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Packaging Group		 Interposer
Connect LGA to PCB
With Compliant Columns
 
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Click to Enlarge 		Interposer: Compression mounting sockets or direct solderable interposers (Package on Package) with compliant columns absorbs CTE mismatch between the LGA and the PCB. Tin/Lead and Lead-Free available. Braided Columns or Copper Columns.

Features
  • Pin Count Up to 10,000 I/O
  • LGA Size: 4mm to 200mm
  • Column Alloy, Length and Ø Diameter. (See table)
    •
    Interposer
    Connects LGA to PCB with Solder Columns, Copper Columns or Micro-Coil Springs
    Model Number Pins
    I/O    		 Pitch
    ℄    		 Pad
    Matrix    		 X/Y Size
    LGA    		 Alloy
    Construction    		 Column
    ØDia    		 Column Length Device Type Compression
    Solderable    		 DWG Nbr
    Filled    		 Fig. 360°
    Solidworks
    Model
    IP30E20B8x40A 20 0.5mm 5x5 4x4mm Cu Pillar Ø0.20mm
    8 mil    		 1.0mm
    40mil    		 QFN20
    Plastic    		 Solderable 350520 Fig. 1 Model
    IP90U56B8x60A 56 0.5mm 14x14 8x8mm Pb90/Sn20
    Columns    		 Ø0.20mm
    8 mil    		 1.52mm
    60mil    		 QFN56
    Plastic    		 Solderable 351420 Fig. 3 Model
    IP31G56B8x60A 56 0.5mm 14x14 8x8mm Cu C194
    Columns    		 Ø0.20mm
    8 mil    		 1.52mm
    60mil    		 QFN56
    Plastic    		 Solderable 351421 Fig. 3 Model
    IP83C598G20x87A 598 2.0mm 37x31 75.0x63.5mm Pb80/Sn20
    Cu Wrap    		 Ø0.51mm
    20 mil    		 2.21mm
    87mil    		 CG598
    Ceramic
    Sony    		 Compression 337180 Fig. 2 Model
    IP94D1272E20x87A 1272 1.0mm 36x36 37.5x37.5mm Pb90/Sn10
    Cu Braided    		 Ø0.51mm
    20 mil    		 2.21mm
    87mil    		 CG1272
    Ceramic
    Microsemi    		 Compression 313681 Fig. 2 Model
    IP54R10000E16x87A 10000 1.0mm 100x100 100x100mm SAC305
    Cu Braided    		 Ø0.40mm
    16 mil    		 2.21mm
    87mil    		 CG10000
    Si Wafer    		 Solderable 319961 Model
    Note 1: Contact TopLine for assistance for Interposer configurations not shown above.
    Note 2: Column length: 1.0~2.5mm (40~100 mils).
     
     
     
    Example Column Interposers.
    Other sizes available.
    Fig. 1
    QFN 20 Pins
    Pitch 0.5mm - 4x4mm
    Solder Copper Column (PoP)    		 Fig. 2
    CLGA 1272 Pins
    Copper Braided Solder Columns
    Pitch 1.0mm - 37.5x37.5mm
    SMT Compression Socket
     
     
     
    Interposer
    Model Number System
        IP         9        4        C        1272         E         20     x     87         A    
    Series Alloy Construction Plating Nbr Pins Pitch Column Diameter
    Mils    		   Column Length
    Mils    		 Version
    FILLED With Columns:
    IP = Interposer
    CS = Conductive Spacer
    		 Code   •   Alloy
    3 = Cu Copper
    5 = In50/Pb50
    6 = Sn91.5/Sb8.5
    8 = Pb80/Sn20
    9 = Pb90/Sn10

    0 = TBA
    1 = TBA
    2 = TBA
    4 = TBA
    7 = TBA
    		 Code • Description
    0 = Bare (Plain)
    1 = Bump (1 Side)
    2 = Bump (2 Sides)
    3 = Cu Wrap
    4 = Cu Braid

     5 = TBA
    6 = TBA
    7 = TBA
    8 = TBA
    9 = TBA
    		 Code   •   Plating
    C = Cu Wrap (Sn/Pb)

    B = 16x Cu Braid (Sn/Pb)
    D = 32x Cu Braid (Sn/Pb)

    E = Cu Pillar (Sn/Pb)
    G = Gold (RoHS)

    H = 16x Cu Braid (RoHS)
    U = Unplated

    Code   •   Bump
    A = Sn63/Pb37
    S = SAC
    		 Pins • Matrix
    255 = 16x16
    349 = 19x19
    360 = 19x19
    472 = 22x22
    483 = 22x22
    484 = 22x22
    517 = 23x23
    624 = 25x25
    672 = 26x26
    717 = 27x27
    896 = 30x30
    1140 = 34x34
    1144 = 34x34
    1148 = 34x34
    1152 = 34x34
    1272 = 36x36
    1509 = 39x39
    1588 = 40x40
    1657 = 41x41
    1752 = 42x42
    2577 = 51x51
    		 Code • Pitch
    A = 0.4mm    
    B = 0.5mm    
    C = 0.65mm  
    D = 0.8mm    
    E = 1.0mm    
    F = 1.27mm
    G = 2.0mm
    H = 2.54mm
    K = 0.45mm

    Single Column:
    N = Not Defined

    Odd Pitch:
    V = 1.0mm Stagger
    W = 1.00/1.27mm
    Y = 1.17/1.09mm
    Z = Other    
    		 Code •     Metric
    Ø6 mil • 0.150mm
    Ø8 mil • 0.200mm
    Ø10mil • 0.250mm
    Ø12mil • 0.300mm
    Ø15mil • 0.380mm
    Ø16mil • 0.400mm
    Ø18mil • 0.450mm
    Ø20mil • 0.510mm
    Ø24mil • 0.610mm
    Ø30mil • 0.762mm
    Ø35mil • 0.890mm
    		  Code •   Metric
    40mil • 1.00mm
    50mil • 1.27mm
    62mil • 1.57mm
    87mil • 2.21mm
    91mil • 2.31mm
    93mil • 2.36mm
    95mil • 2.41mm
    100mil • 2.54mm
    110mil • 2.80mm
    145mil • 3.68mm
    150mil • 3.81mm
    		 Code
    A
    B
    C
    D
    E
     
     
    Drawing Number System
     
        3         1         36         8         0    
    Series Pitch Matrix Array Interconnect Diameter Version
    Interposer
    Code • Item Description
    3 = Interposer with Columns
    (Pcode BM1)
    		 PITCH
    Code • Pitch
    1 = 1.0mm  
    2 = 1.27mm
    3 = 2.00mm
    4 = 0.4mm  
    5 = 0.5mm  
    6 = 0.65mm
    8 = 0.8mm  
    9 = Special 
    0 = Hardware 









    		 Array Matrix
    Code • Matrix
    00 = 1x2
    01 = 1x1
    02 = 2x2
    19 = 19x19
    22 = 22x22
    24 = 24x24
    25 = 25x25
    26 = 26x26
    27 = 27x27
    30 = 30x30
    34 = 34x34
    35 = 35x35
    36 = 36x36
    39 = 39x39
    40 = 40x40
    42 = 42x42
    43 = 43x43
    44 = 44x44
    71 = 37x31
    99 = 100x100
    		 Column & Pad
    Code • Ø Column Diameter
    1 = Ø6 mil •   Ø0.15mm
    2 = Ø8 mil •   Ø0.20mm
    3 = Ø10 mil • Ø0.25mm
    4 = Ø12 mil • Ø0.30mm
    5 = Ø15 mil • Ø0.35mm
    6 = Ø16 mil • Ø0.40mm
    7 = Ø18 mil • Ø0.45mm
    8 = Ø20 mil • Ø0.50mm
    9 = Other
    0 = Other
    		 Version
    Code • Ø Rev
    0 = Rev A
    1 = Rev B
    2 = Rev C
     
     
     
     
    ECCN: EAR99 Export Administration Regulations (EAR)
    HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
    HS Code: 8311.30.3000 LEAD-TIN SOLDERS
    ITAR: Micro-coil springs and dummy daisy chain CCGA are not restricted.
     
     
     
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