Mirrored & Patterned
Dummy Die
 
 
Mechanical Dummy Die
Mirrored and Etched Patterns
Experimental use in Lab
Variety of Applications
 
Go to Wafer

Example Die with Etch Patterns

 Quick Specs:
Material: Si (Silicon)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks
 
Bare Die Part Numbering System
MD - 5.0x3.5 - BG250 - W
Die Type - Size in millimeter - Back Grinding
Thickness µm		   Packaging
Mirrored Dummy Die
MD=Single Die
WMD=Sawn Wafer

Pattern Etched Die
ED=Single Die
WED=Sawn Wafer		 - All sizes available
0.25 ~ 25mm

Square Die:
1.0 = 1.0mm SQ
2.5 = 2.5mm SQ
Etc

Rectangule Die:
5.0x3.5 = 5.0x3.5mm
10x7.5 = 10x7.5mm
Etc		 - Blank= No Backgrinding

BG100=100µm
BG250=250µm
BG300=300µm

All thickness available		   MD & ED series:
Packed in Tray
W = Waffle Pack 2-inch
P = Waffle Pack 4-inch

WMD & WED series:
Diced on Tape
H8 = 8-inch Plastic Hoop
NT8 = 8-inch Nitto Tape & Ring
UV8 = 8-inch UV Tape & Ring
UV12 = 12-inch UV Tape & Ring
Variety of options and packaging are available. Tell us your application.
 
Die and Wafer Ordering
Mirrored Die
Single
Waffle Pack		 Pattern Die
Single
Waffle Pack		 Mirrored Die
Sawn Wafer
Tape & Ring		 Pattern Die
Sawn Wafer
Tape & Ring
MD-mm x mm-BG300-W
BG back grind optional
Packed in
2-inch Waffle Tray		 ED-mm x mm-BG300-P
BG back grind optional
Packed in
4-inch Waffle Tray		 WMD-mm x mm-BG300-UV8
BG back grind optional
Cured UV Tape
8-inch Metal Ring		 WED-mm x mm-BG300-UV12
BG back grind optional
Cured UV Tape
12-inch Metal Ring
Back grinding available all thicknesses. Variety of packaging options are available. Tell us your application.
 
Related Links:
Wafer   Test Die   Flip Chip  


TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
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