|
|
| Columns |
Matrix |
Pitch |
Size (mm) |
Pb80/Sn20
Flat Lid |
Pb80/Sn20
Exposed
Dummy Die |
Pb90/Sn10
Flat Lid |
Pb90/Sn10
Exposed
Dummy Die |
Outline
Drawing |
| 255 |
16x16 |
1.27mm |
21mm |
CCGA255T1.27-DC161 |
CCGA255T1.27-DC161D |
CCGA255T1.27A-DC161 |
CCGA255T1.27A-DC161D |
|
| 360 |
19x19 |
1.27mm |
25mm |
CCGA360T1.27-DC198 |
CCGA360T1.27-DC198D |
CCGA360T1.27A-DC198 |
CCGA360T1.27A-DC198D |
|
| 472 |
22x22 |
1.27mm |
31mm |
CCGA472T1.27-DC225 |
CCGA472T1.27-DC225D |
CCGA472T1.27A-DC225 |
CCGA472T1.27A-DC225D |
|
| 517 |
23x23 |
1.27mm |
31mm |
 CCGA517T1.27-DC237 |
CCGA517T1.27-DC237D |
CCGA517T1.27A-DC237 |
CCGA517T1.27A-DC237D |
PDF |
| 624 |
25x25 |
1.27mm |
32.5mm |
CCGA624T1.27-DC257 |
CCGA624T1.27-DC257D |
CCGA624T1.27A-DC257 |
CCGA624T1.27A-DC257D |
PDF |
| 717 |
27x27 |
1.27mm |
35mm |
CCGA717T1.27-DC278 |
CCGA717T1.27-DC278D
|
CCGA717T1.27A-DC278
|
CCGA717T1.27A-DC278D |
PDF |
| 1089 |
33x33 |
1.27mm |
42.5mm |
CCGA1089T1.27-DC339 |
CCGA1089T1.27-DC339D |
CCGA1089T1.27A-DC339 |
CCGA1089T1.27A-DC339D |
|
| 1144 |
34x34 |
1.0mm |
35mm |
CCGA1144T1.0-DC347 |
CCGA1144T1.0-DC347D |
CCGA1144T1.0A-DC347 |
CCGA1144T1.0A-DC347D |
PDF |
| 1152 |
34x34 |
1.0mm |
35mm |
CCGA1152T1.0-DC346 |
CCGA1152T1.0-DC346D |
CCGA1152T1.0A-DC346 |
CCGA1152T1.0A-DC346D |
|
| 1247 |
31x41 |
1.0mm |
32.5x42.5mm |
CCGA1247T1.0-DC3141 |
CCGA1247T1.0-DC3141D |
CCGA1247T1.0A-DC3141 |
CCGA1247T1.0A-DC3141D |
|
| 1272 |
36x36 |
1.0mm |
37.5mm |
CCGA1272T1.0-DC367 |
CCGA1272T1.0-DC367D |
CCGA1272T1.0A-DC367 |
CCGA1272T1.0A-DC367D |
|
| 1588 |
40x40 |
1.27mm |
52.5mm |
CCGA1588T1.27-DC407 |
CCGA1588T1.27-DC407D |
CCGA1588T1.27A-DC407 |
CCGA1588T1.27A-DC407D |
|
| 1657 |
41x41 |
1.0mm |
42.5mm |
CCGA1657T1.0-DC417 |
CCGA1657T1.0-DC417D |
CCGA1657T1.0A-DC417 |
CCGA1657T1.0A-DC417D |
PDF |
| 2577 |
51x51 |
1.0mm |
52.5mm |
CCGA2577T1.0-DC517 |
CCGA2577T1.0-DC517D |
CCGA2577T1.0A-DC517 |
CCGA2577T1.0A-DC517D |
PDF |
| |
| |
Solder Columns
Shown with Fillet |
Pb80/Sn20
Solder Column
Rotatable
Model |
 Pb80/Sn20
Solder Column
Outline |
Pb90/Sn10
Solder Column
Rotatable
Model |
Pb90/Sn10
Solder Column
Outline |
|
| |
| |
| NASA GSFC-STD-6001: |
| IBM Solder Column: Pb90Sn10 2.21mm L x 0.51mm diameter and 1.62mm L x 0.89mm diameter. |
| Copper Wrapped Solder Column: Pb80Sn20, Sn-plated Cu Wrap, Sn63Pb37 Finish. 2.21mm L x 0.51mm diameter |
| |
| Component Inspection: |
| Colpanarity: Less than +/-0.15mm (0.0059-inch) |
| Single Column Tilt: An individual column shall not be bent more than 5° relative to other columns |
| Multiple Column Tilt: Tilt is acceptable if all columns are tilted uniformally up to maximum 10° |
| Visual Inspection: Use 10X magnification |
| |
| PWB Board Requirements: |
| PWB Board Material: Polyimide recommended due to lower CTE compared with epoxy-class boards. |
| PWB Allowed Finish: Tin-lead solder or Electroless-Nickel, Immersion Gold (ENIG). Maximum 0.254µm (10 micro-inch) gold. |
| PWB Prohibited Finish: Pure tin or other lead free surface plating is not allowed. |
| PWB Pad Diameter: Non-Solder Masked Defined pads (NSMD) minimum 120% of solder column diameter |
| PWB Component Courtyard: 0.3-inch (7.62mm) minimum clearance to allow sufficient clearance for rework. |
| |
| Assembly Requirements: |
| Underfill: Not allowed under the CCGA component. |
| Solder Paste Stencil: Laser cut stencils are recommend, instead of chem-etched stencils. |
| |
| Rework Requirements: |
| Prohibited Reuse of Columns: Columns shall not be reused even if they remain attached to the CCGA part after removal from the board. |
| |
| Process Validation Testing: |
| Electrical Continuity: Use daisy chained connections at -55°C , +100°C and +25°C to identify a failed attachment. |
| |
| |
