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BGA Solder Ball

Standard Lead Free Alloy (Pb Free)
    SAC Composition Typical Device Types Special Order RoHS
SAC305 Sn96.5 Ag3.0 Cu0.5 BGA, LBGA, PBGA, CBGA - RoHS
RoHS = Lead Free
 
Special Lead Free Alloy (Pb Free)
Ref. Composition Typical Device Types Special Order RoHS
SAC101 Sn98.9 Ag1.0 Cu0.1 None Yes RoHS
SAC105 Sn98.5 Ag1.0 Cu0.5 Wafer Level Yes RoHS
SAC125 Sn98.3 Ag1.2 Cu0.5 None Yes RoHS
SAC125+Ni Sn 98.25 Ag 1.2 Cu 0.5 Ni 0.05 None Yes RoHS
SAC266 Sn96.8 Ag2.6 Cu0.6 None Yes RoHS
SAC300 Sn96.95 Ag3.0 Cu0.05 None Yes RoHS
SAC307 Sn96.3 Ag3.0 Cu0.7 None Yes RoHS
- Sn80.8 Sb18 Ni1.2 None Yes RoHS
- Sn98.9 Ag1.0 Cu0.5 None Yes RoHS
SAC350 Sn96.45 Ag3.5 Cu0.05 None Yes RoHS
SAC387 Sn95.5 Ag3.8 Cu0.7 None Yes RoHS
SAC400 Sn95.95 Ag4.0 Cu0.05 None Yes RoHS
SAC405 Sn95.5 Ag4.0 Cu0.5 Legacy Yes RoHS
Sn96 Sn96.5 Ag3.5 Legacy Yes RoHS
RoHS = Lead Free
 
Non Lead Free Alloy
Ref. Composition Typical Device Types Special Order  
Sn63 Sn63 Pb37 Available -  
Sn62 Sn62 Pb36 Ag2.0 - CBGA  
Sn10 Sn10 Pb90 - CBGA  
 
 
Ball Diameter
Ball (mm) Ball (Mil) Typical BGA Pitch Special BGA Pitch  
0.76mm 30 mil 1.27 ~ 1.5mm -  
0.635mm 25 mil 1.0mm -  
0.50mm 20 mil 1.0mm 0.8mm  
0.45mm 18 mil 0.8mm 1.0mm  
0.406mm 16 mil 0.8mm 1.0mm  
0.35mm 14 mil 0.65 ~ 0.75mm -  
0.30mm 12 mil 0.5mm 0.65 ~ 0.75mm  
0.25mm 10mil 0.4mm -  
0.20mm 8mil 0.3mm -  
0.15mm 6mil - -  
0.10mm 4mil - -  
Typical Sphere Tolerance (pre-reflow):
0.635~0.760mm = +/- 0.015mm
0.200~0.600mm = +/- 0.010mm
0.100~0.150mm = +/- 0.005mm
 



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