Flip Chips With Daisy Chain   Useful Links:  Practice PC Boards     Part Number System     More Wire bondable Test Die      Quartz Die For Underfill Experiments   Example Full Array With Daisy Chain Example Perimeter With Daisy Chain   Flip Chips with Daisy Chain (Eutectic and SAC Bumps) Bumps Bump Matrix Pitch Die Size (mm) Bump Height UBM øDia Tray Qty Eutectic Sn63/Pb37 Order Number Lead Free SAC - Sn/Ag/Cu Order Number Ref Quick View 88 22x22 Perimeter 204µm 5.08mm 107µm ø102µm 36 Waffle 2" FC88G5.08E204-DC FC88G5.08C204-DC PB08 112 28x28 Perimeter 152.5µm 5.08mm 85µm ø88µm 36pcs Waffle 2" FC112K5.08E152-DC FC112K5.08C152-DC PB06 176 44x44 Perimeter 204µm 10.2mm 107µm ø102µm 49pcs Waffle 4" FC176G10E204-DC FC176G10C204-DC PB08 x4 220 44x66 Perimeter 204µm 10mm x 15mm 107µm ø102µm 20pcs Waffle 4" FC220G10x15E204-DC FC220G10x15C204-DC PB08 x6 317 18x18 Full Array 254µm 5.08mm 125µm ø102µm 36pcs Waffle 2" FC317G5.08E254-DC FC317G5.08C254-DC FA10 484 22x22 Full Array 200µm 5.0mm 74µm ø102µm 36pcs Waffle 2" - FC484G5C200-DC - 569 24x24 Full Array 204µm 5.08mm 89µm ø102µm 36pcs Waffle 2" FC569G5E204-DC FC569G5C204-DC FA08 1268 36x36 Full Array 254µm 10.2mm 125µm ø102µm 49pcs Waffle 4" FC1268G10E254-DC FC1268G10C254-DC FA10 x4 1936 44x44 Full Array 200µm 10mm 74µm ø102µm 49pcs Waffle 4" - FC1936G10C200-DC FC484 x4 2276 48x48 Full Array 204µm 10mm 89µm ø102µm 9pcs Waffle 2" FC2276G10E204-DC FC2276G10C204-DC 4xFA08 2904 44x66 Full Array 200µm 10x15mm 74µm ø102µm 24pcs Waffle 4" - FC2904G10x15C200-DC FC484 x6 3844 62x62 Full Array 150µm 10mm 65µm ø65µm 49pcs Waffle 4" - FC3844G10C150-DC FC3844 4356 66x66 Full Array 200µm 15mm 74µm ø102µm 16pcs Waffle 4" - FC4356G15C200-DC FC484 x9 7744 88x88 Full Array 200µm 20mm 74µm ø102µm 9pcs Waffle 4" - FC7744G20C200-DC FC484 x16

General Specifications:

Die thickness: Standard 24 mil (600~650µm). Thin die (back grinding) to 8mils (200µm) available on special order. 6mils (150µm) available on "as-is" basis with yield loss.

UBM Al/NiV/Cu: Total Thickness: 16K Å  Al= 4K Å / NiV= 4K Å / Cu= 8K Å

Metal Thickness: 8.9K Å   (Pitch 152µm)    17K Å   (Pitch 204~457µm)

Passivation Thickness: 8K Å   (Pitch 152~204µm)    10K Å   (Pitch 254~457µm)

Standard Passivation Type: Nitride

Optional Polyimide Passivation provides: Stress relief, scratch protection, promotes better adhesion to reduce chance of delamination.

Flip Chips (Copper Pillar with SnAg Solder Cap) Bumps Bump Matrix Pitch Die Size (mm) Bump Height øDia Packaging Copper Pillar Lead Free Solder Cap Sn/Ag Order Number Ref Quick View 245,000 ~495x495 Full Array 40µm 20x20mm 30µm 20µm Gel-Pak 4pcs ----- 4" Waffle Pack 9pcs ---- 12" Cassette or Ring 148 die FC245K20C40-I FC250K 157,609 397x397 Full Array 50µm 20x20mm 23µm 25µm Gel-Pak 4pcs ----- 4" Waffle Pack 9pcs ---- 8" Cassette or Ring 52 die FC157K20C50-I FC157K 2,213 Chip 800,000 8" Wafer Dual Pitch Micro Bump 40/100µm 10x7.1mm 16µm ø22µm Gel-Pak 16pcs ----- 4" Waffle Pack 16pcs ---- 8" Cassette or Ring 360 die FC2213K10x7C40 FC2K 2,213 Chip 1.9 Million 12" Wafer Dual Pitch Micro Bump 40/100µm 10x7.1mm 16µm ø22µm 12" Cassette or Ring 876 die FCW2213K10x7C40A FC2K 39,601 199x199 Full Array 100µm 20x20mm 37µm ø50µm Gel-Pak 4pcs ----- 4" Waffle Pack 9pcs ---- 8" Cassette or Ring with 52 die FC39K20C100-I FC39K 64 8x8 200µm 2x2mm 100µm ø100µm 4" Waffle Pack 400 pcs ---- 8" Cassette or Ring with 7020 die WLP64T.2P-DC088 1x WLP64 256 16x16 200µm 4x4mm 100µm ø100µm 4" Waffle Pack 196 pcs ---- 8" Cassette or Ring with 1968 die WLP256T.2P-DC168 4x WLP64 576 24x24 200µm 6x6mm 100µm ø100µm 4" Waffle Pack 121 pcs ---- 8" Cassette or Ring with 732 die WLP576T.2P-DC248 9x WLP64 1024 32x32 200µm 8x8mm 100µm ø100µm Gel-Pak ---- 4" Waffle Pack 64pcs ---- 8" Cassette or Ring with 401 die WLP1024T.2P-DC328 16x WLP64 1600 40x40 200µm 10x10mm 100µm ø100µm Gel-Pak --- 4" Waffle Pack 49pcs ---- 8" Cassette or Ring with 256 die WLP1600T.2P-DC407 25x WLP64 2304 48x48 200µm 12x12mm 100µm ø100µm Gel-Pak ---- 4" Waffle Pack 36pcs ---- 8" Cassette or Ring with 164 die WLP2304T.2P-DC487 36x WLP64 3136 56x56 200µm 14x14mm 100µm ø100µm Gel-Pak ----- 4" Waffle Pack 25pcs ---- 8" Cassette or Ring with 120 die WLP3136T.2P-DC567 49x WLP64 4096 64x64 200µm 16x16mm 100µm ø100µm Gel-Pak ----- 4" Waffle Pack 16pcs ---- 8" Cassette or Ring with 88 die WLP4096T.2P-DC647 64x WLP64     Packaging Options Quartz die available with and without bumps (without daisy chain) 5-inch wafers available for all items. Tape and reel (T&R) packaging available special order.   Wafer Box Cassette (Closed) Wafer Shipper (Open) Rotatable Model Rotatable Model     Geometries  •   UBM  •   Bumps  •   Eutectic Properties         TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 Email: sales@topline.tv ©2020 TopLine. All Rights Reserved.