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| About CGA on Silicon: Column Grid Array (CGA) silcon wafer level packages provide a novel solution for overcoming 2.6ppm/oC mismatch of coefficient of thermal expansion (CTE) between large silicon packages and glass-epoxy printed circuit boards (PCB). OFHC Copper (Cu) columns on Si substrates are compliant and absorb strain in applications found in the fields of military, aerospace and defense where significantly varying temperatures, high vibration and shock are present. |
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Silicon Substrate - Wafer Level Package
Column Grid Array with Daisy Chain |
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| Enlarge Corner View |
Enlarge Corner View |
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| Columns |
Matrix |
Pitch |
Package
Size (mm) |
Part Number |
Fillet
Alloy |
Column
Type |
Column
ØDia |
SolidWorks
Model |
Images |
| 2500 |
50x50 |
0.5mm |
25mm |
CG2500T.5Cu-DC508D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
 Model |
Top
Bottom |
| 2916 |
54x54 |
0.5mm |
27mm |
CG2916T.5Cu-DC548D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
Model |
Top
Bottom |
| 3844 |
62x62 |
0.5mm |
31mm |
CG3844T.5Cu-DC628D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
Model |
Top
Bottom |
| 4900 |
70x70 |
0.5mm |
35mm |
CG4900T.5Cu-DC708D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
Model |
Top
Bottom |
| 6400 |
80x80 |
0.5mm |
40mm |
CG6400T.5Cu-DC808D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
Model |
Top
Bottom |
| 10000 |
100x100 |
0.5mm |
50mm |
CG10000T.5Cu-DC100D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
Model |
Top
Bottom |
| 14400 |
120x120 |
0.5mm |
60mm |
CG14400T.5Cu-DC120D |
Sn63 |
Copper
OFHC |
Ø0.125mm
5mil |
Model |
Top
Bottom |
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| Cu Copper Columns |
| Alloy |
Column
Ø Diameter
±0.03mm |
Column
Length
±0.05mm |
SnPb
Plating
Thickness |
Part Number |
Drawing |
360° Rotatable
Solidworks
Model |
CDA101
Copper Alloy
OFE - OFHC |
Ø 0.100mm
(Ø 0.004") |
1.0mm
(0.050") |
3~5um
(100~
200 microinch) |
CU101P4x40 |
300440 |
Model |
Ø 0.127mm
(Ø 0.005") |
1.27mm
(0.050") |
3~5um
(100~
200 microinch) |
CU101P5x50 |
300550 |
Model |
Ø 0.152mm
(Ø 0.006") |
1.50mm
(0.060") |
3~5um
(100~
200 microinch) |
CU101P6x60 |
300660 |
Model |
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| Note: Contact TopLine for other ØDiameter and Length available. |
| Excellent thermal conductivity. Transfers heat from CCGA to ground layers in PCB. |
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Part Number System
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| CG |
14400 |
T |
.5 |
Cu |
− |
DC120 |
D |
| Package Type |
Nbr Pins |
Tray |
Pitch |
Column Type/Length |
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Daisy Chain |
Option |
CG
Column
Grid Array |
I/O Pads |
T = Tray
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Standard
.4 = 0.4mm
.5 = 0.5mm
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Copper Columns
Cu = OFHC Cu Copper
Cylindrical Column
SnPb Plating
Sn63/Pb37 Fillet
D = 4N Cu Braided Copper
NiPdAu Plating
Sn63/Pb37 Fillet
F = 4N Cu Braided Copper
NiPdAu Plating
SAC305 Fillet
RoHs Lead Free
Be = BeCu Braided Column
NiPdAu Plating
SAC305 Fillet
RoHs Lead Free
Bp = BeCu Braided Column
NiPdAu Plating
Sn63/Pb37 Fillet
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Net List
Drawing Number |
D=Dummy Si Die |
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| ECCN: EAR99 Export Administration Regulations (EAR) |
| HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS |
| ITAR: Solder columns and dummy daisy chain CCGA are not
restricted. |
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Download Solidworks® e-Drawing viewer to enjoy 360° rotatable models.
For PC •
MAC Version
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TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000 • Fax: 1-478-451-3000
Email: sales@topline.tv
©2018 TopLine. All Rights Reserved.
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