note 1: Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.
Note 2: Contact TopLine for other ØDiameter and Length available.
 
 
Copper Wrapped Pb90/Sn10 Columns NEW
Fig. Alloy Column
Ø  Diameter
±0.05mm		 Column
Length
±0.05mm		 Pitch
Application		 Solder
Core
ØDiameter		 Copper
Cu Ribbon
Thickness		 Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 2B
Pb90/Sn10
"C" Plating		 Ø 0.30mm
(Ø 0.012")		 2.31mm
(0.091")		 Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm		 Ø 0.25mm
(Ø 0.010")		 0.025mm
(1.0 mil)		 CG9010C12x91 911291   360 ° Model
Ø 0.30mm
(Ø 0.012")		 2.54mm
(0.100")		 Pitch 0.8mm
Plastic BGA/LGA
Pad Ø 0.40~0.50mm		 Ø 0.25mm
(Ø 0.010")		 0.025mm
(1.0 mil)		 CG9010C12x100 911299   360 ° Model
Ø 0.38mm
(Ø 0.015")		 2.31mm
(0.091")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm		 Ø 0.30mm
(Ø 0.012")		 0.025mm
(1.0 mil)		 CG9010C15x91 911591   360 ° Model
Ø 0.38mm
(Ø 0.015")		 2.54mm
(0.100")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.50~0.60mm		 Ø 0.30mm
(Ø 0.012")		 0.025mm
(1.0 mil)		 CG9010C15x100 911599   360 ° Model
Ø 0.51mm
(Ø 0.020")		 1.80mm
(0.063")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm		 Ø 0.40mm
(Ø 0.016")		 0.038mm
(1.5 mil)		 CG9010C20x70 912070   360 ° Model
Ø 0.51mm
(Ø 0.020")		 2.31mm
(0.091")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm		 Ø 0.40mm
(Ø 0.016")		 0.038mm
(1.5 mil)		 CG9010C20x91 912091   360 ° Model
Ø 0.51mm
(Ø 0.020")		 2.54mm
(0.100")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm		 Ø 0.40mm
(Ø 0.016")		 0.038mm
(1.5 mil)		 CG9010C20x100 912099   360 ° Model
Ø 0.51mm
(Ø 0.020")		 3.81mm
(0.150")		 Pitch 1.0mm
Plastic BGA/LGA
Pad Ø 0.80~0.86mm		 Ø 0.40mm
(Ø 0.016")		 0.038mm
(1.5 mil)		 CG9010C20x150 912097   360 ° Model
Ø 0.56mm
(Ø 0.022")		 1.80mm
(0.063")		 Pitch 1.27mm
Plastic BGA/LGA
Pad Ø 0.86mm		 Ø 0.45mm
(Ø 0.018")		 0.038mm
(1.5 mil)		 CG9010C22x70 912270   360 ° Model
Note 1: Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.
Note 2: Contact TopLine for other ØDiameter and Length available.
Note 3: Copper wrapped Pb90/Sn10 provides wider process window for secondary assembly to PWB board.
 
 
NASA Invented Micro-coil Spring
Fig. Alloy Spring
Ø Diameter
±0.025mm		 Free
Length
±0.050mm		 CCGA
Pitch		 Plating Wire
ØDia		 Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 3
Micro-Coil
BeCu
 C17200
Alloy 25		 Ø 0.40mm
(Ø 0.016")		 1.0mm
(0.040")		 1.0mm
Plastic BGA/LGA		 Sn60/Pb40 0.0635mm
(Ø 0.0025")		 MCS172P16x40 171640   360 ° Model
Ø 0.40mm
(Ø 0.016")		 1.0mm
(0.040")		 1.0mm
Plastic BGA/LGA		 Lead Free
Au 10 µ-inch
(0.25µm)		 0.0635mm
(Ø 0.0025")		 MCS172G16x40 191640   360 ° Model
Ø 0.51mm
(Ø 0.020")		 1.27mm
(0.050")		 1.0~1.27mm
Standard
Ceramic CCGA		 Sn60/Pb40 0.086mm
(Ø 0.0034")		 MCS172P20x50 172050   360 ° Model
Ø 0.51mm
(Ø 0.020")		 1.27mm
(0.050")		 1.0~1.27mm
Lead Free		 Lead Free
Au 10 µ-inch
(0.25µm))		 0.086mm
(Ø 0.0034")		 MCS172G20x50 192050   360 ° Model
Note: Contact TopLine for ØDiameter and Length available.
 
 
Copper Column (Lead Free RoHS)
Fig. Alloy Column
Ø  Diameter
±0.03mm		 Column
Length
±0.05mm		 Plating
Coating		 AWG
Nearest
Equivalent		 Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 4
Copper Alloy
OFE - 99.9%

G Plating
Ni-Gold Coated
Ni/Au
RoHS

Ø 0.20mm
(Ø 0.008")		 0.50mm
(0.020")		 NiAu AWG 32 CU110G8x20A 600820   360 ° Model
Ø 0.20mm
(Ø 0.008")		 0.63mm
(0.025")		 NiAu AWG 32 CU110G8x25A 600825   360 ° Model
Ø 0.20mm
(Ø 0.008")		 0.80mm
(0.031")		 NiAu AWG 32 CU110G8x31A 600831   360 ° Model
Ø 0.20mm
(Ø 0.008")		 1.00mm
(0.040")		 NiAu AWG 32 CU110G8x40A 600840   360 ° Model
Ø 0.20mm
(Ø 0.008")		 1.27mm
(0.050")		 NiAu AWG 32 CU110G8x50A 600850   360 ° Model
Ø 0.20mm
(Ø 0.008")		 1.5mm
(0.060")		 NiAu AWG 32 CU110G8x60A 600860   360 ° Model
Ø 0.20mm
(Ø 0.008")		 1.6mm
(0.063")		 NiAu AWG 32 CU110G8x63A 600863   360 ° Model
Ø 0.20mm
(Ø 0.008")		 1.9mm
(0.075")		 NiAu AWG 32 CU110G8x75A 600875   360 ° Model
Ø 0.20mm
(Ø 0.008")		 2.2mm
(0.087")		 NiAu AWG 32 CU110G8x87A 600887   360 ° Model
Ø 0.25mm
(Ø 0.010")		 0.50mm
(0.020")		 NiAu AWG 30 CU110G10x20A 601025   360 ° Model
Ø 0.25mm
(Ø 0.010")		 0.63mm
(0.025")		 NiAu AWG 30 CU110G10x25A 601025   360 ° Model
Ø 0.25mm
(Ø 0.010")		 0.80mm
(0.031")		 NiAu AWG 30 CU110G10x31A 601031   360 ° Model
Ø 0.25mm
(Ø 0.010")		 1.00mm
(0.040")		 NiAu AWG 30 CU110G10x40A 601040   360 ° Model
Ø 0.25mm
(Ø 0.010")		 1.27mm
(0.050")		 NiAu AWG 30 CU110G10x50A 601050   360 ° Model
Ø 0.25mm
(Ø 0.010")		 1.5mm
(0.060")		 NiAu AWG 30 CU110G10x60A 601060   360 ° Model
Ø 0.25mm
(Ø 0.010")		 1.6mm
(0.063")		 NiAu AWG 30 CU110G10x63A 601063   360 ° Model
Ø 0.25mm
(Ø 0.010")		 1.9mm
(0.075")		 NiAu AWG 30 CU110G10x75A 601075   360 ° Model
Ø 0.25mm
(Ø 0.010")		 2.2mm
(0.087")		 NiAu AWG 30 CU110G10x87A 601087   360 ° Model
Ø 0.30mm
(Ø 0.012")		 0.50mm
(0.020")		 NiAu AWG 29 CU110G12x20A 601225   360 ° Model
Ø 0.30mm
(Ø 0.012")		 0.63mm
(0.025")		 NiAu AWG 29 CU110G12x25A 601225   360 ° Model
Ø 0.30mm
(Ø 0.012")		 0.80mm
(0.031")		 NiAu AWG 29 CU110G12x31A 601231   360 ° Model
Ø 0.30mm
(Ø 0.012")		 1.00mm
(0.040")		 NiAu AWG 29 CU110G12x40A 601240   360 ° Model
Ø 0.30mm
(Ø 0.012")		 1.27mm
(0.050")		 NiAu AWG 29 CU110G12x50A 601250   360 ° Model
Ø 0.30mm
(Ø 0.012")		 1.5mm
(0.060")		 NiAu AWG 29 CU110G12x60A 601260   360 ° Model
Ø 0.30mm
(Ø 0.012")		 1.6mm
(0.063")		 NiAu AWG 29 CU110G12x63A 601263   360 ° Model
Ø 0.30mm
(Ø 0.012")		 1.9mm
(0.075")		 NiAu AWG 29 CU110G12x75A 601275   360 ° Model
Ø 0.30mm
(Ø 0.012")		 2.2mm
(0.087")		 NiAu AWG 29 CU110G12x87A 601287   360 ° Model
Note: Contact TopLine for other ØDiameter (0.10~0.50mm) and Length (0.25~3.5mm) available.
High frequency applications. Excellent thermal conductivity. Transfers heat from CCGA to ground layers in PCB.
 
 
Copper Braided Solder Columns U.S. PATENT 10,477,698   •   CN Patent  111,822,899  •   More About
Fig. Alloy Column
Ø  Diameter
±0.05mm		 Column
Length
±0.05mm		 Core
Material		 Solder
Core
Ø Diameter		 Copper
Cu
Ø Diameter		 Copper
Nbr
Strands		 Part Number Drawing 360° Rotatable
Solidworks
Model
Fig. 5
Copper
Braided Column
Lead Free
and Tin-Lead		 Ø 0.30mm
(Ø 0.012")		 2.21mm
(0.087")		 Lead Free Ø 0.20mm
(Ø 0.008")		 0.025mm
(1.0 mil)		 16X BC10H12x87A 951287   360 ° Model
Pb80/Sn20 Ø 0.20mm
(Ø 0.008")		 0.025mm
(1.0 mil)		 16X BC8020B12x87A 751287
Pb90/Sn10 Ø 0.20mm
(Ø 0.008")		 0.025mm
(1.0 mil)		 16X BC9010B12x87A 711287
Ø 0.35mm
(Ø 0.014")		 2.21mm
(0.087")		 Lead Free Ø 0.25mm
(Ø 0.010")		 0.025mm
(1.0 mil)		 16X BC10H14x87A 951487   360 ° Model
Pb80/Sn20 Ø 0.25mm
(Ø 0.010")		 0.025mm
(1.0 mil)		 16X BC8020B14x87A 751487
Pb90/Sn10 Ø 0.25mm
(Ø 0.010")		 0.025mm
(1.0 mil)		 16X BC9010B14x87A 711487
Ø 0.40mm
(Ø 0.016")		 2.21mm
(0.087")		 Lead Free Ø 0.25mm
(Ø 0.010")		 0.038mm
(1.5 mil)		 16X BC10H16x87B 951687   360 ° Model
Pb80/Sn20 Ø 0.25mm
(Ø 0.010")		 0.038mm
(1.5 mil)		 16X BC8020B16x87B 751687
Pb90/Sn10 Ø 0.25mm
(Ø 0.010")		 0.038mm
(1.5 mil)		 16X BC9010B16x87B 711687
Ø 0.45mm
(Ø 0.018")		 2.21mm
(0.087")		 Lead Free Ø 0.30mm
(Ø 0.012")		 0.038mm
(1.5 mil)		 16X BC10H18x87B 951887   360 ° Model
Pb80/Sn20 Ø 0.30mm
(Ø 0.012")		 0.038mm
(1.5 mil)		 16X BC8020B18x87B 751887
Pb90/Sn10 Ø 0.30mm
(Ø 0.012")		 0.038mm
(1.5 mil)		 16X BC9010B18x87B 711887
Ø 0.50mm
(Ø 0.020")		 2.21mm
(0.087")		 Lead Free Ø 0.35mm
(Ø 0.014")		 0.038mm
(1.5 mil)		 16X BC10H20x87B 952087   360 ° Model
Pb80/Sn20 Ø 0.35mm
(Ø 0.014")		 0.038mm
(1.5 mil)		 16X BC8020B20x87B 752087
Pb90/Sn10 Ø 0.35mm
(Ø 0.014")		 0.038mm
(1.5 mil)		 16X BC9010B20x87B 712087
Note: Contact TopLine for other ØDiameter and Length available up to 3.8mm Long.
Benefits of New Copper Braided Solder Column:
1. Non-collapsible, robust and compliant structure. Use for reducing stress caused by CTE mismatch.
2. New Lead Free Braided Columns available for COTS Eu-RoHS applications
3. The Exoskeleton Copper Sleeve acts as a heat pipe to conduct heat from underside of chip. Smaller size and lighter package.
4. Small diameter Braided Columns for fine-pitch devices. Smaller size and lighter package.
5. Available in several material sets: Tin-Lead Mil/Aerospace: Pb80/Sn20, Pb90/Sn10, HMP and RoHS: Lead Free for COTS applications.
6. Animated Finite Element Analysis (FEA) Strain on Copper Wrapped Column under CTE mismatch.
 
 
AWG Size Chart (Reference Only)
AWG
Gauge		 Mil Inch Micron
μm		 Millimeter
mm
AWG 24 20 mil 0.020" 500um 0.50mm
AWG 25 18 mil 0.018" 450um 0.45mm
AWG 26 16 mil 0.016" 400um 0.40mm
AWG 27 14 mil 0.014" 360um 0.36mm
AWG 28 12.5 mil 0.0125" 320um 0.32mm
AWG 30 10 mil 0.010" 250um 0.25mm
AWG 32 8 mil 0.008" 200um 0.20mm
AWG 34 6 mil 0.006" 150um 0.15mm
AWG 36 5 mil 0.005" 125um 0.125mm
AWG 38 4 mil 0.004" 100um 0.10mm
AWG 40 3 mil 0.003" 80um 0.08mm
AWG 41 2.8 mil 0.0028" 70um 0.07mm
AWG 42 2.5 mil 0.0025" 60um 0.06mm
AWG 44 2.0 mil 0.0020" 50um 0.05mm
AWG 46 1.6 mil 0.0016" 40um 0.04mm
AWG 47 1.4 mil 0.0014" 35um 0.035mm
AWG 48 1.25 mil 0.00125" 32um 0.032mm
AWG 49 1.1 mil 0.0011" 28um 0.028mm
AWG 50 1.0 mil 0.0010" 25um 0.025mm
AWG 51 0.88 mil 0.00088" 22um 0.022mm
AWG 52 0.78 mil 0.00078" 20um 0.020mm
AWG 53 0.70 mil 0.00070" 18um 0.018mm
AWG 54 0.62 mil 0.00062" 16um 0.016mm
AWG 55 0.55 mil 0.00055" 14um 0.014mm
AWG 56 0.49 mil 0.00049" 12.5um 0.0125mm
Note 1: Sizes listed in table are rounded (up or down) for simplicity and are not guaranteed for accuracy.
Note 2: Refer to ASTM standard B258 for accurate dimensions.
Note 3: AWG (American Wire Gauge) is predominantly for use in North America for electrically conducting wire.
 
 
 
Solidworks® e-Drawings software to view rotatable:    Download
 
 
Outline Drawing
Fig. 1   Fig. 2
 
Pb90/Sn10
Solder Column

Click Photo		   Pb80/Sn20 Traditional
Pb85/Sn15 New
Pb90/Sn10 New
Solder Column with Cu Wrap
Click Photo to see Sn63/Pb37 coating over the column
Click Photo
 
 
 
Column Part Number System
 
    CG         8020         C         20         X         87     −     Option    
Column Type Core Alloy Coating Ø Diameter
Mils		 Packaging Length
Mils		   Option
CG = Solder Column

MCS = Micro Coil Spring

BC = Braided Column

CC = Copper Core Column

CU = Copper Pillar Column

 Copper Wrap:
8020 = Pb80/Sn20
8515 = Pb85/Sn15
9010 = Pb90/Sn10


Braided Column:
U.S. Patent 10,477,698
CN Patent 111,822,899

Tin-Lead
8020 = Pb80/Sn20
9010 = Pb90/Sn10
935 = Pb93.5/Sn5/Ag1.5

Lead Free (RoHS)
8 = Sn91.5/Sb8.5
10 = Sn90/Sb10



Metal Core:
101 = Cu OFHC (CDA101)

110 = Cu EFTEC-3 Soft (C14410)

194 = Cu EFTEC-194 Hard
Cu97.4/Fe2.4/Zn.13 (C194)



Micro-Coil Spring:
172 = BeCu (C172)
Cu98% Be1.8% Co+Ni0.2%


Elastomer Core:
000 = Under Development





 Column Cu Wrap(CG)
C = Sn63/Pb37 (Tin-Lead)


Plain Column(CG)
U = Unplated - Bare


Micro-coil Spring (MCS)
P = Sn60/Pb40
G = Ni/Au (RoHS)


Cu Pillar/Column (CU)
G = NiAu (RoHS)


 Copper Core Column (CC)
A = Pb90/Sn10 Ribbon
Coat Sn63/Pb37
K = Sn90/Sb10 Ribbon (RoHS)
Coat Sn90/Ag3.5/Bi0.5/In6.0


Braided Column (BC)
Tin-Lead
B = Sn63/Pb37 16*Cu
L = Sn63/Pb37 8*Cu


Lead-Free (RoHS)
H = SAC+ 16*Cu
J = SAC+ 8*Cu

Elastomer Core
W = RoHS 16*Cu
Y = RoHS 8*Cu


 Solder Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
10 = 0.25mm
11 = 0.28mm
12 = 0.30mm
13 = 0.33mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm
20 = 0.50mm
22 = 0.56mm
35 = 0.89mm


Micro Coil Spring
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
16 = 0.40mm
18 = 0.45mm
20 = 0.50mm


Copper Column
6 = 0.15mm
7 = 0.18mm
8 = 0.20mm
9 = 0.23mm
10 = 0.25mm
12 = 0.30mm
14 = 0.35mm
15 = 0.38mm
16 = 0.40mm


 Standard:
X = Jar


Special:
J = JEDEC Tray
T = 4" Tray
W = 2" Tray
E = Tape & Reel 		Solder Column
25 = 0.63mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
100 = 2.54mm
138 = 3.51mm
150 = 3.81mm


Micro Coil Spring
25 = 0.65mm
30 = 0.75mm
33 = 0.85mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm


Copper Columns
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
73 = 1.85mm
87 = 2.21mm

Other Length Available

   Blank=Standard

A to Z = Custom


Braided Columns
C172 Soft
A= 1.0mil
B= 1.5mil
C= 2.0mil

C172 Hard
D= 1.0mil
E= 1.5mil
F= 2.0mil

PCC
G= 1.5mil
H= 2.0mil
 
 
Column DP# Order Number
 
    8         20         87         0    
Column Type Ø Diameter
Mils		 Length
Mils		 Package
Quantity
Pb80/Sn20 Solder Column (CG):
8 = Cu Wrap Ribbon (C)


 Pb90/Sn10 Solder Column (CG):
9 = Plain Column (U)
0 = Cu Wrap Ribbon (C)


Braided Column (BC) 16X:
U.S. Patent 10,477,698
CN Patent 111,822,899
4 = Cu Braid + Pb80/Sn20 Solder (B)
5 = Cu Braid + Lead Free Solder (H)
7 = Cu Braid + Pb90/Sn10 Solder (B)



 Micro-Coil Spring (MCS):
1 =   Be-Cu C17200  Plated Sn60/Pb40 (P)
2 =   Be-Cu C17200  Plated Ni/Au Gold (G) RoHS

Code • Diameter • Pitch
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 1.0mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
30 = Ø0.75mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm)

 Code   •  Length
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
99 = 2.54mm
95 = 2.41mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm


Other Lengths Available

WIP
00 = 8"
12 = 12"
14 = 14"
 Code   •  Qty
0 = Jar 100pcs
1 = Jar 1Kpcs
2 = Jar 5Kpcs
3 = Jar 10Kpcs
7 = Reel 2500pcs
8 = Tray
9 = Bulk





WIP
0 = PLAIN
1 = WRAP
8 = DIP
9 = WAVE
 
 
Column Drawing Number
 
    80         20         87    
Column Type and Plating Ø Diameter
Mils		 Length
Mils
COPPER WRAP COLUMN (CG)
    Tin-Lead   
80 = Pb80/Sn20 (C)
85 = Pb85/Sn15 (C)
91 = Pb90/Sn10 (C)


Plain Solder Column (CG)
Tin-Lead
90 = Pb90/Sn10 Unplated (U)



Micro Coil Spring (MCS)
17 = BeCu + Sn60/Pb40 (P)
19 = BeCu + Ni/Au RoHS (G)


Lead Free Cu Columns (RoHS):
60 = C14410 (EFTEC-3) + NiAu (G)
65 = C194 (EFTEC-194) + NiAu (G)



Copper Core Solder Column (CU)
Tin-Lead
34 = Cu Core + Pb90/Sn10 Ribbon(A)

Lead Free (RoHS):
33 = Cu Core + Sn90Sb10 Ribbon (K)



Copper Braided Column (BC)
U.S. Patent 10,477,698
CN Patent 111,822,899



Braided Column Lead Free (RoHS) BC
10 = Elastomer Core 16*Cu (W)
11 = Elastomer Core 8*Cu (Y)
94 = Sn90/Sb10 - 8*Cu (J)
95 = Sn90/Sb10 - 16*Cu (H)
98 = Sn91.5/Sb8.5 - 16*Cu (H)

Braided Column Tin-Lead (BC)
70 = TBA
71 = Pb90/Sn10 - 16*Cu (B)
72 = Pb90/Sn10 32*Cu (D)
73 = Pb90/Sn10 - 8*Cu (L)
74 = Pb80/Sn20 - 8*Cu (L)
75 = Pb80/Sn20 - 16*Cu (B)
76 = Pb93.5/Sn5/Ag1.5 HMP - 16*Cu (B)
77 = Pb93.5/Sn5/Ag1.5 HMP - 8*Cu (L)
78 = TBA
79 = TBA



Application Specific (ASIC)
89 = Customer Specific Assigned number 		  Diameter  
04 = Ø0.10mm (P 0.4mm)
05 = Ø0.13mm (P 0.5mm)
06 = Ø0.15mm (P 0.5mm)
08 = Ø0.20mm (P 0.5mm)
09 = Ø0.23mm (P 0.5mm)
10 = Ø0.25mm (P 0.65mm)
12 = Ø0.30mm (P 0.8mm)
13 = Ø0.33mm (P 0.8mm)
14 = Ø0.35mm (P 0.8mm)
15 = Ø0.38mm (P 0.8mm)
16 = Ø0.40mm (P 1.0mm)
17 = Ø0.43mm (P 1.0mm)
18 = Ø0.45mm (P 1.0mm)
20 = Ø0.50mm (P 1.0mm)
22 = Ø0.56mm (P 1.27mm)
27 = Ø0.70mm (P 1.27mm)
30 = Ø0.75mm (P 1.27mm)
35 = Ø0.89mm (P ≥1.5mm) 		  Length  
20 = 0.50mm
25 = 0.63mm
30 = 0.75mm
31 = 0.80mm
35 = 0.90mm
40 = 1.00mm
50 = 1.27mm
63 = 1.60mm
70 = 1.80mm
73 = 1.85mm
75 = 1.91mm
87 = 2.21mm
91 = 2.31mm
93 = 2.36mm
95 = 2.41mm
99 = 2.54mm
98 = 2.80mm
94 = 3.05mm
92 = 3.51mm
96 = 3.70mm
97 = 3.81mm

Other Lengths Available
 
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
HS Code: 8311.30.3000 Lead-Tin Solders
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
 
        
 
 
WARNING - THIS PRODUCT CONTAINS LEAD
Ingestion may cause lead poisoning. Do not breathe dust or fumes. Use NIOSH approved respiratory protection when necessary. Use only with adequate ventillation. Wash hands before eating, drinking, and smoking. Keep out of reach of children. For industrial and commercial use only. Do not re-use container. Not for use in potable water systems. See material safety data sheet for further information.
 
California Regulatory Information
California State Proposition 65
WARNING! This product contains lead, known to the state of California to cause cancer, birth defects and other reproductive harm. (California Health & Safety Code 25249.5 et seq.)
 
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