Flip Chips With Daisy Chain   Useful Links:  Flip Chip Catalog     Practice PC Boards     Part Number System     More Wire bondable Test Die      Quartz Die For Underfill Experiments   Example Full Array With Daisy Chain Example Perimeter With Daisy Chain Flip Chips with Daisy Chain (Eutetic and SAC Bumps) Bumps Bump Matrix Pitch Die Size (mm) Bump Size Height Diameter Tray Qty Eutectic Sn63/Pb37 Order Number Pb-Free Lead Free SAC - Sn/Ag/Cu Order Number Ref Quick View 48 12x12 Perimeter 18mil 457µm 6.3mm 140µm ø178µm 25pcs Waffle 2" FC48D6.3E457-DC FC48D6.3C457-DC FBT250 88 22x22 Perimeter 8 mil 204µm 5.08mm 107µm ø102µm 36 Waffle 2" FC88G5.08E204-DC FC88G5.08E204-DC PB08 96 24x24 Perimeter 18 mil 457µm 12.7mm 140µm ø178µm 25pcs Waffle 4" FC96D12.7E457-DC FC96D12.7C457-DC FBT500 112 28x28 Perimeter 6 mil 152µm 5.08mm 185µm ø88µm 36pcs Waffle 2" FC112K5.08E152-DC FC112K5.08C152-DC PB06 176 44x44 Perimeter 8mil 204µm 10mm 107µm ø102µm 49pcs Waffle 4" FC176G10E204-DC FC176G10C204-DC PB08 x4 220 44x66 Perimeter 8mil 204µm 10mm x 15mm 107µm ø102µm 20pcs Waffle 4" FC220G10x15E204-DC FC220G10x15C204-DC PB08 x6 317 18x18 Full Array 10 mil 254µm 5.08mm 119µm ø102µm 36pcs Waffle 2" FC317G5.08E254-DC FC317G5.08C254-DC FA10 1268 36x36 Full Array 10 mil 254µm 10mm 119µm ø102µm 49pcs Waffle 4" FC1268G10E254-DC FC1268G10C254-DC FA10 x4 2853 54x54 Full Array 10 mil 254µm 15mm 119µm ø102µm 16pcs Waffle 4" FC2853G15E254-DC FC2853G15C254-DC FA10 x9 5072 72x72 Full Array 10 mil 254µm 20mm 119µm ø102µm 9pcs Waffle 4" FC5072G20E254-DC FC5072G20C254-DC FA10 x16

General Specifications: Die thickness: Standard 24 mil (600~650µm). Thin die (back grinding) to 8mils (200µm) available on special order. 6mils (150µm) available on "as-is" basis with yield loss.   UBM Al/NiV/Cu: Total Thickness: 16K Å  Al= 4K Å / NiV= 4K Å / Cu= 8K Å Metal Thickness: 8.9K Å   (Pitch 152µm)    17K Å   (Pitch 204~457µm) Passivation Thickness: 8K Å   (Pitch 152~204µm)    10K Å   (Pitch 254~457µm)   Standard Passivation Type: Nitride   Optional Polyimide Passivation provides: Stress relief, scratch protection, promotes better adhesion to reduce chance of delamination.   Options and Accessories: Quartz die available with and without bumps (without daisy chain) 5-inch wafers available for all items. Tape and reel (T&R) packaging available special order.   Geometries   UBM   Bumps             Unbumped Die (Al Pads) with Daisy Chain and Passivation Openings for Wire Bonding Pads Pad Matrix Pitch Die Size (mm) Passivation Opening Diameter Tray Qty Metal Backing For Eutectic Soldering Mount with Die Attach Adhesives Order Number Ref Quick View 48 12x12 Perimeter 18mil 457µm 6.3mm 100~150µm 25pcs Waffle 2" FCN48D6.3A457M-DC FCN48D6.3A457-DC FBT250 88 22x22 Perimeter 8 mil 204µm 5.08mm 80~100µm 36 Waffle 2" FCN88G5.08A204M-DC FCN88G5.08A204-DC PB08 112 28x28 Perimeter 6 mil 152µm 5.08mm 55~86µm 36pcs Waffle 2" FCN112K5.08A152M-DC FCN112K5.08A152-DC PB06 176 44x44 Perimeter 8mil 204µm 10mm 80~100µm 49pcs Waffle 4" FCN176G10A204M-DC FCN176G10A204-DC PB08 x4 Geometries     See 12 more wire bondable Test Die

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