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Mechanical Dummy Die | ||
Mirrored and Etched Patterns | ||
Experimental use in Lab | ||
Variety of Applications | ||
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Bare Die Part Numbering System | ||||||
MD | - | 5.0x3.5 | - | BG250 | - | W |
Die Type | - | Size in millimeter | - | Back Grinding Thickness µm |
Packaging | |
Mirrored Dummy Die MD=Single Die WMD=Sawn Wafer Pattern Etched Die ED=Single Die WED=Sawn Wafer |
- | All sizes available 0.25 ~ 25mm Square Die: 1.0 = 1.0mm SQ 2.5 = 2.5mm SQ Etc Rectangule Die: 5.0x3.5 = 5.0x3.5mm 10x7.5 = 10x7.5mm Etc |
- | Blank= No Backgrinding BG100=100µm BG250=250µm BG300=300µm All thickness available |
MD & ED series: Packed in Tray W = Waffle Pack 2-inch P = Waffle Pack 4-inch WMD & WED series: Diced on Tape H8 = 8-inch Plastic Hoop NT8 = 8-inch Nitto Tape & Ring UV8 = 8-inch UV Tape & Ring UV12 = 12-inch UV Tape & Ring |
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Variety of options and packaging are available. Tell us your application. |
Die and Wafer Ordering | |||||
Mirrored Die Single Waffle Pack |
Pattern Die Single Waffle Pack |
Mirrored Die Sawn Wafer Tape & Ring |
Pattern Die Sawn Wafer Tape & Ring |
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MD-mm x mm-BG300-W BG back grind optional Packed in 2-inch Waffle Tray |
ED-mm x mm-BG300-P BG back grind optional Packed in 4-inch Waffle Tray |
WMD-mm x mm-BG300-UV8 BG back grind optional Cured UV Tape 8-inch Metal Ring |
WED-mm x mm-BG300-UV12 BG back grind optional Cured UV Tape 12-inch Metal Ring |
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Back grinding available all thicknesses. Variety of packaging options are available. Tell us your application. | |||||
Related Links: Wafer Test Die Flip Chip |
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TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 • Fax: 1-478-451-3000 Email: sales@topline.tv • Home |