Wire Bondable
Patterned Die
 
 
Test Die
Daisy Chain & Isolated Pads
Experimental use in Lab
Variety of Applications
 

Example Die with Patterns

Quick Specs:
Material: Si (Silicon)
Die size 1mm, 2.5mm & 4mm
Thickness 250 µm

Use and Applications:
Laboratory testing
Parasitic Evaluation
Wire bond practice
Optimization

Availability:
Delivery Stock to 4 weeks

 
Test Die Part Numbering System
TD 48 - 4mm - BG250 DC##
Die Type Number Pads - Size in millimeter - Back Grinding
Thickness µm
Circuit Pattern
TD=Test Die
Singulated
1 = Fully
Aluminized

16, 32, 64 , etc pads
- Size
1.0x1.0mm
2.5x2.5mm
4 x4mm
8 x8mm
12 x 12mm
etc.
- BG250=250µm DC## = Daisy Chain
ISO = Isolated Pads
GP = Ground Plane
FULL = Fully metalized
Variety of options and packaging are available. Tell us your application.
 
Die Ordering Information
Nbr Pads
Die Size
Daisy Chain
Circuit
Isolated Pads Ground Plane
Dual Circuit
Fully Metalized Qty in
Waffle Pack
16L
1.0x1.0mm
TD16-1mm-BG250-DC## TD16-1mm-BG250-ISO TD16-1mm-BG250-GP TD16-1mm-BG250-FULL 100
32L
2.5x2.5mm
TD32-2.5mm-BG250-DC## TD32-2.5mm-BG250-ISO TD32-2.5mm-BG250-GP TD32-2.5mm-BG250-FULL 100
48L
4.0x4.0mm
TD48-4mm-BG250-DC## TD48-4mm-BG250-ISO TD48-4mm-BG250-GP TD48-4mm-BG250-FULL 64
Back grinding available other thicknesses. Variety of options and packaging are available. Tell us your application.
 

Related Links:
Wafer   Dummy Die   Flip Chip  


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