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Packaging Group		 Interposer
Connect LGA to PCB
With Compliant Columns
 
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Click to Enlarge 		Interposer: Compression mounting sockets or direct solderable interposers (Package on Package) with compliant columns absorbs CTE mismatch between the LGA and the PCB. Tin/Lead and Lead-Free available. Braided Columns, Copper Columns or Micro-Coil Springs

Features
  • Pin Count Up to 10,000 I/O
  • LGA Size: 4mm to 200mm
  • Column Alloy, Length and Ø Diameter. (See table)
    •
    Interposer
    Connects LGA to PCB with Solder Columns, Copper Columns or Micro-Coil Springs
    Model Number Pins
    I/O    		 Pitch
    ℄    		 Pad
    Matrix    		 X/Y Size
    LGA    		 Alloy
    Construction    		 Column
    ØDia    		 Column Length Device Type Compression
    Solderable    		 DWG Nbr
    Filled    		 Fig. 360°
    Solidworks
    Model
    IP30E20B8x40A 20 0.5mm 5x5 4x4mm Cu Pillar Ø0.20mm
    8 mil    		 1.0mm
    40mil    		 QFN20
    Plastic    		 Solderable 350520 Fig. 1 Model
    IP90U56B8x60A 56 0.5mm 14x14 8x8mm Pb90/Sn20
    Columns    		 Ø0.20mm
    8 mil    		 1.52mm
    60mil    		 QFN56
    Plastic    		 Solderable 351420 Fig. 3 Model
    IP31G56B8x60A 56 0.5mm 14x14 8x8mm Cu C194
    Columns    		 Ø0.20mm
    8 mil    		 1.52mm
    60mil    		 QFN56
    Plastic    		 Solderable 351421 Fig. 3 Model
    IP83C598G20x87A 598 2.0mm 37x31 75.0x63.5mm Pb80/Sn20
    Cu Wrap    		 Ø0.51mm
    20 mil    		 2.21mm
    87mil    		 CG598
    Ceramic
    Sony    		 Compression 337180 Fig. 2 Model
    IP94D1272E20x87A 1272 1.0mm 36x36 37.5x37.5mm Pb90/Sn10
    Cu Braided    		 Ø0.51mm
    20 mil    		 2.21mm
    87mil    		 CG1272
    Ceramic
    Microsemi    		 Compression 313681 Fig. 2 Model
    IP17P2400E20x50A 2400 1.0mm 50x48 50x50mm Micro-Coil
    to PGA    		 Ø0.51mm
    20 mil    		 1.27mm
    50mil    		 CG2400
    Ceramic    		 Solderable 314880 Model
    IP54R10000E16x87A 10000 1.0mm 100x100 100x100mm SAC305
    Cu Braided    		 Ø0.40mm
    16 mil    		 2.21mm
    87mil    		 CG10000
    Si Wafer    		 Solderable 319961 Model
    Note 1: Contact TopLine for assistance for Interposer configurations not shown above.
    Note 2: Column length: 1.0~2.5mm (40~100 mils).
     
     
     
    Example Column Interposers.
    Other sizes available.
    Fig. 1
    QFN 20 Pins
    Pitch 0.5mm - 4x4mm
    Solder Copper Column (PoP)    		 Fig. 2
    CLGA 1272 Pins
    Copper Braided Solder Columns
    Pitch 1.0mm - 37.5x37.5mm
    SMT Compression Socket
     
     
     
    Interposer
    Model Number System
        IP         9        4        C        1272         E         20     x     87         A    
    Series Alloy Construction Plating Nbr Pins Pitch Column Diameter
    Mils    		   Column Length
    Mils    		 Version
    FILLED With Columns:
    IP = Interposer
    		 Code • Alloy
    1 = Micro-Coil
    3 = Cu Pillar
    8 = Pb80/Sn20
    9 = Pb90/Sn10

    0 = TBA
    2 = TBA
    4 = TBA
    5 = TBA
    6 = Sn/Sb
    7 = TBA
    		 Code • Description
    0 = Bare
    1 = Cu C194
    3 = Cu Wrap
    4 = Cu Braid
    7 = Micro-Coil
    9 = Micro-Coil

    Under Development
    2 = TBA
    5 = TBA
    6 = TBA
    8 = TBA
    		 Code • Plating
    C = Cu Wrap (Sn/Pb)

    B = 16x Cu Braid (Sn/Pb)
    D = 32x Cu Braid (Sn/Pb)
    L = 8x Cu Braid (Sn/Pb)

    E = Cu Pillar (Sn/Pb)
    F = NiPdAu (RoHS)
    P = MCS (Sn/Pb)
    G = Gold (RoHS)

    R = 32x Cu Braid (RoHS)
    H = 16x Cu Braid (RoHS)
    J = 8x Cu Braid (RoHS)

    U = Unplated
    		 Pins • Matrix
    255 = 16x16
    349 = 19x19
    360 = 19x19
    472 = 22x22
    483 = 22x22
    484 = 22x22
    517 = 23x23
    624 = 25x25
    672 = 26x26
    717 = 27x27
    896 = 30x30
    1140 = 34x34
    1144 = 34x34
    1148 = 34x34
    1152 = 34x34
    1272 = 36x36
    1509 = 39x39
    1588 = 40x40
    1657 = 41x41
    1752 = 42x42
    2577 = 51x51
    		 Code • Pitch
    A = 0.4mm    
    B = 0.5mm    
    C = 0.65mm  
    D = 0.8mm    
    E = 1.0mm    
    F = 1.27mm
    G = 2.0mm
    H = 2.54mm
    K = 0.45mm

    Odd Pitch:
    V = 1.0mm Stagger
    W = 1.00/1.27mm
    Y = 1.17/1.09mm
    Z = Other    
    		 Code •     Metric
    Ø6 mil • 0.150mm
    Ø8 mil • 0.200mm
    Ø10mil • 0.250mm
    Ø12mil • 0.300mm
    Ø15mil • 0.380mm
    Ø16mil • 0.400mm
    Ø18mil • 0.450mm
    Ø20mil • 0.510mm
    Ø24mil • 0.610mm
    Ø30mil • 0.762mm
    Ø35mil • 0.890mm
    		  Code •   Metric
    40mil • 1.00mm
    50mil • 1.27mm
    62mil • 1.57mm
    87mil • 2.21mm
    91mil • 2.31mm
    93mil • 2.36mm
    95mil • 2.41mm
    100mil • 2.54mm
    110mil • 2.80mm
    145mil • 3.68mm
    150mil • 3.81mm
    		 Code
    A
    B
    C
    D
    E
     
     
    Drawing Number System
     
        3         1         36         8         0    
    Series Pitch Matrix Array Interconnect Diameter Version
    Interposer
    Code • Item Description
    3 = Interposer with Columns
    (Pcode BM1)
    		 PITCH
    Code • Pitch
    1 = 1.0mm  
    2 = 1.27mm
    3 = 2.00mm
    4 = 0.4mm  
    5 = 0.5mm  
    6 = 0.65mm
    8 = 0.8mm  
    9 = Special 
    0 = Hardware 









    		 Array Matrix
    Code • Matrix
    19 = 19x19
    22 = 22x22
    24 = 24x24
    25 = 25x25
    26 = 26x26
    27 = 27x27
    30 = 30x30
    34 = 34x34
    35 = 35x35
    36 = 36x36
    39 = 39x39
    40 = 40x40
    42 = 42x42
    43 = 43x43
    44 = 44x44
    71 = 37x31
    99 = 100x100
    		 Column & Pad
    Code • Ø Column Diameter
    1 = Ø6 mil •   Ø0.15mm
    2 = Ø8 mil •   Ø0.20mm
    3 = Ø10 mil • Ø0.25mm
    4 = Ø12 mil • Ø0.30mm
    5 = Ø15 mil • Ø0.35mm
    6 = Ø16 mil • Ø0.40mm
    7 = Ø18 mil • Ø0.45mm
    8 = Ø20 mil • Ø0.50mm
    9 = Other
    0 = Other
    		 Version
    Code • Ø Rev
    0 = Rev A
    1 = Rev B
     
     
     
     
    ECCN: EAR99 Export Administration Regulations (EAR)
    HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
    HS Code: 8311.30.3000 LEAD-TIN SOLDERS
    ITAR: Micro-coil springs and dummy daisy chain CCGA are not restricted.
     
     
     
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