BGA Solder Ball
 
BGA Devices   Maximum Ball Count Chart  Elastomer Core Solder Ball   Home

 
BGA Solder Ball

Standard Lead Free Alloy RoHS (Pb Free)
Ref. Composition Typical
Device Types
Special
Order
RoHS
SAC305 Sn96.5 Ag3.0 Cu0.5 BGA - RoHS
Minimum Order 250K pcs
 
 
Special Lead Free Alloy RoHS (Pb Free)
Ref. Alloy Typical
Device Types
Available
Special Order
RoHS
SAC101 Sn98.9 Ag1.0 Cu0.1 None Yes RoHS
SAC105 Sn98.5 Ag1.0 Cu0.5 Wafer Level Yes RoHS
SAC125 Sn98.3 Ag1.2 Cu0.5 None Yes RoHS
SAC125+Ni Sn 98.25 Ag 1.2 Cu 0.5 Ni 0.05 None Yes RoHS
SAC266 Sn96.8 Ag2.6 Cu0.6 None Yes RoHS
SAC300 Sn96.95 Ag3.0 Cu0.05 None Yes RoHS
SAC307 Sn96.3 Ag3.0 Cu0.7 None Yes RoHS
- Sn80.8 Sb18 Ni1.2 None Yes RoHS
- Sn98.9 Ag1.0 Cu0.5 None Yes RoHS
SAC350 Sn96.45 Ag3.5 Cu0.05 None Yes RoHS
SAC387 Sn95.5 Ag3.8 Cu0.7 None Yes RoHS
SAC400 Sn95.95 Ag4.0 Cu0.05 None Yes RoHS
SAC405 Sn95.5 Ag4.0 Cu0.5 Legacy Yes RoHS
Sn96 Sn96.5 Ag3.5 Legacy Yes RoHS
Minimum Order 250K pcs
 
 
Non Lead Free Alloy
Ref. Composition Typical
Device Types
Special Order  
Sn63 Sn63 Pb37 BGA -  
Sn62 Sn62 Pb36 Ag2.0 BGA CBGA  
Sn10 Sn10 Pb90 - CBGA  
Minimum Order 250Kpcs
 
 
Ball Diameter
Ø Ball Dia
(mm)
Ø Ball Dia
(Mil)
Standard
BGA Pitch
Alternative
BGA Pitch
Ø Ball Diam
Toleranc
Pre-Reflow
0.76mm 30 mil 1.27 ~ 1.5mm - ±15µm
0.635mm 25 mil 1.0mm - ±15µm
0.61mm 24 mil 1.0mm - ±15µm
0.50mm 20 mil 1.0mm 0.8mm ±10µm
0.45mm 18 mil 0.8mm 1.0mm ±10µm
0.406mm 16 mil 0.8mm 1.0mm ±10µm
0.35mm 14 mil 0.65 ~ 0.75mm - ±10µm
0.30mm 12 mil 0.5mm - ±10µm
0.25mm 10mil 0.4mm - ±10µm
0.20mm 8mil 0.3mm - ±10µm
0.15mm 6mil - - ±10µm
0.10mm 4mil - - ±5µm
Other Ball Diameters Avialable:
 
 



TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: Info

©2017 TopLine. All Rights Reserved.
Home