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| General Specifications: |
Die thickness: Standard 24 mil (600~650µm).
Thin die (back grinding) to 8mils (200µm) available on special order.
6mils (150µm) available on "as-is" basis with yield loss. |
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| UBM Al/NiV/Cu: Total Thickness: 16K Å Al= 4K Å / NiV= 4K Å / Cu= 8K Å |
| Metal Thickness: 8.9K Å (Pitch 152µm) 17K Å (Pitch 204~457µm) |
| Passivation Thickness: 8K Å (Pitch 152~204µm) 10K Å (Pitch 254~457µm) |
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| Standard Passivation Type: Nitride |
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Optional Polyimide Passivation provides:
Stress relief, scratch protection, promotes better adhesion to reduce chance of delamination. |
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Rotatable Model
