Die mechanical dummy Si silcon die: mirrored, polished or with etched patterns. Wafer or singulated sawn die. We backgrind to thickness you require. For experimental use in the lab for dicing practice, pick and place, wire-bonding practice. Daisy chain available. MD , ED, WMD, WED series. MD-3X1.5 BG304-WP2 , MD.89X.87-304-UH8 , 181263

		Mirrored & Patterned Dummy Die

Mechanical Dummy Die

Mirrored and Etched Patterns

Experimental use in Lab

Variety of Applications

Go to Wafer

Example Die with Etch Patterns

Quick Specs:
Material: Si (Silicon)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks


Bare Die Part Numbering System
MD	-	5x5mm	-	BG250	-	WP2
Die Type	-	Size in millimeter	-	Back Grinding Thickness µm		Packaging
Mirrored Dummy Die MD=Singulated WMD=Wafer Format Etched Die ED=Singulated WED=Wafer Format	-	All sizes available 0.25 ~ 25mm	-	Blank= No Backgrinding BG100=100µm BG250=250µm BG300=300µm All thickness available		MD & ED series: Packed in Tray WP2 = Waffle Pack 2-inch WP4 = Waffle Pack 4-inch WMD & WED series: Diced on Tape H = Hoop NTR = Nitto Tape & Ring UVR = UV Tape & Ring

Variety of options and packaging are available. Tell us your application.


Die Ordering Information
Mirrored Die Singulated Waffle Pack	Etched Die Singulated Waffle Pack	Mirrored Die Sawn Wafer Tape & Ring	Etched Die Sawn Wafer Tape & Ring
MD-mm x mm-BG300-WP2 BG back grind optional	ED-mm x mm-BG300-WP2 BG back grind optional	WMD8-mm x mm-BG300-NTR BG back grind optional	WED8-mm x mm-BG300-NTR BG back grind optional

Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.


Related Links: Wafer Test Die Flip Chip
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