Complete Catalog




QFP Rework Tool
About Us
 
TopLine is the world's largest provider of daisy chain dummy components, test die and practice PC boards. TopLine assists thousands of customers define and refine their SMT and microelectronics assembly processes. Our fully-illustrated 160 page catalog includes over 1000 different dummy packages and practice kits. Expert application engineers are ready to offer solutions to your complex requirements.

SAVE MONEY
Dummy Components are a low cost way to define and refine your SMT assembly processes. TopLine offers same day shipping on most items.

TYPICAL APPLICATIONS
Our customers are constantly discovering new ways to use dummy components. Typical applications include machine evaluation, acceptance testing, solder training, temperature profiling, re-certification, prototype design, practice and demonstrations.

PRACTICE KITS
Whether you require special packaging or a custom PC Board designed, TopLine does all these efficiently and routinely. Gerber files to make solder-paste stencil are free.

EDUCATIONAL MATERIALS
We offer many training guides such as the SMD Nomenclature Book and Quick Study Dummy Components, and free component outline drawings and PC Board footprints from our Document Center.  And be sure to download our free library of 450 TopArt Clip Art illustrations of electronic components.



Founded in 1989, TopLine is the original "one-stop-shop" for daisy chain dummy components. TopLine has helped thousands of customers to define and refine their SMD assembly processes in 45 countries.

1989   TopLine offers QFP100 25mil pitch.
1990   TopLine introduces 0.5mm pitch QFP208.
1991   TopLine introduces TSOP
1992   TopLine introduces 0.4mm pitch QFP256.
1993   TopLine introduces practice PCB and kits.
1994   TopLine introduces TQFP 0.3mm pitch.
1995   TopLine introduces BGA Ball Grid Arrays and flip chips.
1996   TopLine adds CSP Chip Scale Packages including µBGA.
1997   TopLine launches website.
1998   TopLine adds 1.0mm pitch BGA.
1999   TopLine introduces 0.8mm pitch CSP.
2000   Wide range of "lead-free" components and 0.5mm pitch CSP.
2001   TopLine expands into ESD Products.
2002   TopLine moves to new headquarters.
2003   TopLine expands. Opens sales office in Georgia.
2004   TopLine opens BGA manufacturing facility.
2005   TopLine expands Lead Free (No-Pb) RoHS compatible products.
2006   TopLine opens BGA assembly in Silicon Valley facility.
2007   TopLine produces BGA 0.4mm daisy chain (No-Pb) RoHS.
2008   TopLine introduces Open Cavity QFN for microelectronics prototyping.
2009   TopLine expands facility near Altanta, Georgia.
2010   TopLine introduces WLP Series, wafer level WL-CSP with daisy chain.
2011   TopLine introduces eWLP Series, embedded die with daisy chain.
2012   TopLine introduces BGA 0.3mm pitch daisy chain.




TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA

Email: sales@TopLine.tv

Toll Free USA/Canada (800) 776-9888
Tel: 1-478-451-5000  •  Fax: 1-478-451-3000

©2012 TopLine. All Rights Reserved.