Mirrored & Patterned
Dummy Mechanical Si Wafers
 
 
 
Mechanical Dummy Wafers and Die
Mirrored and Etched Patterns
Experimental use in Lab
Variety of Applications
 
Go to Dummy Die
Quick Specs:
Wafer Material: Si (Silicon)
Wafer size 4~12 inch (100~300mm)
Die size 0.25mm to 25mm
Thickness 100~725 µm

Use and Applications:
Laboratory testing
Evaluation
Prototype
Placement
Optimization

Availability:
Delivery Stock to 4 weeks

Wafer Flats, Dimensions & Thickness:
SEMI SPEC M1-0302
 
Unsawn Wafer Part Numbering System
WM 8 - BG250 - C
Wafer Type Size Code Inch   Back Grinding
Thickness µm		   Packaging
WM=Wafer
Mirrored
Dummy
(Unsawn)

WE=Wafer
Etched
Patterned
(Unsawn)		 4-inch (100mm)
5-inch (125mm)
6-inch (150mm)
8-inch (200mm)
12-inch (300mm)		   BG75=75µm
BG100=100µm
BG200=200µm
BG300=300µm
BG500=500µm

Blank= No Backgrinding

All thickness available		   C = Cassette
J = Jar (Coin Stack)
B = Bulk Coin Stack
H = Hoop
NT = Nitto Tape & Ring
UV = UV Tape & Ring
Variety of options are available.
Order Quantity: 1= 1 Full Wafer, 2=2 Full Wafers, 5= 5 Full Wafers, etc
Please tell us your application.
 
Sawn Wafer Part Numbering System
WMD - 1.0 - BG250 - UV8
Wafer Type   Die Size (mm)   Back Grinding
Thickness µm		   Packaging
WMD=Wafer
Mirrored Die
(Sawn)

WED=Wafer
Etched Die
(Sawn)		   Example:
1.0 = 1.0mm SQ
2.5 = 2.5mm SQ
5.0 = 5.0mm SQ
12 = 12mm SQ

2.3x5.1 =
2.3mm x5.1mm
Rectangle

All Sizes Available		   Example:
BG75=75µm
BG100=100µm
BG200=200µm
BG300=300µm
BG500=500µm

Blank= Not Specified


All thickness available		   Sawn Wafer:
NH8 = Plastic Hoop 8" Ring (Non-UV)

UH8 = Plastic Hooop 8" Ring (UV Tape)

NT8 = Dicing Tape 8" Ring
Disco FF108  •  K&S FF105

NH8 = Plastic Hoop 8" Ring

NT12 = Dicing Tape 12" Ring

UV8 = UV Tape 8" Ring
Disco FF108  •  K&S FF105

UV12 = UV Tape 12" Ring
Variety of options are available.
Order Quantity: 1= 1 Full Wafer, 2=2 Full Wafers, 5= 5 Full Wafers, etc
Please tell us your application.
 
Single Die Part Numbering System
MD - 4.7x8.0 - BG250 - W
Die Type - Size in millimeter   Back Grinding
Thickness µm		   Packaging
MD=Mirrored
Die

ED=Etched
Patterned Die

GD=Glass Die
2000Å Ra (0.2μm)		   Example Square Die:
0.6 = 0.6mm SQ
1.0 = 1.0mm SQ
2.5 = 2.5mm SQ
5.0 = 5.0mm SQ
12 = 12mm SQ

Example Rectangle Die
2.3x5.1 =
2.3mm x5.1mm

All Sizes Available
0.25 ~ 25mm		   Blank= No Backgrinding

BG100=100µm
BG200=200µm
BG300=300µm

All thickness available		   W = Waffle Pack 2-inch
P = Waffle Pack 4-inch

H = Hoop
NTR = Nitto Tape & Ring
UV = UV Tape & Ring

NH8 = Plastic Hoop 8" Ring (Non-UV)
UH8 = Plastic Hooop 8" Ring (UV Tape)

NT8 = Dicing Tape 8" Ring
Disco FF108  •  K&S FF105

NH8 = Plastic Hoop 8" Ring

UV8 = UV Tape 8" Ring
Disco FF108  •  K&S FF105

NT12 = Dicing Tape 12" Ring
UV12 = UV Tape 12" Ring
Variety of options and packaging are available.
Order Quantity = Sold by number of die
Glass Die is translucent with slight haze (Not completely transparent).
Tell us your application.
 
Wafer & Die Ordering Information
Wafer Size Wafer
Jar		 Wafer
Cassette		 Wafer
Tape & Ring		 Die
Sawn Wafer
Tape & Ring		 Die
Singulated
Waffle Pack
4-Inch
100mm		 WM4-J
Mirrored Wafer

WE4-J
Etched Wafer		 WM4-C
Mirrored Wafer

WE4-C
Etched Wafer		 WM4-NTR
Mirrored Wafer

WE4-NTR
Etched Wafer		 WMD4-mm x mm-NTR
Mirrored Wafer

WED4-mm x mm-NTR
Etched Wafer		 MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
5-Inch
125mm		 WM5-J
Mirrored Wafer

WE5-J
Etched Wafer		 WM5-C
Mirrored Wafer

WE5-C
Etched Wafer		 WM5-NTR
Mirrored Wafer

WE5-NTR
Etched Wafer		 WMD5-mm x mm-NTR
Mirrored Wafer

WED5-mm x mm-NTR
Etched Wafer		 MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
6-Inch
150mm		 WM6-J
Mirrored Wafer

WE6-J
Etched Wafer		 WM6-C
Mirrored Wafer

WE6-C
Etched Wafer		 WM6-NTR
Mirrored Wafer

WE6-NTR
Etched Wafer		 WMD6 - mm x mm-NTR
Mirrored Wafer

WED6 - mm x mm-NTR
Etched Wafer		 MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
8-Inch
200mm		 WM8-J
Mirrored Wafer

WE8-J
Etched Wafer		 WM8-C
Mirrored Wafer

WE8-C
Etched Wafer		 WM8-NTR
Mirrored Wafer

WE8-NTR
Etched Wafer		 WMD8 - mm x mm-NTR
Mirrored Wafer

WED8 - mm x mm-NTR
Etched Wafer		 MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
12-Inch
300mm		 WM12-J
Mirrored Wafer

WE12-J
Etched Wafer		 WM12-C
Mirrored Wafer

WE12-C
Etched Wafer		 WM12-NTR
Mirrored Wafer

WE12-NTR
Etched Wafer		 WMD12 - mm x mm-NTR
Mirrored Wafer

WED12 - mm x mm-NTR
Etched Wafer		 MD - mm x mm-W
Mirrored Die

ED - mm x mm-W
Etched Die
Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.
 
 
 
Example CUT Mirrored Wafer Ordering Information
Wafer
Size		 Die Size Center to Center
Pick Location		 Kerf Thickness Packaging Qty Die Order Number
8-Inch
200mm		 600 um x 300 um
0.60 x 0.30mm		 634 um x 334 um 34 um 260 um
10.2 mil		 Wafer Ring
Cured UV Tape		 135,000 pcs WMD-.6x.3-BG260-UV8
8-Inch
200mm		 1000 um x 1000 um
1.0 x 1.0mm		 1044 um x 1044um 44um 250 um
10 mil		 Wafer Ring
Cured UV Tape		 26,00 pcs WMD8-1x1-BG250-NTR
Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.
Cut line across entire surface of Mirrored Wafer. No metal patterns. No fiducials.
 
 
 
Example Wafer Template for Alignment
Wafer
Size		 Die Size Die
Pick
Location		 Alignment
Scribe Kerf		 Wafer
Thickness		 Packaging Wafer Flat Order Number DWG
Number
8-Inch
200mm		 22.0 x 22.0mm Center
of Wafer		 44 um 500 um
20 mil		 Jar Primary Flat WM8-BG500-ALIGN 174100
Back grinding available all thicknesses. Variety of options and packaging are available. Tell us your application.
Cut alignment trench across entire surface of Mirrored Wafer. No metal patterns. No fiducials.
 
 
Related Links:
Dummy Die   Test Die   Flip Chip  


TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000
Email: sales@topline.tv  •   Home