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CCGA
Column Grid Array
 
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ABOUT CCGA: Column Grid Array (CCGA) packages provide a trusted solution for overcoming 10ppm/oC mismatch of coefficient of thermal expansion (CTE) between large ceramic IC packages and glass-epoxy printed circuit boards (PCB). Solder columns on CCGA packages are compliant and absorb strain in applications typically found in the fields of military, aerospace and defense where significantly varying temperatures, high vibration and shock are present.
 
CCGA484 CCGA624 CCGA896 CCGA1152 CCGA1272
 
Columns Matrix Pitch Size (mm) Dummy Die
Location
Pb80/Sn20
Cu Wrap Columns
Pb90/Sn10
Plain Columns
Micro-coil
Springs
Availability
484 22x22 1.0mm 23mm Inside CCGA484T1.0-DC225D
Model
CCGA484T1.0A-DC225D
Model
CCGA484T1.0M-DC225D
Model
Tooled
624 25x25 1.27mm 32.5mm Inside CCGA624T1.27-DC254D CCGA624T1.27A-DC254D CCGA624T1.27M-DC254D Tooled
717 27x27 1.27mm 35mm Inside CCGA717T1.27-DC275D
Model
CCGA717T1.27A-DC275D
Model
CCGA717T1.27M-DC275D
Model
Tooled
896 30x30 1.0mm 31mm Inside CCGA896T1.0-DC308D - - Tooled
1144 34x34 1.0mm 35mm Surface
Mount
CCGA1144T1.0-DC348D
Model
CCGA1144T1.0A-DC348D
Model
CCGA1144T1.0M-DC348D
Model
Tooled
1152 34x34 1.0mm 35mm Inside CCGA1152T1.0-DC346D
Model
CCGA1152T1.0A-DC346D
Model
CCGA1152T1.0M-DC346D
Model
Photos: 1  2  3  4  5
Tooled
1272 36x36 1.0mm 37.5mm Inside CCGA1272T1.0-DC367D CCGA1272T1.0A-DC367D CCGA1272T1.0M-DC367D Tooled
1657 41x41 1.0mm 42.5mm Surface
Mount
CCGA1657T1.0-DC417D
Model
CCGA1657T1.0A-DC417D
Model
CCGA1657T1.0M-DC417D
Model
Tooled
1752 42x42 1.0mm 45mm Surface
Mount
CCGA1752T1.0-DC427CN
Model
CCGA1752T1.0A-DC427CN
Model
CCGA1752T1.0M-DC427CN
Model
Tooled
 
 
 
 
 
3D Model

3D Model

3D Model

3D Model
Columns Matrix Pitch Size (mm) Dummy Die
Location
Pb80/Sn20
Cu Wrap Columns
Pb90/Sn10
Plain Columns
Micro-Coil
Spring
PDF
Outline
Drawing
255 16x16 1.27mm 21mm Inside - CCGA255T1.27A-DC161D - Under Development
349 19x19 1.27mm 25mm Inside - CCGA349T1.27A-DC19_D - Under Development
360 19x19 1.27mm 25mm Inside - CCGA360T1.27A-DC198D - Under Development
472 22x22 1.27mm 31mm Inside - CCGA472T1.27A-DC226D - Under Development
517 23x23 1.27mm 32.5mm Surface
Mount
CCGA517T1.27-DC236D CCGA517T1.27A-DC236D - Under Development
517 23x23 1.27mm 31mm Surface
Mount
- CCGA517T1.27A-DC237D - Under Development
771 30x33 1.17/1.09mm 37.5mm Plastic
Substrate
WCGA771C
Model
WCGA771E
Model
- Under Development
1077 33x33 1.27mm 42.5mm Surface
Mount
CCGA1077T1.27-DC338F
Model
CCGA1077T1.27A-DC427F
Model
- Under Development
1140 34x34 1.0mm 35mm Surface
Mount
CCGA1140T1.0-DC345CN CCGA1140T1.0A-DC345CN CCGA1140T1.0M-DC345CN Under Development
1509 39x39 1.0mm 40mm Surface
Mount
CCGA1509T1.0-DC396F CCGA1509T1.0A-DC396F - Under Development
1588 40x40 1.27mm 52.5mm Surface
Mount
CCGA1588T1.27-DC407F CCGA1588T1.27A-DC407F - Under Development
2577 51x51 1.0mm 52.5mm Surface
Mount
CCGA2577T1.0-DC517F CCGA2577T1.0A-DC517F CCGA2577T1.0M-DC517F Under Development
 
 
 
 
CLGA - Ceramic Land Grid Array with Daisy Chain
Click to Enlarge
Columns Matrix Pitch Size (mm) Part Number Die
Location
Heat
Sink
Capacitors SolidWorks
Model
Images
484 22x22 1.0mm 23mm CLGA484T1.0-DC225D Inside No No Model Top  Bottom
624 25x25 1.27mm 32.5mm CLGA624T1.27-DC254D Inside No No - -
717 27x27 1.27mm 35mm CLGA717T1.27-DC275D Inside No No Model Top  Bottom
1144 34x34 1.0mm 35mm CLGA1144T1.0-DC348D Surface No No Model Top  Bottom
1152 34x34 1.0mm 35mm CLGA1152T1.0-DC346D Inside No No Model Top  Bottom
1272 36x36 1.0mm 37.5mm CLGA1272T1.0-DC367D Inside No No - -
1657 41x41 1.0mm 42.5mm CLGA1657T1.0-DC417 Without No No Model Top  Bottom
1657 41x41 1.0mm 42.5mm CLGA1657T1.0-DC417D Surface No No Model Top  Bottom
1752 42x42 1.0mm 45mm CLGA1752T1.0-DC427D Surface No No Model Top  Bottom
1752 42x42 1.0mm 45mm CLGA1752T1.0-DC427CN Surface Yes No Model Top  Bottom
 
 
 
CCGA Part Number System
 
    CCGA         1752         T         1.0         A         DC427         CN    
Package Type Nbr Pins Tray Pitch Column Type/Length   Daisy Chain Die Option
CCGA
Ceramic Column
Grid Array

CLGA
Ceramic Land
Grid Array

CG-FF
Plastic Grid Array
Flat Heat Spreader

CG-FC
Plastic Grid Array
Dome Heat Spreader
I/O Pads T = Tray

Standard
1.0 = 1.0mm
1.27 = 1.27mm

Pb80/Sn20 + Copper Wrap
Blank = 2.2mm (0.087")
B = 2.54mm (0.100")

Pb90/Sn10 Plain
A = 2.2mm (0.087")

Pb90/Sn10 + Copper
H = 2.2mm (0.087") Cu Wrap
E = 2.2mm (0.087") Cu Plated

Micro Coil Spring
M = Tin/Lead Fillet
G = Gold Plated + SAC305 Fillet
  Net List
Drawing Number
D=Dummy Die
Attached in Cavity
Under the Lid

F=Flip Chip Style
Suface Mount

CF=Flip Chip Style
Rectangular Heat Spreader

CF4=Flip Chip Style
Cloverleaf Heat Spreader

CN= Surface Mount
Dummy Die
Pedestal Heat Spreader
 
 
 
Kelvin DCR DC Resistance Test Method   •   NASA GSFC-STD-6001   •   PWB Land Pattern
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
        
 
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