|
General Specifications: |
Die thickness: Standard 24 mil (600~650µm). Thin die (back grinding) to 8mils (200µm) available on special order. 6mils (150µm) available on "as-is" basis with yield loss. |
|
UBM Al/NiV/Cu: Total Thickness: 16K Å Al= 4K Å / NiV= 4K Å / Cu= 8K Å |
Metal Thickness: 8.9K Å (Pitch 152µm) 17K Å (Pitch 204~457µm) |
Passivation Thickness: 8K Å (Pitch 152~204µm) 10K Å (Pitch 254~457µm) |
|
Standard Passivation Type: Nitride |
|
Optional Polyimide Passivation provides: Stress relief, scratch protection, promotes better adhesion to reduce chance of delamination. |
|